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公开(公告)号：US5055342A
公开(公告)日：1991-10-08
申请号：US484173
申请日：1990-02-16
Applicant: Voya Markovich , Ashit Mehta , Jae M. Park , Eugene Skarvinko , David W. Wang
Inventor： Voya Markovich , Ashit Mehta , Jae M. Park , Eugene Skarvinko , David W. Wang
IPC: B32B27/30 , C08K3/00 , C08K3/36 , C08K7/00 , C08K7/22 , C08L27/12 , C09D127/12 , H01B3/44 , H01L23/14 , H01L23/29 , H01L23/31 , H05K1/03 , H05K3/00
CPC classification number: H05K1/0373 , C08K3/36 , C08K7/22 , H01B3/445 , H05K1/034 , H05K2201/0209 , H05K2201/0254 , H05K3/0032 , Y10S428/901 , Y10S525/935 , Y10S525/936 , Y10T428/24322 , Y10T428/24917 , Y10T428/25 , Y10T428/3154 , Y10T428/31544
Abstract: Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.
Abstract translation: 显示低介电常数和含有氟化聚合物材料的低热膨胀系数和平均粒径不大于7微米的二氧化硅和/或石英填料的氟化聚合物组合物及其在其中形成具有通孔的基材的用途。 通过将组合物施加到基底上，然后将组合物加热到足以使组合物熔合的温度来获得上述组合物的层。
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公开(公告)号：US4997702A
公开(公告)日：1991-03-05
申请号：US475454
申请日：1990-02-06
Applicant: Samuel Gazit , Gary W. Adams
Inventor： Samuel Gazit , Gary W. Adams
CPC classification number: H05K1/0373 , B32B27/20 , H05K1/0366 , H05K1/0393 , H05K2201/015 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/0254 , H05K2201/0278 , H05K2201/0293 , H05K2201/057 , H05K2201/068 , Y10S428/901 , Y10T428/24917 , Y10T442/2713
Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.
Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。
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公开(公告)号：EP1881506A1
公开(公告)日：2008-01-23
申请号：EP06714232.3
申请日：2006-02-15
Applicant: NGK INSULATORS, LTD. , Soshin Electric Co. Ltd.
Inventor： OOBUCHI, Takeshi , IDE, Yoshinori
CPC classification number: H05K1/092 , H01B1/16 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/0209 , H05K2201/0254
Abstract: A conductive paste comprising silver powder as a major component and metal oxide powder of which primary particles have a hollow structure is used. The metal oxide is preferably silica. In an electronic part comprising a ceramic body and an internal electrode formed inside the ceramic body, preferably, the internal electrode is formed from the conductive paste. A surface layer electrode can be also formed from the conductive paste.
Abstract translation: 使用包含银粉作为主要成分的导电糊和其中一次粒子具有中空结构的金属氧化物粉末。 金属氧化物优选为二氧化硅。 在陶瓷体内部形成有陶瓷体和内部电极的电子部件中，优选地，内部电极由导电性糊料形成。 表面层电极也可以由导电膏形成。
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94.发明公开
公开(公告)号：EP1204697A1
公开(公告)日：2002-05-15
申请号：EP00950805.2
申请日：2000-07-28
Applicant: PPG Industries Ohio, Inc.
Inventor： NOVICH, Bruce, E. , LAMMON-HILINSKI, Kami , ROBERTSON, Walter, J. , WU, Xiang , VELPARI, Vedagiri , LAWTON, Ernest, L. , RICE, William, B.
CPC classification number: C03C25/10 , C03C25/00 , C03C25/47 , C03C25/48 , C08J5/08 , H05K1/0366 , H05K3/0047 , H05K2201/0166 , H05K2201/0175 , H05K2201/0209 , H05K2201/0212 , H05K2201/0239 , H05K2201/0245 , H05K2201/0254 , H05K2201/029 , H05K2203/127
Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.
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公开(公告)号：EP1060141A1
公开(公告)日：2000-12-20
申请号：EP99908438.7
申请日：1999-02-25
Applicant: PPG Industries Ohio, Inc.
Inventor： NOVICH, Bruce , ROBERTSON, Walter, J.
CPC classification number: H05K1/0366 , C03C25/26 , C03C25/42 , C03C25/47 , C08J5/08 , H05K3/0047 , H05K2201/0175 , H05K2201/0209 , H05K2201/0239 , H05K2201/0245 , H05K2201/0248 , H05K2201/0254 , H05K2203/127
Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.
