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公开(公告)号:KR1020080061059A
公开(公告)日:2008-07-02
申请号:KR1020060135844
申请日:2006-12-28
Applicant: 전자부품연구원
IPC: A61B5/00
Abstract: An apparatus and a method for measuring a thickness of a skin using an image sensor are provided to remove any side effects to a living body when measuring the thickness of the skin. An apparatus for measuring a characteristic of a skin(30) includes a light source(10), an image sensor(40), and a characteristic analysis device(50). The light source generates first wavelength light of 700 to 1350 nm or second wavelength light of 1500 to 1700 nm to a specific region of an object. The image sensor measures a characteristic of the first wavelength light or the second wavelength light diffused and impinged to the object from the light source outside the object. The characteristic analysis device analyzes an internal characteristic of the object through the data measured by the image sensor.
Abstract translation: 提供一种使用图像传感器测量皮肤厚度的装置和方法,用于在测量皮肤厚度时消除对生物体的任何副作用。 一种用于测量皮肤(30)的特性的装置包括光源(10),图像传感器(40)和特征分析装置(50)。 光源产生700至1350nm的第一波长光或1500至1700nm的第二波长光到物体的特定区域。 图像传感器测量第一波长光或者第二波长光从物体外部的光源扩散并撞击物体的特性。 特征分析装置通过图像传感器测量的数据分析对象的内部特性。
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公开(公告)号:KR200367729Y1
公开(公告)日:2004-11-15
申请号:KR2020040024408
申请日:2004-08-26
Applicant: 전자부품연구원
IPC: G01N21/80
Abstract: 본 고안은 pH 센서에 관한 것으로, 보다 자세하게는 마이크로 칩을 이용하여 극소량의 시료 용액의 광학적 특성으로 pH를 측정하는 pH 센서에 관한 것이다.
본 고안의 상기 목적은 시료 용액과 지시약 용액이 각각 주입되는 주입부; 상기 주입부와 연결되며 시료 용액과 지시약 용액이 접촉하며 층흐름으로 흘러가는 미세 통로; 및 상기 시료 용액과 지시약 용액이 배출되는 배출부를 포함하여 구성됨을 특징으로 하는 마이크로 칩을 이용한 pH 센서에 의해 달성된다.
따라서, 본 고안에 의한 마이크로 칩을 이용한 pH 센서는 마이크로 칩을 이용하여 극소량의 시료 용액만으로 pH를 측정하고 층흐름(laminar flow)을 이용하여 pH 측정 후 시료 용액을 회수할 수 있는 특징이 있다.-
公开(公告)号:KR1020010078652A
公开(公告)日:2001-08-21
申请号:KR1020000006057
申请日:2000-02-09
IPC: H01L23/52
Abstract: PURPOSE: A method for packaging a micro structure is provided to use an inexpensive plastic package of a surface mounted device type instead of a dual in-line package by packaging a portion moving in devices like an acceleration sensor, an angular velocity sensor and an actuator in a wafer level. CONSTITUTION: A micro structure is composed of a structure wafer and a cover wafer(40) on the structure wafer. A silicon direct bonding wafer has a silicon layer(30) having the same thickness as the structure and a sacrificial layer(31) between the silicon layer and the wafer. The sacrificial layer is etched to make the structure move. The cover wafer having an adhesion layer(44) is bonded to an upper portion of the silicon direct bonding wafer prepared by an electrical process. The cover wafer comes to have a desired thickness by using lapping and a chemical mechanical polishing(CMP) process. A through hole(46) is formed in the bonded cover wafer by a silicon anisotropical etching process. Metal layers(48) are formed on the cover wafer having the through hole and in a pad on the structure wafer. The wafer completed by an electrical process is sawed into unit devices. Lead frames are bonded to the unit devices, and interconnected by metal wires. A molding process using plastic is performed.
