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    Semiconductor device and mounting method therefor
    91.
    发明授权
    Semiconductor device and mounting method therefor 失效
    半导体装置及其安装方法

    公开(公告)号：US6019274A

    公开(公告)日：2000-02-01

    申请号：US857865

    申请日：1997-05-16

    Applicant: Naofumi Iwamoto

    Inventor： Naofumi Iwamoto

    IPC: H01L21/60 ,  H01L23/32 ,  H01L23/495 ,  H01L23/498 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12

    CPC classification number: H05K3/3421 ,  H01L23/32 ,  H01L23/49572 ,  H01L23/49811 ,  H01L24/83 ,  H01L2924/14 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10916 ,  H05K2203/0278 ,  H05K2203/159 ,  H05K3/301 ,  Y02P70/613

    Abstract: A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal pieces arranged as weights on the leads are temporarily positioned adequately to specified bonding pads, thus restraining the leads from shifting from appropriate positions, which may occur if the leads deform, and wherein the metal pieces become wettable by bonding agent when heated, thus making sure that the leads are firmly fixed between the metal pieces and the bonding pads.

    Abstract translation: 一种回流安装方法和半导体装置，用于通过防止引线的变形并且确保电路板上的接合焊盘和引线之间的可靠接触而有效地制造可靠性优异的TCP，其中作为引线上的重量设置的金属片是暂时的 适当地定位到指定的接合焊盘，从而限制引线从适当的位置移动，如果引线变形可能会发生这种情况，并且其中金属片在加热时可被粘合剂润湿，从而确保引线牢固地固定在金属 片和接合垫。

    Self-aligning light directing surface mountable miniature incandescent lamp
    93.
    发明授权
    Self-aligning light directing surface mountable miniature incandescent lamp 失效
    自调光导光表面安装微型白炽灯

    公开(公告)号：US5382874A

    公开(公告)日：1995-01-17

    申请号：US970767

    申请日：1992-11-03

    Applicant: Ralph E. Johnson

    Inventor： Ralph E. Johnson

    IPC: H01K1/46 ,  H01J5/54 ,  H01K1/32 ,  H01K5/02 ,  H01K7/04 ,  H05K3/30 ,  H05K3/34 ,  H01K1/42

    CPC classification number: H05K3/3442 ,  H01J5/54 ,  H01K1/325 ,  H01K1/46 ,  H01K5/02 ,  H01K7/04 ,  H05K2201/10113 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/613

    Abstract: A surface mountable miniature incandescent lamp assembly has an elongated substantially cylindrical glass envelope wherein a filament is contained in contact with metal members having glass-to-metal seals with the glass envelope. A substantial portion of the outer surface of the glass envelope is coated with a light reflective metal coating, with a non-coated elongated window transparent to light being left on the surface. The metal members extend axially to the outside from the envelope and, when mounted to a circuit board provide electric contact for the lamp. At least one of the end members includes a unique surface feature, such as a flat portion of an otherwise cylindrical surface, which is directionally coupled relative to the window of the glass envelope and which acts as a key or indexing surface for mounting the lamp assembly to the receiving surface (circuit board) with the window disposed in the desired direction.

    Abstract translation: 可表面安装的小型白炽灯组件具有细长的基本上圆柱形的玻璃外壳，其中灯丝包含与玻璃与金属密封件的金属部件接触。 玻璃外壳的外表面的主要部分涂覆有光反射金属涂层，其中未涂覆的细长窗口对于留在表面上的光而言是透明的。 金属构件从外壳轴向延伸到外部，并且当安装到电路板时为灯提供电接触。 至少一个端部构件包括独特的表面特征，例如其它圆柱形表面的平坦部分，其相对于玻璃外壳的窗口定向耦合，并且用作安装灯组件的键或分度表面 到达接收表面（电路板），窗口设置在所需方向。

    Method of making surface mountable electronic device
    95.
    发明授权
    Method of making surface mountable electronic device 失效
    制造可表面安装的电子设备的方法

