公开(公告)号：US08053953B2

公开(公告)日：2011-11-08

申请号：US12514278

申请日：2007-11-08

Applicant: Hiroaki Yamada

Inventor： Hiroaki Yamada

IPC: H01L41/053

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αk of the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.

Abstract translation: 通过焊接表面安装在布线板上的电子部件，其中抑制了表面安装后的焊料中出现裂缝的电子部件可以包括：构成容器的至少一部分并由陶瓷制成的部件; 以及设置在构件的外表面上并用于通过焊料将电子部件表面安装在布线板上的外部端子。 构成外部端子的层的膜厚被设计成当构成构件的陶瓷的热膨胀系数为α1时，构件和外部端子的组合膨胀系数αk满足1.029＆lt; 1lE;αk/α1＆nlE的关系; 1.216。 外部端子优选地包括作为电极体的镍层。

公开(公告)号：US07737796B2

公开(公告)日：2010-06-15

申请号：US12009406

申请日：2008-01-18

Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

IPC: H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 公开了一种用于高稳定性的恒温型引线引出型晶体振荡器，其包括向多个引线从其引出的晶体谐振器供热，以保持温度恒定的供热体。 供热体包括：导热板，其具有用于引线的通孔并且安装在电路板上，并且面向并直接热连接到晶体谐振器和用于加热的片状电阻器 电路板与导热板相邻，并且热连接到导热板。

公开(公告)号：US20100060108A1

公开(公告)日：2010-03-11

申请号：US12514278

申请日：2007-11-08

Applicant: Hiroaki Yamada

Inventor： Hiroaki Yamada

IPC: H01L41/053

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αk of the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.

Abstract translation: 通过焊接表面安装在布线板上的电子部件，其中抑制了表面安装后的焊料的裂纹的发生，可以包括：构成容器的至少一部分并由陶瓷制成的部件; 以及设置在构件的外表面上并用于通过焊料将电子部件表面安装在布线板上的外部端子。 构成外部端子的层的膜厚被设计成当构成构件的陶瓷的热膨胀系数为α1时，构件和外部端子的组合膨胀系数αk满足1.029＆lt; 1lE;αk/α1＆nlE的关系; 1.216。 外部端子优选地包括作为电极体的镍层。

公开(公告)号：US20090236134A1

公开(公告)日：2009-09-24

申请号：US12381692

申请日：2009-03-16

Applicant: Thomas A. Knecht ,  Glen Reeser

Inventor： Thomas A. Knecht ,  Glen Reeser

IPC: H05K1/16

CPC classification number: H05K1/0243 ,  H01P7/082 ,  H01P7/084 ,  H05K3/3436 ,  H05K2201/10068

Abstract: A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.

Abstract translation: 一种球栅阵列谐振器，用作例如压控振荡器的电路中的高“Q”电感元件。 谐振器包括陶瓷衬底，其包括相对的顶表面和底表面，每个陶瓷衬底具有在其上形成的导电材料的连续条带，并且在一个实施例中，至少两个导电通孔延伸穿过衬底并电连接导电材料的各条带以限定 用于RF信号的连续且细长的路径或传输线。 相应的导电材料条可以是螺旋形的，钩形的，蛇形的，或者根据所需的应用适当地成形。 底表面上的导电球/球体限定RF信号输入/输出焊盘和适于与例如压控振荡器的印刷电路板或基板电连接的接地焊盘。

公开(公告)号：US20080100402A1

公开(公告)日：2008-05-01

申请号：US11977276

申请日：2007-10-24

Applicant: Alexandre Rogozine

Inventor： Alexandre Rogozine

IPC: H01P1/205

CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

Abstract: A resonator/filter adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material including at least one resonator through-hole extending therethrough and respective top, bottom and side surfaces defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments electrically interconnect the first and second conductive regions.

Abstract translation: 适用于直接表面安装到印刷电路板表面的谐振器/滤波器。 谐振器/滤波器包括介电材料块，其包括延伸穿过其中的至少一个谐振器通孔以及限定用导电材料覆盖的介电材料的相应区域的相应顶部，底部和侧面。 顶部块表面限定至少第一导电区域。 块的底表面上的第二导电区域限定了输入/输出触点，其允许滤波器安装在板上，底部滤波器表面位于其上，从而在板和谐振器通孔之间提供直接接地 用于改善衰减性能，特别是在较高频率下。 多个传输线实施例将第一和第二导电区域电互连。

公开(公告)号：US07023291B2

公开(公告)日：2006-04-04

申请号：US10946890

申请日：2004-09-22

Applicant: Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B5/32

CPC classification number: H05K1/0201 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10606

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.

