公开(公告)号：EP2559022B1

公开(公告)日：2013-09-04

申请号：EP11730436.0

申请日：2011-04-11

Applicant: Koninklijke Philips Electronics N.V.

Inventor： VAN HERPEN, Maarten Marinus Johannes Wilhelmus ,  JOCHIJMS, Paul Antonius Emil ,  WILLEMSEN, Oscar Hendrikus

IPC: G09F13/22 ,  G09F9/33 ,  G09F21/02

CPC classification number: G09F13/22 ,  G09F9/33 ,  G09F21/02 ,  G09F2021/023 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281

公开(公告)号：EP2441130A1

公开(公告)日：2012-04-18

申请号：EP09845680.9

申请日：2009-06-08

Applicant: Tex-Ray Industrial Co., Ltd. ,  King's Metal Fiber Technologies Co., Ltd.

Inventor： LEE, James ,  HUANG, Hong Hsu

IPC: H01R12/24 ,  G06F3/01 ,  H05K1/00 ,  G01L1/14

CPC classification number: G06F3/044 ,  G01D5/2405 ,  G06F2203/04111 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151

Abstract: A fabric connector for sensing object proximity is provided. The fabric connector comprises a sensing layer (23), an insulating layer (22) and a yarn (26). The sensing layer has at least one connection region (233a, 233b, 233c, 233d) and a disconnection region. The at least one connection region (233a, 233b, 233c, 233d) has a capacitance value and is formed with conductive fabric. The insulation layer (22) which is formed with insulating fabric is disposed below the sensing layer (23). The yarn (26) is formed with conductive material and is configured to electrically connect to the at least one connection region (233a, 233b, 233c, 233d) of the sensing layer (23) and a sensor (25). The sensor (25) senses a variation in the capacitance value of the at least one connection region (233a, 233b, 233c, 233d) in accordance with object proximity.

公开(公告)号：EP2030491B9

公开(公告)日：2012-02-22

申请号：EP07764352.6

申请日：2007-06-04

Applicant: Future-Shape GmbH

Inventor： LAUTERBACH, Christl ,  STEINHAGE, Axel

IPC: H01K1/00 ,  H03K17/96

CPC classification number: H03K17/962 ,  H03K2017/9602 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K1/0263 ,  H05K1/038 ,  H05K3/0058 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10727

Abstract: A textile layer arrangement has a first textile layer (1) and a second textile layer (13), wherein the second textile layer is formed on or above the first textile layer. The textile layer arrangement also has at least one electronic component (3) which is formed between the first textile layer and the second textile layer. The textile layer arrangement further has at least one power line (8), which is formed in at least one boundary region of the textile layer arrangement, for providing electrical power. The textile layer arrangement also has at least one supply line (7), which at least one supply line electrically couples the at least one electronic component to the at least one power line. The at least one power line is arranged at a distance from the at least one electronic component, and the at least one supply line is arranged at an angle with respect to the at least one power line.

公开(公告)号：EP2416840A1

公开(公告)日：2012-02-15

申请号：EP09792071.4

申请日：2009-08-28

Applicant: National Ict Australia Limited (NICTA)

Inventor： ROBINSON, David

IPC: A61N1/05 ,  A61N1/36 ,  A61N1/372

CPC classification number: A61N1/375 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.

公开(公告)号：EP2107642A3

公开(公告)日：2011-04-20

申请号：EP09004942.0

申请日：2009-04-03

Applicant: Amphenol-Tuchel Electronics GmbH

Inventor： Schewe, Eckhard ,  Ellsäßer, Uwe

IPC: H01R4/06

CPC classification number: H01R4/06 ,  H01R4/242 ,  H01R4/2495 ,  H01R4/58 ,  H01R12/62 ,  H01R12/675 ,  H01R12/68 ,  H05K1/00 ,  H05K1/038 ,  H05K3/365 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10598 ,  H05K2203/1189

Abstract: Die Erfindung betrifft eine Verbindungsanordnung umfassend mindestens ein erstes flexibles und leitfähiges Halbzeug, wobei das leitfähige textile Halbzeug über gewellt angeordnete paarweise beabstandete Leitfäden in dem textilen Halbzeug verfügt, sowie mindestens ein Durchdringanpresselement zur Verbindung des ersten flexiblen leitfähigen Halbzeuges mit einem zweiten textilen leitfähigen Halbzeug oder einer Leiterplatte, wobei mindestens ein Durchdringanpresselement als mechanisches und gleichzeitig auch elektrisches Verbindungselement vorgesehen ist, zum mechanischen und elektrischen Verbinden der Leitfäden des ersten flexiblen und leitfähigen textilen Halbzeuges mit dem zweiten textilen leitfähigen Halbzeug oder der Leiterplatte.