    公开(公告)号：US4934048A

    公开(公告)日：1990-06-19

    申请号：US280172

    申请日：1988-12-05

    Applicant: Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    Inventor： Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    IPC: H01F27/29 ,  H05K3/30

    CPC classification number: H01F27/292 ,  H05K3/30 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49172

    Abstract: A surface mountable electronic device and method of making same wherein a discrete electronic device is encapsulated in a body of electrical insulating material having opposite ends and a mounting surface extending between the ends, and an electrode is provided on each end. Each electrode includes a portion on the end of the body in electrical contact with the corresponding lead of the discrete electronic device and a contact portion extending along the mounting surface for making electrical connection to a circuit portion defined on a surface to which the device is mountable. The discrete electronic device is manufactured, prior to encapsulation, by known techniques. Preferably the body is a rectangular solid with each of the four sides having electrode contact portions thereon to serve as one of four possible mounting surfaces each with substantial mechanical stability. When the discrete electronic device is an inductor, interruption of the magnetic field is minimized by spacing the ends of the inductor core from the ends of the encapsulating body, separating the electrode contact portions, having the area of the electrode end portion less than the area of the end of the encapsulating body, and having the cross-sectional area of the most narrow section of the electrode end portion no less than the cross sectional area of the magnetic wire of the inductor winding. For a shielded inductor, phenolic core inductor or non-inductive device, solid metal end electrodes can be employed.

    Abstract translation: 一种可表面安装的电子设备及其制造方法，其中分立的电子器件封装在具有相对端的电绝缘材料体和在端部之间延伸的安装表面，并且在每个端部上设置电极。 每个电极包括在主体的端部与分立的电子设备的相应引线电接触的部分和沿着安装表面延伸的接触部分，用于与限定在该装置可安装的表面上的电路部分进行电连接 。 离散电子器件在封装之前通过已知技术制造。 优选地，主体是矩形固体，其中四边中的每一个在其上具有电极接触部分，以用作四个可能的安装表面之一，每个具有相当大的机械稳定性。 当分立电子设备是电感器时，通过将电感器芯的端部与封装体的端部间隔开来，使电场端部的面积小于面积的电极接触部分 并且电极端部的最窄部分的横截面积不小于电感器绕组的磁线的横截面面积。 对于屏蔽电感器，可以使用酚醛芯感应器或非感应器件，固体金属端电极。

    Electric capacitor in the form of a chip component and method for manufacturing same
    96.
    发明授权
    Electric capacitor in the form of a chip component and method for manufacturing same 失效
    芯片组件形式的电容器及其制造方法

    公开(公告)号：US4617609A

    公开(公告)日：1986-10-14

    申请号：US707591

    申请日：1985-03-04

    Applicant: Ferdinand Utner ,  Herbert Bolz

    Inventor： Ferdinand Utner ,  Herbert Bolz

    IPC: H01G4/252 ,  H01G2/06 ,  H01G4/00 ,  H01G9/004 ,  H05K3/34 ,  H01G1/14 ,  H01G4/10 ,  H01G7/00

    CPC classification number: H01G2/06 ,  H01G2/065 ,  H05K3/3442 ,  H01F2027/295 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/435

    Abstract: An electric capacitor which can be soldered to a printed circuit board in the manner of a chip component, without damaging the capacitor, has capacitor plates with electrodes therebetween arranged in a stack, the electrodes alternatingly terminating at opposite end faces of the capacitor, at which a metal plating is applied, with a portion of respective bands of flexible metal being disposed adjacent each metal plating forming current leads, with the portion of the band adjacent the metal plating being encapsulated with the capacitor, and a remaining portion of each band projecting outside of the encapsulation and being bent at least partially around exterior sides of the encapsulation and forming soldering surfaces. A method for manufacturing such a capacitor includes the steps of cutting spaced recesses in a metal plate for producing a number of continuous parallel bands extending between two margins of the plate, cutting and bending those bands and inserting a stacked capacitor with the metal platings between the cut ends of the band, encapsulating the capacitor and the portions of the bands adjacent thereto, and severing the opposite ends of the bands from the plate margins and bending the severed portions around a part of the exterior of the encapsulation.

