公开(公告)号：WO1993024939A1

公开(公告)日：1993-12-09

申请号：PCT/US1993005061

申请日：1993-05-27

Applicant: ADVANCED CIRCUIT TECHNOLOGY, INC.

Inventor： ADVANCED CIRCUIT TECHNOLOGY, INC. ,  MURPHY, Davis, W. ,  BONNETTE, Dennis, A. ,  STEARNS, Thomas, H.

IPC: H01B07/08

CPC classification number: H05K3/06 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4092 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0353 ,  H05K2203/0369 ,  H05K2203/0384 ,  Y10T29/49156 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T428/1291

Abstract: A laminate (50) comprising metal layers (56 and 58) separated by an etchant barrier (51) to control depth of etching of the laminate, the barrier being etchable by an etchant which is not an etchant for the layers. A cable (20) incorporating such a laminate and having relatively flexible conductors (22) integral with relatively rigid terminals. A method of making such a cable, using the laminate, by selectively etching the layers down to the barrier to form the conductors and terminals (26 and 28), stripping the barrier and laminating the conductors with an insulating material (42 and 44) preferably extending over at least a portion of the terminals to reinforce the conductor terminal transition and a cable when made of such a method.

公开(公告)号：US12089331B2

公开(公告)日：2024-09-10

申请号：US17314131

申请日：2021-05-07

Applicant: Aplus Semiconductor Technologies Co., Ltd.

Inventor： Cheng-Neng Chen ,  Sui-Ho Tsai ,  Yun-Nan Wang ,  Chiao-Hui Wang

IPC: H05K1/14 ,  C23C14/34 ,  C23C14/58 ,  C23C18/16 ,  C23C28/02 ,  C25D5/02 ,  C25D5/10 ,  G03F7/004 ,  G03F7/20 ,  H05K1/11

CPC classification number: H05K1/147 ,  C23C14/34 ,  C23C14/5873 ,  C23C18/1637 ,  C23C28/023 ,  C25D5/022 ,  C25D5/10 ,  G03F7/0041 ,  G03F7/2016 ,  H05K1/11 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0341

Abstract: A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

公开(公告)号：US11908768B2

公开(公告)日：2024-02-20

申请号：US17671635

申请日：2022-02-15

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Ryohei Yumoto ,  Tomoya Oohiraki ,  Takeshi Kitahara ,  Yoshiyuki Nagatomo

IPC: H05K1/09 ,  H05K1/18 ,  H05K3/22 ,  H01L21/52 ,  H01L23/12 ,  H01L23/367 ,  H01L23/473 ,  H01L23/373 ,  H01L21/48 ,  H05K3/00 ,  H05K3/02

CPC classification number: H01L23/3735 ,  H01L21/4857 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/022 ,  H05K3/0052 ,  H05K2201/0341 ,  H05K2201/0379 ,  H05K2203/068

Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

公开(公告)号：US20180368265A1

公开(公告)日：2018-12-20

申请号：US16121822

申请日：2018-09-05

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics(QinHuangDao) Co. , Ltd.

Inventor： LEI ZHOU ,  RUI-WU LIU ,  QIONG ZHOU

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/06 ,  H05K3/18 ,  H05K1/09

CPC classification number: H05K1/189 ,  H05K1/032 ,  H05K1/09 ,  H05K3/064 ,  H05K3/108 ,  H05K3/188 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2201/0769 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T29/49155

Abstract: A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.

公开(公告)号：US20180042119A1

公开(公告)日：2018-02-08

申请号：US15540828

申请日：2015-12-30

Applicant: AIRBUS GROUP, SAS ,  MALLARD

Inventor： Benoît DANTIN ,  Pascal LEMEILLE

IPC: H05K3/14 ,  C23C28/02 ,  C23C4/02 ,  H05K3/10 ,  C23C4/129 ,  C23C4/18 ,  H05K3/46 ,  C23C24/04 ,  C23C4/08

CPC classification number: H05K3/14 ,  C23C4/02 ,  C23C4/08 ,  C23C4/129 ,  C23C4/18 ,  C23C24/04 ,  C23C28/021 ,  H05K1/056 ,  H05K1/165 ,  H05K3/102 ,  H05K3/225 ,  H05K3/4685 ,  H05K2201/0341 ,  H05K2203/1344 ,  H05K2203/173

Abstract: A structure including at least one electrical line on one surface of the structure, one electrically conductive layer of the line resulting from deposition of an electrically conductive material via a cold spraying method, and the line includes a protective bonding layer on which the electrically conductive material is deposited via the cold spraying method, the protective bonding layer forming a continuous protective shield between the structure and the cold-sprayed material. An insulating layer is advantageously located between the structure and the protective bonding layer. Achieving an electrical line on a surface of the structure involves implementing a step of oxy-fuel flame spraying of a protective material to form a protective bonding layer, followed by a step of cold spraying of the electrically conductive material of the electrically conductive layer onto the protective bonding layer.

