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    めっきレジスト用樹脂組成物および多層プリント配線板
    101.
    发明申请
    めっきレジスト用樹脂組成物および多層プリント配線板 审中-公开
    用于镀层的树脂组合物和多层印刷布线板

    公开(公告)号：WO2012169384A1

    公开(公告)日：2012-12-13

    申请号：PCT/JP2012/063669

    申请日：2012-05-28

    Applicant: 太陽ホールディングス株式会社 ,  柴田 大介 ,  邑田 勝人

    Inventor： 柴田　大介 ,  邑田　勝人

    IPC: H05K3/18 ,  H05K3/46

    CPC classification number: H05K3/429 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0209

    Abstract: 　部分スルーホール形成に有用なめっきレジスト用樹脂組成物およびこの組成物を用いてスルーホールが分割された部分スルーホールを有する多層プリント配線板を提供する。　層間絶縁層と導体層とが交互に積層されてなる多層プリント配線板の層間絶縁層の一部として用いられるめっきレジスト用樹脂組成物であって、樹脂固形分に対して３０～９０質量％の酸化チタンを含むことを特徴とするめっきレジスト用樹脂組成物である。

    Abstract translation: 本发明提供一种有利于形成部分通孔的电镀抗蚀剂树脂组合物，以及具有通过使用该组合物分割通孔而获得的部分通孔的多层印刷线路板。 用于电镀抗蚀剂的树脂组合物用作通过交替层叠层间绝缘层和导电层获得的多层印刷线路板的层间绝缘层的一部分，其特征在于，相对于 树脂固体。

    DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE
    102.
    发明申请
    DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE 审中-公开
    具有孔的电介质基板和制造方法

    公开(公告)号：WO2007001995A1

    公开(公告)日：2007-01-04

    申请号：PCT/US2006/023832

    申请日：2006-06-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  KOYANAGI, Tatsunori ,  LEE, Vincent Yong Chin ,  FU, Yi Liang ,  OHKURA, Yoshiyuki ,  ITO, Masahiko

    Inventor： KOYANAGI, Tatsunori ,  LEE, Vincent Yong Chin ,  FU, Yi Liang ,  OHKURA, Yoshiyuki ,  ITO, Masahiko

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K3/002 ,  H05K1/028 ,  H05K2201/0166 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2203/1184

    Abstract: An aspect of the present invention comprises a method of forming holes in a dielectric substrate comprising the steps of applying a layer of photoresist to a dielectric substrate, exposing portions of the photoresist to actinic radiation through a photomask to form a pattern in the photoresist for an array of holes to be etched in the substrate, developing the photoresist, etching the dielectric substrate to form an array of holes, each hole extending at least partially through the dielectric substrate, and removing the excess photoresist. Another aspect of the present invention is a method of simultaneously forming holes in a dielectric substrate some of which extend partially through the substrate and some of which extend completely through the substrate. Other aspects of the present invention are dielectric substrates formed using the methods of the invention.

    Abstract translation: 本发明的一个方面包括一种在电介质衬底中形成孔的方法，包括以下步骤：将光致抗蚀剂层施加到电介质衬底上，将光致抗蚀剂的一部分暴露于通过光掩模的光化辐射，以在光致抗蚀剂中形成图案， 在衬底中蚀刻的孔的阵列，显影光致抗蚀剂，蚀刻电介质衬底以形成孔阵列，每个孔至少部分延伸穿过电介质衬底，以及去除多余的光致抗蚀剂。 本发明的另一方面是在电介质基板中同时形成空穴的方法，其中一些部分延伸穿过基底，其中一些完全延伸穿过基底。 本发明的其它方面是使用本发明的方法形成的电介质基片。

    WINDOW MANUFACTURE METHOD OF SEMICONDUCTOR PACKAGE TYPE PRINTED CIRCUIT BOARD
    103.
    发明申请
    WINDOW MANUFACTURE METHOD OF SEMICONDUCTOR PACKAGE TYPE PRINTED CIRCUIT BOARD 审中-公开
    半导体封装型印刷电路板的窗制造方法