    Abstract translation: 可以以芯片部件的方式焊接到印刷电路板而不损坏电容器的电容器具有电容器板，其间具有电极的电极板布置在堆叠中，电极交替地终止于电容器的相对端面，在该电容器 施加金属电镀，其中柔性金属的各个带的一部分设置在每个金属镀层形成电流引线附近，带的与金属镀层相邻的部分被电容器封装，并且每个带的剩余部分向外突出 并且至少部分地围绕封装的外侧弯曲并形成焊接表面。 制造这种电容器的方法包括以下步骤：在金属板中切割间隔开的凹槽，以产生在板的两个边缘之间延伸的多个连续的平行带，切割和弯曲这些带，并且将金属板插入在 切割带的端部，封装电容器和与其相邻的带的部分，并且将带的相对端从板边缘切断并且围绕封装的外部的一部分弯曲切断的部分。

    Hermetically sealed ceramic cased surface mount capacitor
    97.
    发明授权
    Hermetically sealed ceramic cased surface mount capacitor 失效
    密封陶瓷套管表面贴装电容器

    公开(公告)号：US4614995A

    公开(公告)日：1986-09-30

    申请号：US667046

    申请日：1984-11-01

    Applicant: Bernard Lavene

    Inventor： Bernard Lavene

    IPC: H01G2/02 ,  H01G2/06 ,  H01G4/228 ,  H01G4/248 ,  H05K3/34 ,  H01G1/13

    CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G2/065 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A planar terminated capacitor and a method for fabricating planar terminated capacitors is disclosed wherein a capacitor element is inserted in a nonconductive ceramic case. The case extends outwardly beyond the ends of the capacitor element forming cavities at each end of the case. Metal end caps are positioned at the ends of the case substantially enclosing the cavities. The end caps are electrically coupled to the ends of the capacitor element.

    Abstract translation: 公开了一种平面端接电容器和制造平面端接电容器的方法，其中将电容器元件插入到非导电陶瓷壳体中。 壳体向外延伸超过在壳体的每个端部处形成腔的电容器元件的端部。 金属端帽位于壳体的基本上包围空腔的端部。 端盖电耦合到电容器元件的端部。

    Push-on terminal clip and assembly
    99.
    发明授权
    Push-on terminal clip and assembly 失效
    推式端子夹和组件

    公开(公告)号：US4422128A

    公开(公告)日：1983-12-20

    申请号：US290692

    申请日：1981-08-06

    Applicant: Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

    Inventor： Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

    IPC: H05K3/32 ,  H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/3447 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/34 ,  Y02P70/611

    Abstract: The lead of a T03 style transistor extends through a hole in a printed circuit board. A resilient connector is provided for connecting the transistor lead to a printed circuit conductor in a manner to allow dip soldering but avoiding stress on the lead which might break the glass seal on the transistor package. The connector is a spring clip having a U-shaped portion with a pair of aligned holes in the legs to grip the transistor lead, one of the legs extending into another U-shaped portion which resiliently engages the circuit board conductor when assembled to the transistor lead. The connections are secured by dip soldering to complete the assembly.

    Abstract translation: T03型晶体管的引线延伸穿过印刷电路板中的一个孔。 提供弹性连接器，用于将晶体管引线连接到印刷电路导体，以允许浸焊，但避免引线上的应力，这可能会破坏晶体管封装上的玻璃密封。 连接器是具有U形部分的弹簧夹，其中在腿中具有一对对齐的孔以夹持晶体管引线，其中一个腿延伸到另一个U形部分中，该U形部分在组装到晶体管时弹性地接合电路板导体 铅。 连接通过浸焊固定，以完成组装。

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