公开(公告)号：US20150027756A1

公开(公告)日：2015-01-29

申请号：US13948274

申请日：2013-07-23

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Yu-Hui Wu

IPC: H05K1/02

CPC classification number: H05K1/0237 ,  H05K1/0242 ,  H05K2201/098

Abstract: A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness.

Abstract translation: 用于高频信号的电路板结构包括基板和形成在基板上的导电电路层。 导电电路层包括电路图案和连接焊盘。 电路图案包括具有矩形块形状的基部和设置在基部上的具有半球形状的圆顶部。 圆形顶部可以通过嵌入在介电塑料膜中的圆形底部部分进行修改。 或者，形成具有圆形顶部和底部的双层结构，使得电路图案的表面设置有半球以加强反射，从而克服由于矩形结构引起的信号集中或信号衰减的问题 由于表面粗糙度。

公开(公告)号：US08941224B2

公开(公告)日：2015-01-27

申请号：US13853281

申请日：2013-03-29

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H01L23/06 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L21/563 ,  H01L23/49861 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package structure includes a thin chip substrate, a stabilizing material layer, a chip and a filling material. A first circuit metal layer of the substrate is inlaid into a dielectric layer and a co-plane is defined by the first circuit metal layer and the dielectric layer and is exposed from the dielectric layer. The bonding pads of the substrate are on the co-plane, have a height higher than the co-plane and connected to the first circuit metal layer. The stabilizing material layer is provided on two sides of the co-plane to define a receiving space for accommodating the chip. The filling material is injected into the receiving space to fasten the pins of the chip securely with bonding pads. Since no plastic molding is required, a total thickness of the package structure and the cost is reduced. The stabilizing material layer prevents the substrate from warping and distortion.

Abstract translation: 封装结构包括薄片基板，稳定材料层，芯片和填充材料。 衬底的第一电路金属层嵌入电介质层中，并且由第一电路金属层和电介质层限定共面，并从电介质层露出。 衬底的接合焊盘在共面上，具有高于共面的高度并连接到第一电路金属层。 稳定材料层设置在共面的两侧，以限定用于容纳芯片的容纳空间。 将填充材料注入到接收空间中，用粘合垫牢固地固定芯片的销。 由于不需要塑料成型，所以包装结构的总厚度和成本降低。 稳定材料层防止基材翘曲和变形。

公开(公告)号：US08858808B2

公开(公告)日：2014-10-14

申请号：US13448478

申请日：2012-04-17

Applicant: Cheng-Hsiung Yang

Inventor： Cheng-Hsiung Yang

IPC: H01B13/00

CPC classification number: H05K3/0085 ,  H05K1/0393 ,  H05K3/0008 ,  H05K2201/10424 ,  H05K2203/167

Abstract: A method of thin printed circuit board wet process consistency on the same carrier, and more particularly to a printed circuit board in the developing, copper plating, stripping, etching and other wet processes uses the same frame as a carrier from the beginning to the end of the wet process, such that the thin printed circuit board is conducted a continuous and automatic wet process to avoid disassembly, storage and transportation between each process. Moreover, when using the flame, the thin printed circuit board is smooth and flattening in the wet process for avoiding “water effect,” the effective area is not exposed to any mechanical members for preventing scratches, and there are point contacts between the thin printed circuit board and the frame for preventing chemical residue. Accordingly, the present invention can not only enhance the yield of the thin printed circuit board but also shorten the production time.

Abstract translation: 一种薄印刷电路板在相同载体上湿法稠度的方法，更具体地说涉及在显影，镀铜，剥离，蚀刻和其它湿法工艺中的印刷电路板，从开始到结束使用与载体相同的框架 使得薄的印刷电路板进行连续和自动的湿法，以避免在每个工艺之间的拆卸，储存和运输。 此外，当使用火焰时，薄的印刷电路板在湿法中平滑且扁平化以避免“水分效应”，有效区域不暴露于任何机械构件以防止划伤，并且薄印刷 电路板和防止化学残留物的框架。 因此，本发明不仅可以提高薄印刷电路板的产量，而且缩短生产时间。

公开(公告)号：US20140291853A1

公开(公告)日：2014-10-02

申请号：US13853281

申请日：2013-03-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L21/563 ,  H01L23/49861 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package structure includes a thin chip substrate, a stabilizing material layer, a chip and a filling material. A first circuit metal layer of the substrate is inlaid into a dielectric layer and a co-plane is defined by the first circuit metal layer and the dielectric layer and is exposed from the dielectric layer. The bonding pads of the substrate are on the co-plane, have a height higher than the co-plane and connected to the first circuit metal layer. The stabilizing material layer is provided on two sides of the co-plane to define a receiving space for accommodating the chip. The filling material is injected into the receiving space to fasten the pins of the chip securely with bonding pads. Since no plastic molding is required, a total thickness of the package structure and the cost is reduced. The stabilizing material layer prevents the substrate from warping and distortion.