    公开(公告)号：WO2006109967A2

    公开(公告)日：2006-10-19

    申请号：PCT/KR2006/001307

    申请日：2006-04-10

    Applicant: SIMM TECH CO., LTD

    Inventor： OH, Choon Hwan ,  JUNG, Chang Bo

    CPC classification number: H05K3/242 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/182 ,  H05K3/0044 ,  H05K3/064 ,  H05K3/28 ,  H05K2201/0166 ,  H01L2924/00

    Abstract: Window manufacture method of semiconductor package type printed circuit board of the present invention comprises an imaging step to expose to outer as pressing a dry film, excepts a bond finger part is formed in both sides of bronze coated circuit board, an etching step to be formed bond finger to get rid of bronze of exposed the imaging step, a strip step to eliminate the pressed dry film after formed bond finger in the etching step, a solder regist spread step to insulate all area except bond finger and solder boland to be formed by the strip step, a nickel/gold plating to be formed nickel/gold plating layer to do electroplating on exposed bond finger and solder boland in the solder regist spread step.

    Abstract translation: 本发明的半导体封装型印刷电路板的窗口制造方法包括成像步骤，除了在青铜涂层电路的两侧形成键合指部分之外，在压制干膜时暴露于外部 蚀刻步骤，形成结合指状物以去除暴露成像步骤的青铜;去除在蚀刻步骤中形成的结合指状物之后的受压干燥膜的剥离步骤;焊接剂扩散步骤，以除键合外的所有区域 通过剥离步骤形成指状物和焊料层，形成镍/金电镀镍/金电镀层，以在暴露的键合电极上进行电镀，并且在焊料扩散步骤中进行焊料氧化物的电镀。

    RESIN COMPATIBILIZED STARCH-OIL SIZING
    105.
    发明申请
    RESIN COMPATIBILIZED STARCH-OIL SIZING 审中-公开
    树脂混合淀粉油

    公开(公告)号：WO0222354A8

    公开(公告)日：2005-04-07

    申请号：PCT/US0129005

    申请日：2001-09-18

    Applicant: PPG IND OHIO INC ,  DANA DAVID E

    Inventor： DANA DAVID E

    IPC: B32B27/12 ,  C03C25/32 ,  C08J5/08 ,  D03D15/00 ,  H05K1/03 ,  B32B17/02 ,  B32B17/04 ,  B32B27/04

    CPC classification number: B32B27/12 ,  C03C25/321 ,  C08J5/08 ,  D03D15/0011 ,  H05K1/0366 ,  H05K2201/0166 ,  H05K2201/0239 ,  H05K2201/029

    Abstract: A method a forming a resin compatible fabric (210) includes: (A) forming a fabric with a plurality of fiber strands, wherein at least one of the plurality of fiber strands includes a plurality of fibers and at least one of the plurality of fibers includes an at least partial coating (214) having at least one starch material with at least one hydroxyl group; (B) breaking a bond between a hydrogen atom of a hydroxyl group of a first starch molecule of the at least one starch material with an oxygen atom of a second starch molecule of the at least one starch material to form at least one unreacted hydroxyl group on the first starch molecule; and (C) reacting at least one functional group of a second material with the at least one unreacted hydroxyl group of the at least one starch material to form a grafted starch material after interweaving.

    Abstract translation: 一种形成树脂相容性织物（210）的方法包括：（A）形成具有多根纤维束的织物，其中所述多根纤维束中的至少一个包含多根纤维，并且所述多根纤维中的至少一个纤维 包括至少部分涂层（214），其具有至少一种具有至少一个羟基的淀粉材料; （B）断开至少一种淀粉材料的第一淀粉分子的羟基的氢原子与至少一种淀粉材料的第二淀粉分子的氧原子之间的键，以形成至少一种未反应的羟基 在第一淀粉分子上; 和（C）使至少一种第二材料的官能团与至少一种淀粉材料的至少一种未反应的羟基反应以在交织之后形成接枝淀粉材料。

    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME
    107.
    发明申请
    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME 审中-公开
    隐含的玻璃纤维束和包括它们的产品

