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    CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF
    91.
    发明公开
    CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF 审中-公开
    CRYSTAL设备，而用于生产的封装和工艺

    公开(公告)号：EP2525399A4

    公开(公告)日：2016-11-23

    申请号：EP10856616

    申请日：2010-11-16

    Applicant: ZTE CORP

    Inventor： LV FEI ,  GE HU ,  SONG JIE

    IPC: H01L23/31 ,  H01L23/48 ,  H03H9/05 ,  H05K3/34

    CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

    Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

    A SHOCK DAMPING AND THERMAL ISOLATION SYSTEM FOR A SURFACE MOUNTED VIBRATION SENSITIVE DEVICE
    92.
    发明公开
    A SHOCK DAMPING AND THERMAL ISOLATION SYSTEM FOR A SURFACE MOUNTED VIBRATION SENSITIVE DEVICE 审中-公开
    吸震及保温系统表面安装振动非常敏感器件

    公开(公告)号：EP2499889A1

    公开(公告)日：2012-09-19

    申请号：EP10829400.0

    申请日：2010-11-12

    Applicant: Novatel, Inc.

    Inventor： BECZE, Karoly ,  LANNEVILLE, Pee-Jay

    IPC: H05K7/12 ,  F16F1/371 ,  H05K1/18 ,  H05K13/04

    CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10075 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  Y10T29/4913

    Abstract: The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.

    WIRING BOARD AND WIRING BOARD MODULE
    93.
    发明公开
    WIRING BOARD AND WIRING BOARD MODULE 有权
    电路板和电路板模块

    公开(公告)号：EP1793658A4

    公开(公告)日：2007-10-10

    申请号：EP04799462

    申请日：2004-11-02

    Applicant: MURATA MANUFACTURING CO

    Inventor： FUJIKAWA KATSUHIKO ,  TANAKA KOJI

    IPC: H05K3/34

    CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/611

    Abstract: A wiring board module (10) is provided with a multilayer wiring board (11), and on a mounting surface (11a) of the multilayer wiring board (11), a crystal oscillator (1), an IC component (2) and the like are mounted. On the mounting surface (11a), a mounting land (12) for the IC component (2), a mounting land (13) for the crystal oscillator (1) and a mounting land (14) for other surface mounting component are formed. Particularly, the mounting land (13) for the crystal oscillator (1) is not like the conventional land solely having a large area. Adjacent four land pieces (13a) are electrically connected through one external terminal (1a) of the crystal oscillator (1) to function as a mounting land for the external terminal (1a). In other words, a plurality of the mounting lands (13) provided at positions corresponding to each of the outer terminal (1a) of the crystal oscillator (1) are divided into four land pieces (13a).

    Electronic circuit unit having small size and good productivity
    94.
    发明公开
    Electronic circuit unit having small size and good productivity 审中-公开
    Elektronische Schaltungseinheit，die eine kleineGröe und eine guteProduktivitäthat

    公开(公告)号：EP1513384A2

    公开(公告)日：2005-03-09

    申请号：EP04020884.5

    申请日：2004-09-02

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Furuta, Toshiro ,  Endo, Masaaki ,  Saitoh, Wataru ,  Yamano, Tadaomi

    IPC: H05K5/00 ,  H05K9/00

    CPC classification number: H05K9/002 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/10075 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018

    Abstract: The present invention provides an electronic circuit unit that is suitable for miniaturization and has a good manufacturing productivity. An electronic circuit unit of the present invention comprises a circuit board 3 mounted within a frame member 1, an electronic component 5 with a cover mounted on the circuit board 3, and a plurality of linear terminals 9 passing through and being mounted in the circuit board 3. The terminals 9 comprise at least first and second terminal groups 7a and 7b arranged at an interval between the respective terminals in a line. The first and the second terminal groups 7a and 7b are arranged in a line in the vicinity of one side of the circuit board 3. An opening portion 10 is provided between the first and second terminal groups 7a and 7b, and the electronic component 5 with the cover is mounted on the circuit board 3 while being disposed in the opening portion 10. As a result, a space factor for the arrangement of the electronic component 5 with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board 3, thereby obtaining a small-sized electronic circuit unit.