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Patent Agency Ranking
公开(公告)号：EP1019246A1
公开(公告)日：2000-07-19
申请号：EP98949433.1
申请日：1998-09-23
Applicant: Fibermark, Inc.
Inventor： KEMPF, Ulrich
CPC classification number: D21H21/54 , B32B27/04 , C08J5/24 , D21H13/24 , D21H13/40 , D21H17/52 , D21H25/06 , H05K1/0366 , H05K1/0373 , H05K2201/0145 , H05K2201/0209 , H05K2201/0251 , H05K2201/0254 , H05K2201/0278 , H05K2201/0284 , H05K2201/0293 , Y10S428/901 , Y10T428/249994 , Y10T428/25 , Y10T428/27 , Y10T428/2933 , Y10T428/2962 , Y10T428/31663
Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.
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公开(公告)号：EP0440918A3
公开(公告)日：1992-02-26
申请号：EP90123488.0
申请日：1990-12-07
Applicant: International Business Machines Corporation
Inventor： Chellis, Leroy Newell , Japp, Robert Maynard , Summa, William Joseph , Rudik, William John , Wang, David Wei
CPC classification number: C08J5/24 , C08K7/24 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0239 , H05K2201/0254 , H05K2201/029 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/2982 , Y10T428/31663
Abstract: A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.
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98.发明公开Fluoropolymer insulating material containing hollow microspheres 失效Isolierstoff aus Fluorpolymeren，der Mikrohohlkugelnenthält。
公开(公告)号：EP0441159A2
公开(公告)日：1991-08-14
申请号：EP91100707.8
申请日：1991-01-21
Applicant: JUNKOSHA CO. LTD.
Inventor： Sato,Yoshiaki , Kaneda,Sakuko
CPC classification number: H05K1/0373 , C08J9/32 , H01B3/445 , H05K1/034 , H05K2201/015 , H05K2201/0209 , H05K2201/0254 , Y10T428/249971
Abstract: An insulating material formed from a network of hollow gas-filled microspheres embedded in a cured three-dimensional cross-linked polymer network of copolymerized unsaturated fluorinated monomers and acrylic monomers reacted in a fluorinated organic solvent.
Abstract translation: 由填充在共聚不饱和氟化单体的固化的三维交联聚合物网络中的中空气体填充微球网络形成的绝缘材料和在氟化有机溶剂中反应的丙烯酸类单体。
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99.发明公开
公开(公告)号：EP0304699A2
公开(公告)日：1989-03-01
申请号：EP88112746.8
申请日：1988-08-04
Applicant: JUNKOSHA CO. LTD.
Inventor： Satoh, Yoshiaki
CPC classification number: C08J9/32 , C08J2327/18 , H01B3/445 , H05K1/034 , H05K1/0373 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/0254
Abstract: A composite material of low dielectric constant, having minute hollow spheres of insulating material dispersed in a fibrous Polytetrafluoroethylene. The composite material has high mechanical strength.
Abstract translation: 低介电常数的复合材料，具有绝缘分散在纤维的聚四氟乙烯材料的微小中空球体。 该复合材料具有高的机械强度。
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公开(公告)号：JP2016534549A
公开(公告)日：2016-11-04
申请号：JP2016529796
申请日：2014-07-18
Applicant: ロジャーズ コーポレーション , ロジャーズ コーポレーション
Inventor： クロズリー、ジェシカ
IPC: H05K1/03 , C08K3/38 , C08L9/00 , C08L15/00 , C08L27/18 , C08L71/02 , C08L101/00 , H01B5/14 , H01B13/00 , H05K3/46
CPC classification number: H05K1/0373 , C03C11/00 , C03C14/00 , C03C23/008 , C03C2214/12 , H05K3/4626 , H05K3/4652 , H05K2201/0209 , H05K2201/0254 , Y10T428/24893 , Y10T428/249971 , Y10T428/249974
Abstract: 導電性金属層と、10GHzで誘電性定数が約3.5より小さく、散逸率が約0.006より小さい誘電性基板層からなる回路サブアセンブリが開示され、誘電性基板層の組成物は、アルカリ性溶液を用いて処理されたホウケイ酸塩微小球を約5から約70容量パーセント含む。
Abstract translation: 的导电金属层，为约0.006比电介质基板层，所述电介质基板层的用碱性溶液组合物小于在10GHz约3.5的介电常数越小，电路组件中公开耗散率 硼硅酸盐微球处理约5包含Te至约70％（体积）。
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