公开(公告)号：US09896566B2

公开(公告)日：2018-02-20

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/34 ,  C08K7/10 ,  H05K1/03 ,  C08K3/32 ,  C08K3/40 ,  C08K3/30 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

公开(公告)号：US09869025B2

公开(公告)日：2018-01-16

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Weifeng Miao

IPC: C23C18/38 ,  C01G19/02 ,  C01G31/00 ,  C08K3/22 ,  C09D11/03 ,  C23C18/16 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  C23C18/20 ,  B29C37/00 ,  C23C18/28 ,  C01G19/00 ,  C01G30/00 ,  C01G39/00 ,  B29C35/08

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

公开(公告)号：US20170361584A1

公开(公告)日：2017-12-21

申请号：US15535113

申请日：2015-12-08

Applicant: SABIC Global Technologies B.V.

Inventor： Wei FENG ,  Mahari TJAHJADI ,  Tong WU ,  Yuxian AN

IPC: B32B27/08 ,  C08K3/10 ,  C08K3/32 ,  H05K3/00

CPC classification number: B32B27/08 ,  C08K3/10 ,  C08K3/32 ,  C08K2003/321 ,  H05K1/0373 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107

Abstract: This disclosure relates to materials prepared using a laser-direct structuring (LDS) method. The LDS materials of the present disclosure comprise polymeric film or polymeric sheet structures containing a LDS additive and which can undergo laser-direct structuring and chemical plating to form conductive paths on their surface. The present disclosure finds use, for example, in the automotive, electronics, RFID, communications, and medical device industries.

公开(公告)号：US09706667B2

公开(公告)日：2017-07-11

申请号：US15001140

申请日：2016-01-19

Applicant: SIERRA CIRCUITS, INC.

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/387 ,  H05K3/427 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

公开(公告)号：US09538665B2

公开(公告)日：2017-01-03

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: B05D5/12 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  B05D3/00

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US09451694B2

公开(公告)日：2016-09-20

申请号：US14663447

申请日：2015-03-19

Applicant: IBIS Innotech Inc.

Inventor： Chih-Kung Huang ,  Wei-Jen Lai ,  Wen-Chun Liu

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/03 ,  H05K3/18 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/0373 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L25/04 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/96 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1715 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014

Abstract: A package structure includes a selective-electroplating epoxy compound, a first patterned circuit layer, second patterned circuit layers, metal studs, contact pads and conductive vias. The selective-electroplating epoxy compound includes cavities, a first surface and a second surface. The cavities disposed on the first surface in array arrangement. The selective-electroplating epoxy compound is formed by combining non-conductive metal complex. The metal studs are disposed in the cavities respectively and protruded from the first surface. The first patterned circuit layer is directly disposed on the first surface. The selective-electroplating epoxy compound exposes a top surface of the patterned circuit layer. The top surface is lower than or coplanar with the first surface. The second patterned circuit layers are directly disposed on the second surface. The conductive vias are disposed at the selective-electroplating epoxy compound to electrically connect the second patterned circuit layers to the corresponding metal studs.

Abstract translation: 封装结构包括选择性电镀环氧化合物，第一图案化电路层，第二图案化电路层，金属柱，接触焊盘和导电通孔。 选择性电镀环氧化合物包括空腔，第一表面和第二表面。 排列在第一表面上的空腔。 选择性电镀环氧化合物通过组合非导电金属络合物形成。 金属螺柱分别设置在空腔中并从第一表面突出。 第一图案化电路层直接设置在第一表面上。 选择性电镀环氧化合物暴露图案化电路层的顶表面。 顶面低于或与第一表面共面。 第二图案化电路层直接设置在第二表面上。 导电通孔设置在选择性电镀环氧化合物处，以将第二图案化电路层电连接到相应的金属螺柱。

公开(公告)号：US09380700B2

公开(公告)日：2016-06-28

申请号：US14281631

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/08 ,  H05K3/40 ,  H05K3/18 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US09379490B2

公开(公告)日：2016-06-28

申请号：US14127558

申请日：2012-06-15

Applicant: Dominik Schweizer

Inventor： Dominik Schweizer

IPC: H01R13/6463 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R43/18 ,  H01R43/26 ,  H05K3/18

CPC classification number: H01R13/6463 ,  H01R13/035 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R43/18 ,  H01R43/26 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  Y10T29/49208

Abstract: A plug for an electrical plug-type connector includes a plurality of plug contacts, which are electrically connected or connectable to a corresponding number of connecting elements, for example insulation displacement contacts, clamping contacts or possibly also soldered joints, each for connecting one electrical cable core. Per plug contact, one conductor is formed as a conductor track which is grown three-dimensionally on the surface of a plug body in the form of a cast plastics part and adheres there, and which both forms the plug contact and electrically connects the plug contact to the connecting element.

Abstract translation: 用于电插塞式连接器的插头包括多个插头触点，它们电连接或连接到相应数量的连接元件，例如绝缘位移触头，夹紧触点或可能还有焊接接头，每个用于连接一个电缆 核心。 每个插塞接触，一个导体形成为导体轨道，该导体轨迹在铸塑件的形式的塞体的表面上三维地生长并粘附在那里，并且两者形成插头接触并电连接插头接触 连接元件。

公开(公告)号：US20160128188A1

公开(公告)日：2016-05-05

申请号：US14895143

申请日：2014-09-22

Applicant: LG CHEM, LTD.

Inventor： Shin Hee JUN ,  Chee-Sung PARK ,  Jae Hyun KIM ,  Sang Yun JUNG ,  Cheol-Hee PARK

IPC: H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K1/092 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08K3/22 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a R 3m or P63/mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.

Abstract translation: 本发明涉及一种形成导电图案的组合物，其能够形成精细的导电图案，其减少机械物理性能的劣化并且对各种聚合树脂产品或树脂层具有优异的粘附强度，形成导电性的方法 使用其的图案，以及具有导电图案的树脂结构。 用于形成导电图案的组合物包括聚合物树脂; 以及具有晶体结构中的R 3m或P63 / mmc空间群的第一金属元素和第二金属元素的非导电性金属化合物粒子，其粒径为0.1〜20μm，其中金属核包括第一金属元素 金属或第二金属元素或其离子通过电磁辐射由非导电金属化合物颗粒形成。

公开(公告)号：US20150334836A1

公开(公告)日：2015-11-19

申请号：US14281802

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/09

CPC classification number: H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

Abstract translation: 印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。 图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。