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公开(公告)号：KR1019990012952A
公开(公告)日：1999-02-25
申请号：KR1019970036534
申请日：1997-07-31
Applicant: 전자부품연구원
IPC: H05K13/00
Abstract: 본 발명은 표면실장형 SAW 필터 패키지의 패키징에 이용되는 다이어태치용 치구에 있어서, 상기 다이 어태치용 치구는 표면에 일징 깊이 및 간격으로 상기 표면실장형SAW 필터 패키지를 끼울수 있도록 한쪽 끝이 막힌 형태로 형성된 홈을 갖는 몸체와, 상기 몸체를 지지하는 다리로 이루어져 있다. 또한, 본 발명은 표면실장형 SAW 필터 패키지의 패키징에 이용되는 와이어본딩용 치구에 있어서, 상기 와이어본딩용 치구는 표면에 일징 깊이 및 간격으로 상기 표면실장형 SAW 필터 패키지를 끼울수 있도록 한쪽 끝이 막힌 형태로 형성된 홈을 갖는 몸체와, 상기 홈 상에 상기 표면실장형 SAW 필터 패키지를 고정시킬 수 있는 자석으로 이루어져 있다.
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公开(公告)号：KR101517860B1
公开(公告)日：2015-05-15
申请号：KR1020130161567
申请日：2013-12-23
Applicant: 전자부품연구원
Abstract: 본발명은인쇄회로기판및 제조방법에관한것으로, 보다상세하게는소자를기판에내장시킴으로서신뢰성있는비아구조를가진인쇄회로기판및 그제조방법에관한것으로, 리플로우공정에의해금속비아층과리플로우엘레먼트층의반응에따라생성되는금속간화합물의취성파괴발생하는계면을소성변형을일으키는계면으로변경하여가공경화효과에따른파괴속도를낮출수 있고, 금속비아층의안정된계면형성에따라접속계면의전기적연결이유지됨에따라장기간열처리후에도안정적인전기적성능이유지되는효과가있다.
Abstract translation: 印刷电路板及其制造方法及其制造方法技术领域本发明涉及印刷电路板及其制造方法，更具体地说，涉及一种通过将器件嵌入基板而具有可靠的通孔结构的印刷电路板及其制造方法。 作为根据金属通孔层和元素层的反应而发生的金属间化合物的脆性断裂的表面变为引起塑性变形的表面，可以降低根据加工固化效果的断裂速度。 此外，通过形成金属通孔层的稳定表面来维持接触表面的电连接，使得在长期热处理之后可以保持稳定的电性能。
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公开(公告)号：KR101468641B1
公开(公告)日：2014-12-03
申请号：KR1020120096947
申请日：2012-09-03
Applicant: 전자부품연구원
Abstract: 본발명은반도체장치및 제조방법에관한것으로, 보다상세하게는관통비아가노출되도록씨앗층을증착한후 폴리머필름을채워넣는방식을이용한관통비아가형성된반도체장치및 그제조방법에관한것으로, 관통비아를정확하고정밀하게채울수 있고, 기판구성물질과증착씨앗층간의열팽창계수차이를완충할수 있도록하여열충격에대한신뢰성을향상시킨효과가있다.
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公开(公告)号：KR1020130139688A
公开(公告)日：2013-12-23
申请号：KR1020120063359
申请日：2012-06-13
Applicant: 전자부품연구원
Abstract: A variable capacitor includes a lower electrode formed on a substrate, a dielectric layer formed on the lower electrode layer, and an upper electrode formed on the dielectric layer. The lower electrode and the upper electrode are parallel to form a comb shape. The comb shape of the upper electrode intersects with the comb shape of the lower electrode.