    Abstract translation: 本发明提供一种适于小型化并具有良好制造生产率的电子电路单元。 本发明的电子电路单元包括安装在框架构件1内的电路板3，安装在电路板3上的盖子的电子部件5和通过并安装在电路板中的多个线性端子9 端子9包括至少第一和第二端子组7a和7b，它们以一行的相应端子间隔布置。 第一和第二端子组7a和7b在电路板3的一侧附近排列成一列。开口部分10设置在第一和第二端子组7a和7b之间，电子部件5具有 盖子安装在电路板3的同时设置在开口部分10中。结果，电子部件5与盖子的布置的空间因子非常好，因此可以减小宽度方向尺寸 ，从而获得小型电子电路单元。

    BASE OF SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE, AND SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE
    98.
    发明公开
    BASE OF SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE, AND SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE 有权
    基础表面贴装封装采用电子元器件和表面贴装封装采用电子元器件

    公开(公告)号：EP2555426A1

    公开(公告)日：2013-02-06

    申请号：EP11765420.2

    申请日：2011-03-24

    Applicant: Daishinku Corporation

    Inventor： IIZUKA, Minoru ,  KOJO, Yuka

    IPC: H03H9/02 ,  H01L23/04 ,  H01L23/12 ,  H03H9/10

    CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

    Abstract translation: 的表面安装电子部件封装的基部保持的电子部件元件上，并且将被安装在电路基板上用导电性接合材料。 所述基座具有主面和在外部连接端子被连接到所述电路板电。 外部连接端子在所述主面形成。 所述基座包括形成于外部连接端子上形成凸块。 凸块是比外部连接端子小。 所述基座具有在所述外部连接端子的外周端缘之间沿上在外部连接端子上的应力衰减的方向上的凸块的外周端缘的距离为d。 应力在电路基板上的基的安装关联生成。 的距离d是晚上12点多毫米且等于或小于0.45毫米。

    CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF
    99.
    发明公开
    CRYSTAL DEVICE WITHOUT PACKAGING AND MANUFACTURING METHOD THEREOF 审中-公开
    KRISTALLVORRICHTUNG OHNE KAPSELUNG UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2525399A1

    公开(公告)日：2012-11-21

    申请号：EP10856616.7

    申请日：2010-11-16

    Applicant: ZTE Corporation

    Inventor： LV, Fei ,  GE, Hu ,  SONG, Jie

    IPC: H01L23/31 ,  H01L23/48 ,  H05K3/34

    CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

    Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

    Abstract translation: 本公开公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝着PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

    Electronic circuit unit having small size and good productivity
    100.
    发明公开
    Electronic circuit unit having small size and good productivity 审中-公开
    具有电子电路单元，其包括一个小型电动大和良好的生产率

    公开(公告)号：EP1513384A3

    公开(公告)日：2008-12-31

    申请号：EP04020884.5

    申请日：2004-09-02

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Furuta, Toshiro ,  Endo, Masaaki ,  Saitoh, Wataru ,  Yamano, Tadaomi

    IPC: H05K5/00 ,  H05K9/00

    CPC classification number: H05K9/002 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/10075 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018

    Abstract: The present invention provides an electronic circuit unit that is suitable for miniaturization and has a good manufacturing productivity. An electronic circuit unit of the present invention comprises a circuit board 3 mounted within a frame member 1, an electronic component 5 with a cover mounted on the circuit board 3, and a plurality of linear terminals 9 passing through and being mounted in the circuit board 3. The terminals 9 comprise at least first and second terminal groups 7a and 7b arranged at an interval between the respective terminals in a line. The first and the second terminal groups 7a and 7b are arranged in a line in the vicinity of one side of the circuit board 3. An opening portion 10 is provided between the first and second terminal groups 7a and 7b, and the electronic component 5 with the cover is mounted on the circuit board 3 while being disposed in the opening portion 10. As a result, a space factor for the arrangement of the electronic component 5 with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board 3, thereby obtaining a small-sized electronic circuit unit.

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