Abstract translation: 提供具有增加的热效率的高度稳定的晶体振荡器。 高度稳定的晶体振荡器包括： 恒温器主机，其保持包括用于密封晶体片的谐振器容器的晶体谐振器的温度，与所述晶体谐振器一起构成振荡电路的振荡元件，控制所述恒温器主机内部的温度的温度控制元件， 以及安装有所述恒温器主机，所述振荡元件和所述温度控制元件的电路板。 该结构使得在所述振荡元件和所述温度控制元件之中具有较高温度依赖性的发热芯片电阻器和高热敏元件被布置在所述电路板的一个主平面上，并且所述发热芯片电阻器， 所述高热敏元件，并且所述恒温器主机通过热导材料直接热粘合。

公开(公告)号：US06683790B1

公开(公告)日：2004-01-27

申请号：US09606963

申请日：2000-06-29

Applicant: Hajime Suemasa ,  Takashi Maruyama

Inventor： Hajime Suemasa ,  Takashi Maruyama

IPC: H05K702

CPC classification number: H05K3/3442 ,  H01P1/2053 ,  H01P1/2136 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09736 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2203/0353 ,  Y02P70/613

Abstract: An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board; a terminal electrode disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; a soldering-resistant film disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; wherein the distance between the major surface of the terminal electrode and the second major surface of the printed circuit board is substantially equal to or larger than the distance between the major surface of the soldering-resistant film in the vicinity of the terminal electrode and the second major surface of the printed circuit board.

Abstract translation: 一种电子部件，包括：印刷电路板，包括第一主表面和第二主表面; 设置在印刷电路板的第一主表面上的电路元件; 端子电极，设置在印刷电路板的第二主表面上并且包括与印刷电路板的第二主表面相对的主表面; 设置在印刷电路板的第二主表面上并包括与印刷电路板的第二主表面相对的主表面的耐焊膜; 其中端子电极的主表面和印刷电路板的第二主表面之间的距离基本上等于或大于端接电极附近的耐焊膜的主表面与第二 印刷电路板的主表面。

公开(公告)号：US06570262B1

公开(公告)日：2003-05-27

申请号：US09525077

申请日：2000-03-14

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01L23544

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US5517162A

公开(公告)日：1996-05-14

申请号：US136582

申请日：1993-10-13

Applicant: Hisashi Ariyoshi

Inventor： Hisashi Ariyoshi

IPC: H01P1/205 ,  H01P11/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01P7/04

CPC classification number: H01P1/2056 ,  H05K1/0243 ,  H05K3/3436 ,  H05K3/3442 ,  H01L2224/10175 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K3/3431 ,  H05K3/3452 ,  Y02P70/613

Abstract: A dielectric resonator device includes a dielectric member, inner conductors provided in the dielectric member, an outer conductor formed on an outer surface of the dielectric member, signal input and output electrodes formed on the outer surface of the dielectric member opposing a mounting substrate and coupled with the inner conductors, and solder bumps formed on the outer conductor on its surface opposing the mounting substrate and on the signal input and output electrodes. By heating the dielectric resonator device opposing the mounting substrate, electrical and mechanical connections may be made therebetween through the solder bumps, while preventing the formation of solder bridges.

Abstract translation: 介质谐振器装置包括电介质构件，设置在电介质构件中的内导体，形成在电介质构件的外表面上的外导体，形成在与安装基板相对的电介质构件的外表面上的信号输入和输出电极， 其内部导体和形成在其表面上的外部导体上的焊料凸块相对于安装基板和信号输入和输出电极。 通过加热与安装基板相对的介质谐振器装置，可以通过焊料凸块在其间形成电气和机械连接，同时防止形成焊接桥。

公开(公告)号：WO2012027929A1

公开(公告)日：2012-03-08

申请号：PCT/CN2010/078788

申请日：2010-11-16

Applicant: 中兴通讯股份有限公司 ,  吕飞 ,  葛虎 ,  宋捷

Inventor： 吕飞 ,  葛虎 ,  宋捷

IPC: H01L23/31 ,  H01L23/48 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124