Abstract translation: 封装结构包括薄片基板，稳定材料层，芯片和填充材料。 衬底的第一电路金属层嵌入电介质层中，并且由第一电路金属层和电介质层限定共面，并从电介质层露出。 衬底的接合焊盘在共面上，具有高于共面的高度并连接到第一电路金属层。 稳定材料层设置在共面的两侧，以限定用于容纳芯片的容纳空间。 将填充材料注入到接收空间中，用粘合垫牢固地固定芯片的销。 由于不需要塑料成型，所以包装结构的总厚度和成本降低。 稳定材料层防止基材翘曲和变形。

公开(公告)号：US08547548B1

公开(公告)日：2013-10-01

申请号：US13721019

申请日：2012-12-20

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Chia-Chi Lo ,  Cheng-Hsiung Yang Yang ,  Jun-Chung Hsu

IPC: G01N21/00

CPC classification number: G01N21/8803 ,  G01N2021/8861 ,  G01N2021/888

Abstract: Disclosed is a final defect inspection system, which including a host device, a microscope, a bar code scanner, a support tool, a signal transceiver and an electromagnetic pen. The bar code scanner scans a bar code on a circuit board provided on the support plate. The host device selects data and a circuit layout diagram from the database corresponding to the bar code. The signal transceiver and the electromagnetic pen are electrically connected to the host device. The electromagnetic pen is used to make a mark on a scrap region of the circuit board where any defect is visually found through the microscope. The signal transceiver receives and transmits the positions of the mark to the host device such that the host device calculates the coordinate of a scrap region based on a relative position between an original point and the positions of the mark.

Abstract translation: 公开了一种最终缺陷检查系统，其包括主机，显微镜，条形码扫描器，支持工具，信号收发器和电磁笔。 条形码扫描器扫描设置在支撑板上的电路板上的条形码。 主机设备从与条形码对应的数据库中选择数据和电路布局图。 信号收发器和电磁笔电连接到主机设备。 电磁笔用于在电路板的废料区域上形成标记，其中通过显微镜在视觉上发现任何缺陷。 信号收发器接收和发送标记的位置到主机设备，使得主机设备基于原始点和标记位置之间的相对位置来计算废料区域的坐标。

公开(公告)号：US08471375B2

公开(公告)日：2013-06-25

申请号：US11772208

申请日：2007-06-30

Applicant: Chien-Wei Chang ,  Ting-Hao Lin

Inventor： Chien-Wei Chang ,  Ting-Hao Lin

IPC: H01L23/02

CPC classification number: H01L21/4846 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K1/186 ,  H05K3/205 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high-density fine line structure mainly includes: two boards with similar structures and a dielectric film for combing the two boards. Semiconductor devices respectively in two boards are opposite to each other after the two boards are combined. The two boards each include a fine line circuit, an insulated layer on the same surface, and the semiconductor device installed above the fine line circuit. The surface of the circuit, which is not covered by a solder mask, is made into a pad. The pad is filled with the tin balls for electrically connecting with another semiconductor device. Electroplating rather than the etching method is used for forming the fine line circuit layer, and a carrier and a metal barrier layer, which are needed during or at the end of the manufacturing process, are removed to increase the wiring density for realizing the object of high-density.

Abstract translation: 高密度细线结构主要包括：具有相似结构的两个板和用于梳理两个板的电介质膜。 两块板之间的半导体器件相互相对，两块板组合起来。 两个板各自包括细线电路，同一表面上的绝缘层，以及安装在细线电路上方的半导体器件。 未被焊接掩模覆盖的电路的表面被制成焊盘。 衬垫填充有用于与另一半导体器件电连接的锡球。 使用电镀而不是蚀刻方法来形成细线电路层，并且去除在制造过程期间或结束时需要的载体和金属阻挡层，以增加用于实现该目的的物体的布线密度 高密度。

公开(公告)号：US07871892B2

公开(公告)日：2011-01-18

申请号：US12479811

申请日：2009-06-07

Applicant: Chien-Wei Chang ,  Ting-Hao Lin ,  Ya-Hsiang Chen ,  Yu-Te Lu

Inventor： Chien-Wei Chang ,  Ting-Hao Lin ,  Ya-Hsiang Chen ,  Yu-Te Lu

IPC: H01L21/20

CPC classification number: B32B37/02 ,  B32B38/06 ,  B32B2038/047 ,  B32B2457/08 ,  B32B2457/16 ,  H01G4/236 ,  H01G4/33 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09509 ,  H05K2203/1461