Abstract translation: 目的:提供一种用于包装微结构的方法,以便通过将在诸如加速度传感器,角速度传感器和致动器之类的装置中移动的部分包装来使用表面安装装置类型而不是双列直插式封装的便宜的塑料封装 在晶片级。 构成:微结构由结构晶片和结构晶片上的覆盖晶片(40)组成。 硅直接接合晶片具有与该结构具有相同厚度的硅层(30)和在硅层和晶片之间的牺牲层(31)。 牺牲层被蚀刻以使结构移动。 具有粘合层(44)的覆盖晶片与通过电工艺制备的硅直接接合晶片的上部接合。 通过研磨和化学机械抛光(CMP)工艺,覆盖晶片具有期望的厚度。 通过硅各向异性蚀刻工艺在接合的覆盖晶片中形成通孔(46)。 金属层(48)形成在具有通孔的覆盖晶片上并且在结构晶片上的焊盘中。 通过电气工艺完成的晶片被锯成单元装置。 引线框架结合到单元设备,并通过金属线互连。 执行使用塑料的成型工艺。
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公开(公告)号:KR1020010045525A
公开(公告)日:2001-06-05
申请号:KR1019990048845
申请日:1999-11-05
Applicant: 전자부품연구원
Abstract: PURPOSE: A method for manufacturing a low temperature sintering piezoelectric composition is provided to improve a physical property of a piezoelectric material composed of a substituted piezoelectric composition and to decrease a sintering temperature. CONSTITUTION: Mass regarding a composition of either a substituted low temperature sintering PZT-based piezoelectric material or composite 3-component low temperature sintering PZT-based piezoelectric material, is measured. The low temperature sintering PZT-based piezoelectric compositions of which mass is measured, are mixed while calcined. Mass of BaO-CuO as a low temperature sintering agent is measured and mixed with the calcined low temperature sintering PZT-based piezoelectric composition. The low temperature piezoelectric composition is heated to a predetermined temperature and sintered. An electrode is formed on the sintered low temperature piezoelectric material, and an electric field is applied to perform a polarization process. Power is applied to the electrode to determine a physical property of the low temperature piezoelectric material.
Abstract translation: 目的:提供一种制造低温烧结压电组合物的方法,以改善由取代的压电组合物构成的压电材料的物理性能并降低烧结温度。 组成:测量取代的低温烧结PZT基压电材料或复合三组分低温烧结PZT基压电材料的组成的质量。 测量质量的低温烧结PZT基压电组合物在煅烧时混合。 测量作为低温烧结剂的BaO-CuO的质量,并与煅烧的低温烧结PZT基压电组合物混合。 将低温压电组合物加热到预定温度并烧结。 在烧结的低温压电材料上形成电极,施加电场以进行极化处理。 对电极施加功率以确定低温压电材料的物理性质。
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公开(公告)号:KR1020000031872A
公开(公告)日:2000-06-05
申请号:KR1019980048123
申请日:1998-11-11
Applicant: 전자부품연구원
IPC: B41J2/045
Abstract: PURPOSE: A printer head is provided to reduce the size of the device a half when trying to obtain the same displacement since the displacement can be improved more than two times with the same material and driving voltage. CONSTITUTION: A printer head unit including an ink chamber and a nozzle is composed of a diaphragm covered with the ink chamber of the printer head unit, a piezoelectric film repeatedly arranged on the upper part of the diaphragm at a regular interval to form polarization in the same direction as a diaphragm face and an electrode repeatedly formed in a space between the both ends of the piezoelectric film. Herein, an electrode material(113) is sprayed in an empty space of a photo register by using a metal mask, and the remaining photo register is removed after spraying the electrode material. Then the electrode(113) is repeatedly formed in a series along with the piezoelectric film(107) and a silicon film(101).
Abstract translation: 目的:提供打印头,以便在尝试获得相同的位移时将设备的尺寸减小一半,因为在相同的材料和驱动电压下,位移可以提高两倍以上。 构成:包括墨水室和喷嘴的打印头单元由覆盖有打印头单元的墨室的隔膜组成,压电膜以规则的间隔重复地布置在隔膜的上部,以形成偏振 与膜面相同的方向和在压电膜的两端之间的空间中重复形成的电极。 这里,通过使用金属掩模将电极材料(113)喷射到照相寄存器的空的空间中,并且在喷射电极材料之后去除剩余的照片寄存器。 然后,与压电膜(107)和硅膜(101)一起重复形成电极(113)。
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