公开(公告)号：EP2231803A1

公开(公告)日：2010-09-29

申请号：EP08861688.3

申请日：2008-12-04

Applicant: 3M Innovative Properties Company

Inventor： KROPP, Michael A., ,  ZENNER, Robert L.D.,

IPC: C09J9/02 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08K3/36 ,  C08K9/02 ,  C08L2666/54 ,  C09J4/00 ,  C09J9/02 ,  C09J163/00 ,  H05K2201/0281 ,  Y10T428/31515

Abstract: A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.

公开(公告)号：EP2168748A1

公开(公告)日：2010-03-31

申请号：EP08165108.5

申请日：2008-09-25

Applicant: Hella Lighting Finland Oy

Inventor： Yllikäinen, Sami

IPC: B29C45/00 ,  B29C45/16 ,  F21V15/01 ,  F21V23/06 ,  F21V31/00 ,  H01R4/04

CPC classification number: H05K3/101 ,  B29C45/0013 ,  B29C45/0062 ,  B29C45/1643 ,  B29C45/1671 ,  B29C2045/1673 ,  B29K2995/0005 ,  B29L2031/747 ,  F21V15/01 ,  F21V31/04 ,  H05K1/0203 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113

Abstract: The invention relates to a watertight lamp comprising a housing (7), a lens (8) attached watertight to the housing, an electric component unit (9) comprising a light source (21), and an outer connector (6) for connecting a power supply to the lamp. In order that the manufacturing method thereof be simple and quick, the outer connector (6) comprises conductive parts (4, 5) of electro conductive compound (30) comprising a polymer, said conductive parts providing an electro conductive path to the electric component unit (9, 9', 9"). The invention relates also to a manufacturing method of a watertight lamp. In the method the housing, the lens, electro conductive parts and the sealing are produced by injection moulding into the same mould.

Abstract translation: 本发明涉及一种水密灯，包括壳体（7），水密地附接到壳体的透镜（8），包括光源（21）的电气部件单元（9）和用于连接 电源给灯。 为了使其制造方法简单快捷，外部连接器（6）包括由聚合物构成的导电化合物（30）的导电部分（4,5），所述导电部件提供到电气部件单元的导电路径 （9,9'，9“）本发明还涉及一种防水灯的制造方法，在该方法中，通过注塑成型到同一模具中制造外壳，透镜，导电部件和密封件。

公开(公告)号：EP1911090A2

公开(公告)日：2008-04-16

申请号：EP06800678.2

申请日：2006-07-28

Applicant: FOSTER MILLER, INC.

Inventor： FARRELL, Brian ,  GANNON, John, J., Jr. ,  CAMPBELL, Thomas, G. ,  COPPOLA, Pat, Anhtony ,  O'REILLY, Sean, Gerald ,  BURKE, Joseph, F.

IPC: H01L23/02

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.

公开(公告)号：EP1891254A2

公开(公告)日：2008-02-27

申请号：EP06756026.8

申请日：2006-05-30

Applicant: Koninklijke Philips Electronics N.V.

Inventor： VAN BRUGGEN, Michel, Philips Intel. Property ,  KRANS, Martijn, Philips Intel. Prop. & Standards ,  ASVADI, Sima, Philips Intel. Prop. & Standards ,  WILDERBEEK, Johannes, Philips Intel. Property

IPC: D03D11/00 ,  A41D13/00

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/00 ,  D10B2401/16 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029

Abstract: A textile is formed from interwoven electrically conductive and non- conductive yarns to provide an array of connection points on one or both surfaces of the textile, facilitating the connection of electronic components to the surface of the textile, in an array. The textile comprises a multi-layer warp having electrically conductive and non-conductive yarns and a weft having electrically conductive and non-conductive yarns. At least some of the electrically conductive weft yarns cross selected electrically conductive warp yarns without electrical contact therebetween by being separated from the electrically conductive warp yarns by at least one non-conductive warp yarn in each layer of the multi-layer warp. Loops formed by the electrically conductive weft yarns provide electrical connection points together with proximal portions of electrically conductive warp yarns.

公开(公告)号：EP1862040A2

公开(公告)日：2007-12-05

申请号：EP06738633.4

申请日：2006-03-15

Applicant: C-Core Technologies Inc.

Inventor： VASOYA, Kalu, K.

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

Abstract: Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring 'boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.