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    INTEGRATED DEVICE PACKAGE
    101.
    发明公开
    INTEGRATED DEVICE PACKAGE 审中-公开

    公开(公告)号：US20240118131A1

    公开(公告)日：2024-04-11

    申请号：US18546261

    申请日：2022-02-11

    Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

    Inventor： Johnny Solana Gealon ,  Gharry Maala Bathan ,  Jettro Alcantara Satsatin ,  Chai Wong Lee ,  Johann Philip Trinidad Ignacio

    IPC: G01H11/08 ,  B81B7/00

    CPC classification number: G01H11/08 ,  B81B7/0032 ,  B81B2201/0285

    Abstract: A sensor package is disclosed. The sensor package can include a support structure that is configured to couple with a vibration source by way of a stud. The sensor package can include a cap that is at least partially disposed over the support structure. The cap at least partially defines a cavity. The sensor package can include a vibration sensor module that is coupled to a portion of the support structure and disposed in the cavity. The sensor package can have a mechanical resonant frequency in a range of 0.1 Hz to 11 kHz. The sensor package can include a connector that is coupled to the support structure. The connector can connect to a connection line is electrically connect the vibration sensor module to an external substrate or system. The support structure can include a material that has a Young's modulus of at least 60 GPa and a density less than 3000 kg/m3. The sensor package can include a filler material disposed in the cavity.

    LOW-COST MINIATURE MEMS VIBRATION SENSOR
    105.
    发明申请
    LOW-COST MINIATURE MEMS VIBRATION SENSOR 审中-公开

    公开(公告)号：US20170240418A1

    公开(公告)日：2017-08-24

    申请号：US15382581

    申请日：2016-12-16

    Applicant: Knowles Electronics, LLC

    Inventor： Sarmad Qutub ,  Martin Volk

    IPC: B81B7/00 ,  H04R19/04

    CPC classification number: B81B7/0041 ,  B81B2201/0285 ,  B81C1/00269 ,  B81C2203/0145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H04R1/021 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014

    Abstract: A vibrational sensor comprises a microelectromechanical (MEMS) microphone having a base and a lid defining an enclosure, a MEMS acoustic pressure sensor within the enclosure, and a port defining an opening through the enclosure and material that is arranged to plug the port of the MEMS microphone. In embodiments, the MEMS microphone further includes an integrated circuit within the enclosure that is electrically connected to the MEMS acoustic pressure sensor. In some embodiments, the integrated circuit is configured to bias and buffer the MEMS acoustic pressure sensor. In these and other embodiments, the integrated circuit includes circuitry for conditioning and processing electrical signals generated by the MEMS acoustic pressure sensor. In embodiments, the material is arranged with respect to the port so as to cause the MEMS acoustical pressure sensor to sense vibrational energy rather than acoustic energy as in a conventional MEMS microphone.

    Functional element, electronic apparatus, and moving object
    107.
    发明授权
    Functional element, electronic apparatus, and moving object 有权
    功能元件，电子设备和移动物体

    公开(公告)号：US09446939B2

    公开(公告)日：2016-09-20

    申请号：US14305259

    申请日：2014-06-16

    Applicant: Seiko Epson Corporation

    Inventor： Satoru Tanaka

    IPC: B81B3/00 ,  B81B7/00

    CPC classification number: B81B3/0097 ,  B81B7/0006 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0285

    Abstract: A functional element includes a first electrode section, a second electrode section, a first wiring line connected to the first electrode section, and a second wiring line connected to the second electrode section, the first wiring line is provided with at least one first intersecting section intersecting with a wiring line other than the second wiring line, the second wiring line includes at least one second intersecting section intersecting with a wiring line other than the first wiring line, and a difference between a number of the first intersecting sections and a number of the second intersecting sections satisfies a condition one of equal to and lower than 50% with respect to larger one of the number of the first intersecting sections and the number of the second intersecting sections.

    Abstract translation: 功能元件包括第一电极部分，第二电极部分，连接到第一电极部分的第一布线和连接到第二电极部分的第二布线，第一布线设置有至少一个第一相交部分 与第二布线以外的布线相交，第二布线包括与第一布线以外的布线交叉的至少一个第二交叉部，第一相交部的数量与第 第二交叉部分相对于第一交叉部分的数量和第二交叉部分的数量中的较大的一个满足等于或小于50％的条件一。

    Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer
    109.
    发明授权
    Resonant transducer, manufacturing method therefor, and multi-layer structure for resonant transducer 有权
    谐振换能器，其制造方法和谐振换能器的多层结构

    公开(公告)号：US09139419B2

    公开(公告)日：2015-09-22

    申请号：US14336613

    申请日：2014-07-21

    Applicant: YOKOGAWA ELECTRIC CORPORATION

    Inventor： Takashi Yoshida ,  Shuuji Okuda ,  Shigeto Iwai

    IPC: H01L29/84 ,  B81B3/00 ,  G01N29/12 ,  H01L41/09 ,  H03H3/007 ,  H03H9/24 ,  B81B7/02 ,  B81C1/00 ,  G01L1/14

    CPC classification number: B81B3/0021 ,  B81B3/0002 ,  B81B7/02 ,  B81B2201/0271 ,  B81B2201/0285 ,  B81C1/00198 ,  B81C1/00293 ,  B81C2203/0145 ,  G01L1/14 ,  G01N29/12 ,  G01N2291/014 ,  G01N2291/02827 ,  H01L41/094 ,  H03H3/0072 ,  H03H9/2463

    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole, a second layer disposed over the first layer, a third layer covering the first layer and the second layer, and a projection extending from the second layer toward the resonator, the projection being spatially separated from the resonator, the projection being separated from the first layer by a first gap, the second layer being separated from the first layer by a second gap, the first gap is communicated with the second gap.

    Abstract translation: 谐振换能器包括硅单晶衬底，设置在硅单晶衬底上的硅单晶谐振器，由硅构成的外壳，围绕谐振器间隙，并与硅单晶衬底一起形成腔室，令人兴奋的 模块，其被配置为激励所述谐振器;振动检测模块，被配置为检测所述谐振器的振动，设置在所述腔室上的第一层，所述第一层具有通孔，设置在所述第一层上的第二层， 第一层和第二层，以及从第二层朝向谐振器延伸的突起，突起与谐振器在空间上分离，突起与第一层隔开第一间隙，第二层与第一层分离 通过第二间隙，第一间隙与第二间隙连通。

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