公开(公告)号：US09869027B2

公开(公告)日：2018-01-16

申请号：US15134672

申请日：2016-04-21

Applicant: Samsung Display Co., Ltd. ,  LTCAM CO., LTD.

Inventor： Bong-Yeon Kim ,  Jin-Ho Ju ,  Jun-Hyuk Woo ,  Jung-Hwan Song ,  Seok-Ho Lee ,  Seong-Sik Jeon ,  Jong-Su Han

IPC: C09K13/04 ,  C23F1/16 ,  C11D11/00 ,  H01L21/02 ,  H05K3/26 ,  C11D7/32 ,  C11D7/26 ,  C11D7/08 ,  C11D7/06 ,  C23F11/04 ,  H05K3/06 ,  H05K1/03 ,  H05K3/38

CPC classification number: C23F1/16 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D11/0047 ,  C23F11/04 ,  H01L21/02068 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2203/124 ,  H05K2203/125

Abstract: A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

公开(公告)号：US20170271303A1

公开(公告)日：2017-09-21

申请号：US15593186

申请日：2017-05-11

Applicant: Skyworks Solutions, Inc.

Inventor： Sandra Louise Petty-Weeks ,  Guohao Zhang ,  Hardik Bhupendra Modi

IPC: H01L23/00 ,  H01L23/66 ,  H05K1/02 ,  H05K3/24

CPC classification number: H01L24/85 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K3/244 ,  H05K2201/0341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure relates to a diffusion barrier layer for a radio frequency (RF) transmission line. The diffusion barrier layer includes a material and has a thickness. The thickness of the diffusion barrier layer is sufficiently small such that an RF signal is allowed to penetrate the diffusion barrier layer. Related RF modules and mobile devices that include an RF transmission line with such a diffusion barrier layer are disclosed.

公开(公告)号：US20160374206A1

公开(公告)日：2016-12-22

申请号：US14742070

申请日：2015-06-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jaen-Don Lan ,  PIN-CHUNG LIN ,  CHEN-RUI TSENG ,  CHENG-EN HO ,  YU-AN CHEN

IPC: H05K3/00 ,  B23K26/402 ,  H05K3/16 ,  B23K26/386

CPC classification number: B23K26/402 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0341

Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

Abstract translation: 公开了一种制造电路板的方法，包括制备具有树脂层和停止层的基板，形成穿过树脂层的至少一个导电孔并在停止层处停止，通过溅射工艺形成第一金属层， 通过化学镀工艺在第一金属层上形成第二金属层，形成具有电路图案的第三金属层，暴露第二金属层的一部分并通过电镀工艺填充导电孔，并蚀刻第二金属层 以及第二金属层下面的第一金属层，以暴露第一金属层下的树脂层。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定和稳定的。 蚀刻电路图案对于细线宽/间距具有小于10μm的线宽/间距。

公开(公告)号：US09340759B2

公开(公告)日：2016-05-17

申请号：US14264193

申请日：2014-04-29

Applicant: Samsung Display Co., Ltd. ,  Cowon Innotech Inc.

Inventor： Bong-Yeon Kim ,  Jin-Ho Ju ,  Jun-Hyuk Woo ,  Jung-Hwan Song ,  Seok-Ho Lee ,  Seong-Sik Jeon ,  Jong-Su Han

IPC: C09K13/04 ,  C11D11/00 ,  H01L21/02 ,  H05K3/26 ,  C11D7/32 ,  C11D7/26 ,  C11D7/08 ,  C11D7/06 ,  H05K3/06 ,  H05K1/03 ,  H05K3/38

CPC classification number: C23F1/16 ,  C11D7/06 ,  C11D7/08 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D11/0047 ,  C23F11/04 ,  H01L21/02068 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0341 ,  H05K2203/124 ,  H05K2203/125

Abstract: A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

Abstract translation: 清洁组合物包含约0.01至约5重量％的螯合剂; 约0.01至约0.5重量％的有机酸; 约0.01至约1.0重量％的无机酸; 约0.01至约5重量％的碱金属化合物; 和去离子水。

公开(公告)号：US09320142B2

公开(公告)日：2016-04-19

申请号：US14598595

申请日：2015-01-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Min Baek ,  Yoon Su Kim ,  Jin Hyuck Yang ,  Chang Bae Lee

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/18

CPC classification number: H05K1/111 ,  H05K3/108 ,  H05K3/188 ,  H05K3/388 ,  H05K3/4007 ,  H05K2201/0341 ,  H05K2201/09381 ,  H05K2203/0713 ,  H05K2203/0716 ,  H05K2203/0723 ,  H05K2203/1407 ,  Y10T428/12396

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract translation: 本发明涉及电极结构，其包括：基底; 种子层，设置在所述基底基板的一个或两个表面上; 设置在种子层上的电镀层; 并且在种子层和电镀层之间不连续地提供阻挡层。