Abstract translation: 可变电容器包括形成在基板上的下电极，形成在下电极层上的电介质层和形成在电介质层上的上电极。 下电极和上电极平行形成梳状。 上电极的梳形与下电极的梳形形状相交。
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Patent Agency Ranking
公开(公告)号：KR1020130127855A
公开(公告)日：2013-11-25
申请号：KR1020120051674
申请日：2012-05-15
Applicant: 전자부품연구원
CPC classification number: H01L2224/04105 , H01L2224/10 , H01L2224/16225 , H01L2224/19 , H01L2224/24137 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L2924/1531 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The present invention relates to a molding package and a manufacturing method thereof and particularly to the molding package capable of preventing the movement of a chip in molding and the manufacturing method thereof. The price of a package is reduced by manufacturing the molding package without a tuposuser. To obtain a small and thin package, a plating process and a via process for connecting a chip to a substrate instead of connecting the chip and the substrate after the molding in an existing chip embedded type molding package are omitted and A molding is carried out after the chip and the substrate is connected to a metal in advance. Therefore, bad contact due to the movement of the chip is reduced. [Reference numerals] (AA) Start;(BB) End;(S310) Step of producing a molding die;(S320) Step of producing a molding carrier;(S330) Step of separating the molding die form the molding carrier;(S340) Step of inserting a chip;(S350) Step of forming patterns
Abstract translation: 本发明涉及一种成型包装及其制造方法，特别涉及能够防止成型时的片材的移动的成型包装及其制造方法。 通过在没有tuposuser的情况下制造成型包装来减少包装的价格。 为了获得小而薄的封装，省略了在现有的芯片嵌入式模制包装中，在模制之后，将芯片连接到基板而不是将芯片和基板连接在一起的电镀工艺和通孔工艺，并且在 芯片和基板预先连接到金属。 因此，由于芯片的移动导致的不良接触减少。 （A3）起始;（BB）端部;（S310）成形模具的制造工序;（S320）制造成型载体的工序;（S330）将成型模具分离成模塑载体的工序;（S340 ）插入芯片的步骤;（S350）形成图案的步骤
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公开(公告)号：KR101192367B1
公开(公告)日：2012-10-17
申请号：KR1020110031700
申请日：2011-04-06
Applicant: 전자부품연구원
Abstract: 본 발명에서는 외부로부터 제공되는 DC 전원은 증폭기와 같은 능동 회로에 제공하고, 증폭하고자 하는 주파수 신호에서 DC 전원과 상기 능동 회로 간의 연결을 오픈(open)시키는 RF 초크에 관한 것으로서, 인덕터 소자의 설계를 배제한 기판에 인쇄된 형태의 RF 초크용 대역 저지 필터가 제안된다.
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公开(公告)号：KR1020120040591A
公开(公告)日：2012-04-27
申请号：KR1020100102093
申请日：2010-10-19
Applicant: 전자부품연구원
CPC classification number: H01L2224/24 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A semiconductor package and a manufacturing method thereof are provided to produce a 3D semiconductor package by laminating a semiconductor package by using a TOV(Through Organic Via) process. CONSTITUTION: A silicon substrate(100) has a plurality of holes. An insulating layer(104) is formed by filling a plurality of holes with an organic material. A passive device is formed on the organic material. The organic material is corresponded to one or more holes of the plurality of holes. A metal layer is formed by filling metal before the organic material is filled in the plurality of holes.
Abstract translation: 目的：提供半导体封装及其制造方法，以通过使用TOV（Through Organic Via）工艺层叠半导体封装来制造3D半导体封装。 构成：硅衬底（100）具有多个孔。 通过用有机材料填充多个孔来形成绝缘层（104）。 在有机材料上形成无源器件。 有机材料对应于多个孔中的一个或多个孔。 在有机材料填充在多个孔中之前，通过填充金属形成金属层。
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公开(公告)号：KR101138940B1
公开(公告)日：2012-04-25
申请号：KR1020100100375
申请日：2010-10-14
Applicant: 전자부품연구원
Abstract: PURPOSE: A power source circuit is provided to remove a chip capacitor and a chip inductor corresponding to existing chip components using a noise removing filter of printed pattern type. CONSTITUTION: A printed circuit board comprises a plurality of layers. A filter is printed on the printed circuit board. The filter comprises a first line pattern which transmits power to a power input terminal of the integrated circuit mounted in the printed circuit board. The filter comprises a second line pattern having a shunt stub function connected to the first line pattern through a via-hole. The second line pattern feeds back noise signals created by the operation of a circuit device within the integrated circuit through the power input terminal to a voltage supply source.
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公开(公告)号：KR1020110024356A
公开(公告)日：2011-03-09
申请号：KR1020090082318
申请日：2009-09-02
Applicant: 전자부품연구원
CPC classification number: H04B1/40 , H04B1/0057 , H04W88/06
Abstract: PURPOSE: An RF front-end module for a dual band wireless LAN is provided to constitute all parts of front end module into one combined part. CONSTITUTION: A lower part LTCC(Low Temperature Ceramic Co-fired) substrate(301) has a matching end, a low and high band pass filters for receiving low and high band receiving, and a low-band pass filter for transmitting low and high band at one side. A top LTCC substrate(303) is formed on the top part of the lower part LTCC substrate. The top LTCC substrate has a low pass filter for high band transmitting, a receiving diplexer, and a transmitting diplexer. A dual PAM(Power Amplifier Module) IC(207) and a switch IC(206) is respectively installed to the top LTCC substrate.
Abstract translation: 目的：提供用于双频无线局域网的射频前端模块，将前端模块的所有部分组成一个组合部分。 构成：下部LTCC（低温陶瓷共烧）衬底（301）具有匹配端，用于接收低频和高频带接收的低通和高带通滤波器，以及用于传输低和高频带的低带通滤波器 乐队在一边。 顶部LTCC基板（303）形成在下部LTCC基板的顶部上。 顶部LTCC衬底具有用于高频带发射的低通滤波器，接收双工器和发射双工器。 分别在顶部LTCC基板上安装双重PAM（功率放大器模块）IC 207和开关IC 206。
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