公开(公告)号：US09851763B1

公开(公告)日：2017-12-26

申请号：US14040924

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Alessandro Geist ,  Michael R. Lin ,  Gary R. Crum

IPC: H05K1/18 ,  G06F1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm.

公开(公告)号：US20170359895A1

公开(公告)日：2017-12-14

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji OCHI

IPC: H05K1/09 ,  H05K5/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/092 ,  H05K1/111 ,  H05K1/181 ,  H05K5/0069 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US20170202088A1

公开(公告)日：2017-07-13

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09578744B2

公开(公告)日：2017-02-21

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。

公开(公告)号：US20150305191A1

公开(公告)日：2015-10-22

申请号：US14256108

申请日：2014-04-18

Applicant: Raytheon Company

Inventor： Cary C. Kyhl ,  Scott M. Heston ,  James M. Elliott

IPC: H05K7/20 ,  H05K3/32

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：US08482934B2

公开(公告)日：2013-07-09

申请号：US13011140

申请日：2011-01-21

Applicant: Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

Inventor： Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

IPC: H05K7/02

CPC classification number: H05K3/222 ,  H01G2/065 ,  H05K1/0231 ,  H05K1/025 ,  H05K2201/10628 ,  Y10T29/49002

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract translation: 提供了一种实现具有对称参考平衡的表面贴装元件的方法和结构。 在表面安装器件（SMD）封装中接收第一参考和输入信号，并且第二参考信号被接收并且输出信号从SMD封装输出。 电容器结构在SMD封装内定义在第一个参考和第二个参考之间。 电容器结构包括在第一参考和第二参考之间的平衡阻抗结构。 连接在接收的输入信号和输出信号之间的分量通常位于电容器结构内。

公开(公告)号：US20120188742A1

公开(公告)日：2012-07-26

申请号：US13011140

申请日：2011-01-21

Applicant: Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

Inventor： Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

IPC: H05K7/02 ,  H05K13/00

CPC classification number: H05K3/222 ,  H01G2/065 ,  H05K1/0231 ,  H05K1/025 ,  H05K2201/10628 ,  Y10T29/49002

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract translation: 提供了一种实现具有对称参考平衡的表面贴装元件的方法和结构。 在表面安装器件（SMD）封装中接收第一参考和输入信号，并且第二参考信号被接收并且输出信号从SMD封装输出。 电容器结构在SMD封装内定义在第一个参考和第二个参考之间。 电容器结构包括在第一参考和第二参考之间的平衡阻抗结构。 连接在接收的输入信号和输出信号之间的分量通常位于电容器结构内。

公开(公告)号：US20090264004A1

公开(公告)日：2009-10-22

申请号：US12424341

申请日：2009-04-15

Applicant: Neil S. Sherman ,  Brian H. Steuer

Inventor： Neil S. Sherman ,  Brian H. Steuer

IPC: H01R13/62

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector device for maintaining a desired spatial relationship for spatially and securely connecting to a platform, such as a circuit board, in an efficient manner. The connector device generally includes a body portion separated from the secondary device, a plurality of legs extending from the body portion for removably attaching the body portion to the secondary device, wherein the plurality of legs each include a foot member insertable within an opening of the secondary device for grasping the secondary device and at least one contact pin extending from the body portion to contact the secondary device on an opposite surface as the foot member. The contact pin maintains the separation between the body portion and the secondary device and includes a spring for providing a counter force against the secondary device with respect to the foot member.

Abstract translation: 一种连接器装置，用于以有效的方式保持用于空间和牢固地连接到平台（例如电路板）的期望的空间关系。 连接器装置通常包括与次级装置分离的主体部分，从主体部分延伸的多个腿部，用于可拆卸地将主体部分附接到次要装置，其中多个腿部各自包括可插入到第二装置的开口内的脚部件 用于抓握次级装置的次级装置和从主体部分延伸的至少一个接触销，以在与脚部件相反的表面上接触次级装置。 接触销保持主体部分和次要装置之间的分离，并且包括用于相对于脚部构件提供抵抗次级装置的反作用力的弹簧。

公开(公告)号：US20090034219A1

公开(公告)日：2009-02-05

申请号：US12184086

申请日：2008-07-31

Applicant: Nader Gamini ,  Joseph C. Fjelstad

Inventor： Nader Gamini ,  Joseph C. Fjelstad

IPC: H05K1/18 ,  H05K7/02

CPC classification number: H05K1/185 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H05K1/023 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电子部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

公开(公告)号：US20080277151A1

公开(公告)日：2008-11-13

申请号：US12119287

申请日：2008-05-12

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/00 ,  B23K31/02

CPC classification number: H05K1/185 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/1241 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1700。 组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。 该组件用电绝缘材料908封装，其中通孔420,1002通过衬底808形成或钻孔1000穿过组件引线412。 然后将组件电镀1200，并重复封装和钻孔工艺1500以建立所需的层422,1502,1702。