公开(公告)号：US20030051909A1

公开(公告)日：2003-03-20

申请号：US10032478

申请日：2002-01-02

Inventor： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC: H01L023/48

CPC classification number: H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract translation: 一种焊料结构的阵列，包括多个径向弯曲的外表面，每个包围预定尺寸的空腔，其可以用于在预定的导电接触点处将两个具有不同特性的平面元件柔性地接合在一起。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘的阵列，另一个平面元件具有相应的环形或圆形导电焊盘阵列，由阵列的球形焊球组成，焊球包括焊料和 可以在焊料化合物的熔化和随后的冷却期间产生助熔剂，中空焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

公开(公告)号：US06307159B1

公开(公告)日：2001-10-23

申请号：US09188203

申请日：1998-11-09

Applicant: Koji Soejima ,  Naoji Senba

Inventor： Koji Soejima ,  Naoji Senba

IPC: H01R909

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1111 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract translation: 公开了一种凸块结构，其具有中空体，用于电连接第一构件和第二构件。 还公开了一种制造凸块结构的方法，其具有以下步骤：制备具有凹模的模制板以模制凸块形成构件; 形成导电薄膜，以在模板的凹模中形成预定的空腔; 准备要传输导电薄膜的基板; 以及将形成在所述成型板上的导电性薄膜转移到所述基板。

公开(公告)号：US06298551B1

公开(公告)日：2001-10-09

申请号：US09459586

申请日：1999-12-13

Applicant: Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

Inventor： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC: H05K336

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Abstract translation: 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。

公开(公告)号：US6059579A

公开(公告)日：2000-05-09

申请号：US936240

申请日：1997-09-24

Applicant: John S. Kresge ,  Scott P. Moore ,  Robin A. Susko ,  James W. Wilson

Inventor： John S. Kresge ,  Scott P. Moore ,  Robin A. Susko ,  James W. Wilson

IPC: H01R13/24 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613

Abstract: An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.

Abstract translation: 一种用于连接包括至少两个结构的相对的半导体结构（12,14）的组件和工艺。 结构（12,14）之间的互连（16）将结构以相互间隔开的关系彼此连接。 互连件包括第一材料（18）和第二材料（20）。 第一材料包括弹性柔性中心部分。 第二材料包括围绕第一材料的导电外部部分。 第二材料和第一材料为互连提供了柔性柔顺特性，用于维持结构之间的导电关系。

公开(公告)号：US20180084636A1

公开(公告)日：2018-03-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  Vu Thanh VO ,  Amir SALEHI ,  Dennis R. PYPER ,  Alex J. CRUMLIN ,  Corey S. PROVENCHER ,  Derek J. WALTERS ,  Michael V. YEH

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/148 ,  H05K7/20963 ,  H05K9/0033 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10257

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：US20180042111A1

公开(公告)日：2018-02-08

申请号：US15231438

申请日：2016-08-08

Applicant: BAKER HUGHES INCORPORATED

Inventor： Rocco DIFOGGIO ,  Otto N. FANINI ,  Paul G. CAIRNS ,  Brian D. BREAUX ,  Benjamin TODD

IPC: H05K1/18 ,  G01V3/18 ,  E21B49/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0056 ,  B23K26/18 ,  B33Y10/00 ,  E21B47/011 ,  E21B49/00 ,  G01V3/18 ,  H05K1/113 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10628 ,  H05K2203/107

Abstract: Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.

公开(公告)号：US20160212894A1

公开(公告)日：2016-07-21

申请号：US14991432

申请日：2016-01-08

Applicant: Innolux Corporation

Inventor： Wei-Jen Tsai ,  Hui-Lang Lee ,  Ying-Wen Yang

IPC: H05K9/00 ,  H05K5/00 ,  H05K1/02 ,  H05K5/04

CPC classification number: H05K9/0054 ,  H05K1/0215 ,  H05K1/0259 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/10257

Abstract: A display device includes a display panel, a circuit board, and a conductive element. The circuit board is adjacent to the display panel and electrically connected to the display panel. The circuit board has at least a conductive pattern configured at a ground zone, and the conductive pattern has a plurality of conductive portions spaced apart each other. The quantities of the conductive portions respectively arranged along a first direction and a second direction are plural, and the first direction is substantially perpendicular to the second direction. The conductive element is disposed on the conductive pattern, and the conductive element is electrically connected to the conductive portions.

Abstract translation: 显示装置包括显示面板，电路板和导电元件。 电路板与显示面板相邻并电连接到显示面板。 电路板至少具有配置在接地区的导电图案，导电图案具有彼此隔开的多个导电部。 分别沿第一方向和第二方向布置的导电部分的数量是多个，并且第一方向基本上垂直于第二方向。 导电元件设置在导电图案上，并且导电元件电连接到导电部分。

公开(公告)号：US20160050764A1

公开(公告)日：2016-02-18

申请号：US14923941

申请日：2015-10-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

Abstract translation: 一种用于半导体器件的安装夹具包括：绝缘电路板定位夹具，通过将绝缘电路板容纳在预定位置来定位绝缘电路板;管状接触元件定位夹具，其具有在预定位置处的多个定位孔，以插入多个 管状接触元件和用于将插入到管状接触元件定位夹具中的各个定位孔中的多个管状接触元件按压的管状接触元件压入夹具。

公开(公告)号：US08767398B2

公开(公告)日：2014-07-01

申请号：US13021344

申请日：2011-02-04

Applicant: Robert E. Kodadek, III

Inventor： Robert E. Kodadek, III

IPC: H05K7/20

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电子部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分容易流体连通。

公开(公告)号：US08354594B2

公开(公告)日：2013-01-15

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.

Abstract translation: 本发明涉及一种包括蚀刻带状导体（2）和导线导体（6）的线印刷电路板或卡（1），其中导线在连接点之间和/或电路板或卡（1）之间延伸， 4）。 电线导体（6）中的至少一个具有基本上矩形的，例如正方形的横截面。