    公开(公告)号：WO01012702A1

    公开(公告)日：2001-02-22

    申请号：PCT/US2000/020523

    申请日：2000-07-28

    IPC: C03C25/10 ,  B29B15/10 ,  B29K101/00 ,  C03C25/00 ,  C03C25/48 ,  C04B14/38 ,  C04B20/10 ,  C08J5/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/00

    CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

    Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

    Abstract translation: 本发明提供了一种至少部分涂布的纤维束，其包括在至少一种所述玻璃纤维的表面的至少一部分表面上具有树脂相容性涂料组合物的多种玻璃纤维，所述树脂相容性涂料组合物包含：（a） 多个层状无机颗粒和（b）至少一种聚合物材料。 本发明还提供了一种树脂相容性涂料组合物，其包含（a）由选自不可热膨胀的有机材料，无机聚合材料，不可热膨胀的复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有 平均粒径足以使线条变湿; （b）与所述多个离散颗粒不同的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供了该树脂相容性涂料组合物包含（a）多个中空的，不可热膨胀的有机颗粒; 和（b）至少一种与所述至少一个中空有机颗粒不同的润滑材料。

    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME
    108.
    发明申请
    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME 审中-公开
    侵蚀性玻璃纤维束和包括它们的产品

    公开(公告)号：WO01012701A1

    公开(公告)日：2001-02-22

    申请号：PCT/US2000/020457

    申请日：2000-07-28

    IPC: C03C25/10 ,  B29B15/10 ,  B29K101/00 ,  C03C25/00 ,  C03C25/48 ,  C04B14/38 ,  C04B20/10 ,  C08J5/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/00

    CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

    Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides the use of a resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The resin compatible coating composition can also comprise: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

    Abstract translation: 本发明提供一种至少部分涂布的纤维束，其包括在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物的多种玻璃纤维，所述树脂相容性涂料组合物包含：（a） 多个层状的无机颗粒，其莫氏硬度值不超过所述玻璃纤维的莫氏硬度值; 和（b）至少一种聚合物材料。 本发明还提供了一种树脂相容性涂料组合物的用途，其包括：（a）由选自不可热膨胀的有机材料，无机聚合材料，不可热膨胀的复合材料及其混合物的材料形成的多个离散颗粒， 具有足以允许线条浸湿的平均粒径的颗粒; （b）与所述多个离散颗粒不同的至少一种润滑材料; 和（c）至少一种成膜材料。 树脂相容性涂料组合物还可以包含：（a）多个中空的，不可热膨胀的有机颗粒; 和（b）与所述至少一种中空有机颗粒不同的至少一种润滑材料。

    COMPOSITION FOR A SOLDER MASK, PRODUCT THEREOF AND PROCESS FOR USING SAME
    110.
    发明申请
    COMPOSITION FOR A SOLDER MASK, PRODUCT THEREOF AND PROCESS FOR USING SAME 审中-公开
    用于焊接掩模的组合物，其产品及其使用方法

    公开(公告)号：WO1990012695A1

    公开(公告)日：1990-11-01

    申请号：PCT/US1990002137

    申请日：1990-04-17

    Applicant: AMOCO CORPORATION

    Inventor： AMOCO CORPORATION ,  SALENSKY, George, Anthony ,  THOMAN, Thomas, Steven

    IPC: B44C01/17

    CPC classification number: H05K3/285 ,  C08L71/00 ,  H05K1/095 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2203/0537 ,  H05K2203/0783 ,  Y10S428/901 ,  C08L61/20

    Abstract: This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.

    Abstract translation: 本发明涉及一种用于热塑性基材的焊料掩模组合物。 焊接掩模具有包括聚羟基醚和三聚氰胺甲醛的关键组分。 其他组分包括溶剂，填料和流动控制剂。 任选成分包括着色剂，环氧树脂和酸，以促进组合物的反应。 还可以包括表面活性剂。 焊接面罩为热塑性电路板提供了必要的灵活性和粘附性。 掩模可以直接施加到电路板或转移介质上，以便随后覆盖基板。 它涉及可以是电路板的物品。 它还涉及一种制备这种复合材料的方法，包括处理焊料掩模。

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