公开(公告)号：US4085433A

公开(公告)日：1978-04-18

申请号：US744136

申请日：1976-11-22

Applicant: Conrad J. Baranowski

Inventor： Conrad J. Baranowski

IPC: H05K1/18 ,  H05K1/04

CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/09445 ,  H05K2201/10303 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed.

Abstract translation: 一种用于提高分立电子部件的封装密度的方法。 组件在相对于板的正常定向的预定位置安装到柔性印刷电路板。 然后以这样一种方式折叠该板，使得这些部件的主体相互交错并与其他电路部件和端子交错。 还公开了具有这种交错部件的封装。

公开(公告)号：US3755717A

公开(公告)日：1973-08-28

申请号：US3755717D

申请日：1972-05-12

Applicant: LUCAS INDUSTRIES LTD

Inventor： SHAW J

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K1/04

CPC classification number: H05K1/189 ,  H05K1/05 ,  H05K3/0058 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/2009

Abstract: A flexible electric wiring arrangement has an insulating sheet carrying a conductor pattern. The sheet is slotted and folded so as to be cruciform in plan and so that one side of the sheet defines eight outwardly directed surfaces to which components can be attached.

Abstract translation: 柔性电布线布置具有承载导体图案的绝缘片。 片材被开槽和折叠成十字形的平面图，并且片材的一侧限定八个向外指向的表面，部件可以附接到该表面。

公开(公告)号：US3505570A

公开(公告)日：1970-04-07

申请号：US3505570D

申请日：1968-03-08

Applicant: EDGAR O SPRUDE ,  WILBUR E HESS

Inventor： SPRUDE EDGAR O ,  HESS WILBUR E

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H02B1/04 ,  H02B9/00

CPC classification number: H05K1/189 ,  H05K1/145 ,  H05K3/0058 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/09709 ,  H05K2201/10446 ,  H05K2201/10651 ,  H05K2201/2009

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

公开(公告)号：US09923107B2

公开(公告)日：2018-03-20

申请号：US14795653

申请日：2015-07-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami

IPC: H01L31/042 ,  H01L31/0392 ,  H02S40/34 ,  H05K3/30 ,  H01L31/05 ,  H02S40/22 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/34 ,  H02S40/42 ,  H05K1/0204 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/142 ,  H05K1/144 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/046 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/10121 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

公开(公告)号：US09780465B1

公开(公告)日：2017-10-03

申请号：US15270816

申请日：2016-09-20

Applicant: Jeffrey David Hartman

Inventor： Jeffrey David Hartman

IPC: H01R12/00 ,  H01R12/52 ,  H01R13/24 ,  H01R43/02 ,  H01R43/26 ,  H01R107/00

CPC classification number: H01R12/722 ,  H01R12/737 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4617 ,  H05K3/4682 ,  H05K2201/046 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: An angled circuit board connector includes a unitary connector block having first and second board-contacting faces. The first and second board-contacting faces are arranged relative to each other at an operative angle. The connector block includes a block body. The first and second board-contacting faces face outward from the block body. A first connector port is located on the first board-contacting face. A second connector port is located on the second board-contacting face. A connector trace extends through at least a portion of the block body between the first and second board-contacting faces. The connector trace electrically connects the first and second connector ports.

公开(公告)号：US09746879B2

公开(公告)日：2017-08-29

申请号：US14544875

申请日：2015-02-27

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  G06F1/16 ,  G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H01R12/62 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/62 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

公开(公告)号：US20170201208A1

公开(公告)日：2017-07-13

申请号：US15324984

申请日：2015-07-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami ,  Takeshi Yamana

IPC: H02S40/22 ,  H02S40/34 ,  H01L31/02 ,  H02S30/10 ,  H02S20/32

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/42 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09263 ,  H05K2201/10121 ,  Y02E10/52

Abstract: A wiring substrate is configured to have a power generating portion mounted thereto. The wiring substrate includes a land portion and a wire portion. The width of the wire portion is smaller than the width of the land portion.

公开(公告)号：US20170200836A1

公开(公告)日：2017-07-13

申请号：US15325034

申请日：2015-07-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami ,  Takeshi Yamana

IPC: H01L31/02 ,  H02S40/22 ,  H02S30/10 ,  H02S40/34

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/42 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09263 ,  H05K2201/10121 ,  Y02E10/52

Abstract: This wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate includes: a land portion configured to have a power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.

公开(公告)号：US09706646B2

公开(公告)日：2017-07-11

申请号：US14761209

申请日：2014-01-15

Applicant: Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

Inventor： Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/42 ,  H01M6/40 ,  H01M6/42 ,  H01G11/78

CPC classification number: H05K1/028 ,  H01G11/78 ,  H01M2/204 ,  H01M6/40 ,  H01M6/42 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/425 ,  H05K1/0272 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2203/085 ,  H05K2203/087 ,  H05K2203/09 ,  H05K2203/1184 ,  H05K2203/302

Abstract: An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems having an adjustable size and/or shape. An operational device can be coupled to a planar substrate shaped and sized to correspond to a desired origami shape of an origami pattern. A plurality of planar substrates can be coupled together by a plurality of connection members that corresponds to one or more crease of the origami pattern. An array of planar substrates can be formed that convert into a three dimensional structure with origami shape. The resulting three-dimensional structure provides smaller projection area, higher portability and deformability.