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    Method of forming resistors
    95.
    发明授权
    Method of forming resistors 失效
    形成电阻的方法

    公开(公告)号：US5945257A

    公开(公告)日：1999-08-31

    申请号：US960275

    申请日：1997-10-29

    Applicant: Wallace Dean Doeling

    Inventor： Wallace Dean Doeling

    IPC: H01C17/24 ,  H05K1/16 ,  H05K3/18 ,  G03F7/00

    CPC classification number: H05K1/167 ,  H01C17/2416 ,  H05K2201/0344 ,  H05K2203/073 ,  H05K3/181

    Abstract: A method is disclosed for forming resistors that are low cost, easy to manufacture and substantially within 5 percent of their desired value. In one aspect of the method, an electrically resistive material, such as nickel, is deposited directly on an insulating layer, such as a substrate. A conductive material, such as copper, is then deposited on the resistive material. Using photo-imaging, signal traces are formed in the conductive and resistive materials. A resistor is created by forming a gap in the conductive material at a location where the resistor is desired. Current is thereby forced to flow through the resistive material at the location of the gap.

    Abstract translation: 公开了一种用于形成低成本，易于制造并且基本上在其所需值的5％内的电阻器的方法。 在该方法的一个方面，诸如镍的电阻材料直接沉积在诸如基底的绝缘层上。 然后将诸如铜的导电材料沉积在电阻材料上。 使用光成像技术，在导电和电阻材料中形成信号迹线。 通过在需要电阻器的位置处在导电材料中形成间隙来产生电阻器。 因此，电流在间隙的位置被迫流过电阻材料。

    Method of manufacturing copper-polyimide substrate
    97.
    发明授权
    Method of manufacturing copper-polyimide substrate 失效
    铜 - 聚酰亚胺基板的制造方法

    公开(公告)号：US5246564A

    公开(公告)日：1993-09-21

    申请号：US963739

    申请日：1992-10-20

    Applicant: Yukihiro Tamiya ,  Noriyuki Saeki ,  Akihiro Miyake ,  Yoshiyasu Takenaka

    Inventor： Yukihiro Tamiya ,  Noriyuki Saeki ,  Akihiro Miyake ,  Yoshiyasu Takenaka

    IPC: C23C18/16 ,  C23C18/22 ,  H05K1/00 ,  H05K3/38

    CPC classification number: H05K3/381 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/2086 ,  C23C18/22 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/1105

    Abstract: A method of manufacturing a copper-polyimide substrate, includes hydrophilicating the surface(s) of a polyimide film, applying a catalyst thereto, subjecting the film to electroless plating, heat-treating it in an inert atmosphere, and subjecting it to electroless copper plating or to electroless copper plating followed by electrolytic copper plating. The hydrophilication of the surface(s) of the polyimide film is effected with an aqueous solution containing a hydrazine hydrate and an alkali metal hydroxide or with an aqueous solution containing a permanganate and/or a hypochlorite, then a catalyst is applied to the surface(s) by an ordinary way, then the surface(s) is/are subjected to electroless plating with any one of nickel, cobalt nickel alloys or cobalt alloys to form a plated layer thereon having a thickness of from 0.01 to 0.1 .mu.m and having an impurity content of 10% by weight or less, and thereafter the resulting substrate is heat-treated in an inert atmosphere under the condition that the highest temperature that the substrate reaches falls within the range of from 350.degree. to 540.degree. C. and that the thermal load coefficient( D) to be obtained by the following numerical expression (1) falls within the range of from 0.3 to 3.5. ##EQU1## where ti indicates a desired time; and Ti indicates the temperature of the substrate itself at that time.

    Abstract translation: 一种制造铜 - 聚酰亚胺基板的方法包括使聚酰亚胺膜的表面亲水化，向其中加入催化剂，对膜进行化学镀，在惰性气氛中进行热处理，并对其进行化学镀铜 或化学镀铜，然后进行电解镀铜。 聚酰亚胺膜的表面的亲水化是用含有水合肼和碱金属氢氧化物的水溶液或含有高锰酸盐和/或次氯酸盐的水溶液进行的，然后将催化剂施加到表面 s），然后用镍，钴镍合金或钴合金中的任何一种对表面进行化学镀以在其上形成厚度为0.01至0.1μm的镀层，并且具有 杂质含量为10重量％以下，然后将所得到的基材在惰性气氛中，在基板达到的最高温度落在350〜540℃的范围内进行热处理， 由下式（1）得到的热负荷系数（D）在0.3〜3.5的范围内。 （1）其中ti表示期望的时间; Ti表示此时的基板本身的温度。

    Thermally stable dual metal coated laminate products made from polyimide film
    98.
    发明授权
    Thermally stable dual metal coated laminate products made from polyimide film 失效
    由聚酰亚胺膜制成的耐热稳定双金属涂层叠层产品

    公开(公告)号：US4950553A

    公开(公告)日：1990-08-21

    申请号：US300044

    申请日：1989-01-23

    Applicant: Daniel P. Walsh ,  Philip D. Knudsen

    Inventor： Daniel P. Walsh ,  Philip D. Knudsen

    IPC: C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC classification number: H05K3/38 ,  C23C18/22 ,  C25D5/56 ,  H05K3/181 ,  H05K3/381 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12944

    Abstract: Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.

    Abstract translation: 聚酰亚胺片的表面涂覆有一层无电镀镍或钴，它还可以在Ni上包含一层薄的无电镀铜层。 或Co.这种顽固粘合的涂层随后以这样的方式进行处理，以增加其渗透性或孔隙率，而基本上不改变其电阻性质。 诱导的孔隙率允许除去电介质聚酰亚胺片中捕获的水和其它挥发物，同时金属层的保持的电连续性足以支持电解铜电镀，其提供用于随后生产电子的铜厚度的双重目的 电路并且通过永久地密封或涂覆所述多孔金属层来防止水再次吸收到介质芯中。

    Thermally stable dual metal coated laminate products made from textured polyimide film
    99.
    发明授权
    Thermally stable dual metal coated laminate products made from textured polyimide film 失效
    耐热稳定的双金属涂层层压制品由纹理聚酰亚胺薄膜制成

    公开(公告)号：US4868071A

    公开(公告)日：1989-09-19

    申请号：US155897

    申请日：1988-02-16

    Applicant: Daniel P. Walsh ,  Philip D. Knudsen

    Inventor： Daniel P. Walsh ,  Philip D. Knudsen

    IPC: C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC classification number: H05K3/181 ,  C23C18/22 ,  C25D5/56 ,  H05K3/38 ,  H05K3/381 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12944

    Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

    Abstract translation: 均匀且完全织构化的聚酰亚胺片的两个表面涂覆有一层无电镍或钴，以及随后的电解铜层，产生用于生产电子电路的无粘合层压板。 铜和镍或钴层牢固地结合到织构化的聚酰亚胺片材上，以达到层压板超过粘结强度要求的程度，如通过目前的初始和后期互连与封装电子电路研究所（IPC）的标准剥离强度试验测量的。 焊料浮渣粘附，以及IPC测试2.4.9方法E对耐热循环的修改。

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