Abstract: A method for fabricating a buried capacitor structure includes: laminating a first dielectric layer having a capacitor embedded therein with a second dielectric layer to bury the capacitor therebetween; forming a first circuit pattern on a first metal layer of the first dielectric layer and a second circuit pattern on a second metal layer of the second dielectric layer; depositing a first insulating layer and a second insulating layer on the first metal layer and the second metal layer, respectively; electrically connecting a positive electrode end and a negative electrode end of the capacitor to the second metal layer by a positive through-hole and a negative through-hole, thereby manufacturing the buried capacitor structure.

Abstract translation: 一种埋入式电容器结构的制造方法，其特征在于：将具有嵌入其中的电容器的第一电介质层与第二电介质层层叠， 在所述第一介电层的第一金属层上形成第一电路图案，在所述第二介电层的第二金属层上形成第二电路图案; 分别在第一金属层和第二金属层上沉积第一绝缘层和第二绝缘层; 通过正通孔和负通孔将电容器的正极端子和负极端子电连接到第二金属层，从而制造埋入式电容器结构。

公开(公告)号：US07807034B2

公开(公告)日：2010-10-05

申请号：US11734274

申请日：2007-04-12

Applicant: Ting-Hao Lin

Inventor： Ting-Hao Lin

IPC: C25D5/02

CPC classification number: H05K3/423 ,  H05K3/0035 ,  H05K3/025 ,  H05K3/205 ,  H05K3/242 ,  H05K3/382 ,  H05K3/421 ,  H05K2201/09563 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1152

Abstract: A manufacturing method of a non-etched circuit board is disclosed herein, which employs a metal substrate having a metal barrier layer and an electroplated copper layer to transmit an electrical current to form a circuit layer. A patterned photoresist layer is formed on the electroplated copper layer to define the location of the circuit layer and form circuits or conductive via on the board by electroplating. An electroplated nickel layer or an electroplated gold layer is further formed on the circuit layer for protecting the circuits and improving the fine line capability. During or after the process, the metal substrate, the metal barrier layer, and the electroplated copper layer are removed to enlarge the wiring space, so that a high-density circuit board can be obtained.

Abstract translation: 本文公开了一种未蚀刻电路板的制造方法，其采用具有金属阻挡层和电镀铜层的金属基板来传输电流以形成电路层。 在电镀铜层上形成图案化的光致抗蚀剂层以限定电路层的位置，并通过电镀在电路板上形成电路或导电通孔。 在电路层上进一步形成电镀镍层或电镀金层，以保护电路并提高细线能力。 在处理过程中或之后，去除金属基板，金属阻挡层和电镀铜层以扩大布线空间，从而可以获得高密度电路板。

公开(公告)号：US07405146B2

公开(公告)日：2008-07-29

申请号：US11338376

申请日：2006-01-24

Applicant: Cheng-Kuo Ma

Inventor： Cheng-Kuo Ma

IPC: H01L21/445

CPC classification number: H05K3/243 ,  H05K3/062 ,  H05K3/242 ,  H05K3/28 ,  H05K2201/0352 ,  H05K2203/1476 ,  H05K2203/1581 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: An electroplating method by transmitting electric current from a ball side is provided. In the electroplating method, the circuit layer is firstly formed on the bump side of the IC board, and the electric current is transmitted to the portion of the circuit layer uncovered by the insulating layer formed on the bump side from the electroplated metal layer on the ball side to form the protective layer (the electroplated gold layer) on the portion of the circuit layer. In such a way, the electroplated gold layer cannot be formed under the insulating layer formed on the bump side (attached with the chip) because the electroplated gold layer is formed after the insulating layer has been formed, and thereby the fall-off of the insulating layer from the electroplated gold layer will not happen. Therefore, the reliability of the products is enhanced.

Abstract translation: 提供了通过从球侧传输电流的电镀方法。 在电镀方法中，电路层首先形成在IC板的凸块侧，并且电流被传导到电路层的未被凸起侧形成的绝缘层的电镀层的电镀层上的电镀金属层 球侧，以在电路层的部分上形成保护层（电镀金层）。 以这种方式，由于在形成绝缘层之后形成电镀金层，所以不能在形成在凸块侧（附着芯片）的绝缘层的下方形成电镀金层，从而使电镀金层脱落 绝缘层与电镀金层不会发生。 因此，提高了产品的可靠性。