公开(公告)号：EP3046510A1

公开(公告)日：2016-07-27

申请号：EP14846564.4

申请日：2014-09-12

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： TAI, Yu-Chong ,  CHANG, Han-Chieh

IPC: A61F2/14 ,  A61N1/05 ,  H01B7/08

CPC classification number: H05K1/189 ,  A61N1/0543 ,  A61N1/36046 ,  H05K3/064 ,  H05K2201/0154 ,  H05K2201/052 ,  H05K2201/1003 ,  H05K2201/10151

Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.

Abstract translation: 描述了一种生物相容的微型制造的带状电缆，其中至少一组导体横向分散成通过带状电缆形成孔的旁路翼。 旁路翼片通过孔折线并且在带状电缆的中心部分上折叠，导致带状电缆具有窄的堆叠区域。 狭窄的区域可以穿过膜中的小切口，例如通过眼球巩膜中的切口。 带状电缆可以具有整体形成的电极阵列，用于附接到眼球的视网膜和用于向电极阵列发送信号的其他电子装置。

公开(公告)号：EP2891960A4

公开(公告)日：2015-09-02

申请号：EP13840508

申请日：2013-05-17

Applicant: SHARP KK

Inventor： KIDA KAZUTOSHI ,  HAYASHI SHOGO

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/047 ,  G06F3/0418 ,  G06F3/044 ,  G09G5/003 ,  G09G2300/0426 ,  H05K2201/052 ,  H05K2201/09781 ,  H05K2201/10128

公开(公告)号：EP2600701A4

公开(公告)日：2015-05-06

申请号：EP10854247

申请日：2010-12-07

Applicant: NIPPON MEKTRON KK

Inventor： MATSUDA FUMIHIKO

IPC: H05K3/00 ,  H05K1/02

CPC classification number: H05K1/11 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/118 ,  H05K1/142 ,  H05K3/0097 ,  H05K3/36 ,  H05K3/361 ,  H05K2201/052

公开(公告)号：EP2334157A2

公开(公告)日：2011-06-15

申请号：EP10015380.8

申请日：2010-12-07

Applicant: Hosiden Corporation

Inventor： Shinoda, Koji ,  Nakagawa, Hiroshi

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2203/0195 ,  H05K2203/1572 ,  H05K2203/166 ,  H05K2203/167

Abstract: A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).

Abstract translation: 多个突出基板部分（12）从沿着布线基板（10）的周缘彼此间隔开的位置延伸。 每个突出基板部分（12）设置有电连接到设置在电气仪器基板上的多个电极端子中的布线端子（15），（16）。 在布线基板（10）中的突出基板部分（12）之间的周边边缘（13a）中形成切口部分（18）。

公开(公告)号：EP1938673A1

公开(公告)日：2008-07-02

申请号：EP06809455.6

申请日：2006-09-29

Applicant: NXP B.V.

Inventor： JOHNSON, Mark, T. ,  SEMPEL, Adrianus ,  WIDDERSHOVEN, Franciscus, P.

IPC: H05K1/00 ,  H05K1/18

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/052 ,  H05K2201/055

Abstract: A method for fabricating an electronic device or circuit, respectively, comprises providing a flexible substrate (1), defining onto the flexible substrate (1) electric components (2, 3, 3’, 3’’, 3’’’, 7, 11, 12) and interconnects (8), introducing out breaks (4, 4’, 4’’, 4a-4s) in the flexible substrate (1) between the electric components and/or interconnects, and forming the flexible substrate (1) into a deformed configuration by deforming, particularly folding, parts of the flexible substrate as determined by the breaks (4, 4’, 4’’, 4a-4s).

公开(公告)号：EP1039788A3

公开(公告)日：2002-02-27

申请号：EP00302338.9

申请日：2000-03-22

Applicant: SEIKO EPSON CORPORATION

Inventor： Endo, Kogo ,  Oishi, Eiji ,  Aruga, Yasuhito

IPC: H05K3/36 ,  H05K1/11 ,  G02F1/13

CPC classification number: H05K3/361 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/052 ,  H05K2201/10136

Abstract: The invention provides an electro-optical device capable of simplifying a terminal connecting process and increasing the ratio of a display area. Connection terminals connected to a scanning driver IC chip 32 are arranged on a short side of a wiring connection area 25A of a second substrate 25 in a liquid crystal display panel 21, and the connection terminals and connection terminals arranged on a long side of a wiring connection area 24A of a first substrate 24 are connected from the same direction with a single flexible printed wiring board 22. For this reason, convenience of the flexible printed wiring board 22 can be improved. In addition, it is possible to reduce the projection size of the wiring connection area of the first substrate 24, and the ratio of the display area in the whole liquid crystal panel 21 can be increased.

Abstract translation: 本发明提供一种能够简化终端连接处理并增加显示区域的比率的电光装置。 连接到扫描驱动器IC芯片32的连接端子布置在液晶显示面板21中的第二基板25的布线连接区域25A的短边上，并且布置在布线的长边上的连接端子和连接端子 第一基板24的连接区域24A与单个柔性印刷布线板22从相同方向连接。由此，可以提高柔性印刷布线板22的便利性。 此外，可以减小第一基板24的布线连接区域的突出尺寸，并且可以增加整个液晶面板21中的显示区域的比率。

公开(公告)号：EP0555407A1

公开(公告)日：1993-08-18

申请号：EP92902056.0

申请日：1991-10-29

Applicant: HARRIS CORPORATION

Inventor： SALATINO, Matthew, M.

IPC: H01L23 ,  H05K1 ,  H05K7 ,  H05K3

CPC classification number: H05K7/20509 ,  H01L2924/1627 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3421 ,  H05K7/023 ,  H05K2201/042 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009

Abstract: Un boîtier à superposition destiné à une pluralité de dispositifs à circuits intégrés (76) utilise une plaquette (61) en matière d'interconnexion souple pliée en un agencement à plusieurs couches de doigts parallèles en forme de plaquettes (61) sur lesquels une pluralité de dispositifs à circuits intégrés sont montés en surface. Les fils (71, 73) des dispositifs à circuits intégrés (76) sont fixés à des liaisons d'interconnexion (81, 83) de la plaquette d'interconnexion souple (61). Une pluralité de plaques de dissipation thermique (115) sont intercalées avec les doigts pliés en forme de plaquette (61) de la superposition, de manière à venir au contact des dispositifs à circuits intégrés (76) montés sur les doigts en forme de plaquette (61). Les plaques de dissipation thermique (115) sont retenues par des blocs d'espacement thermoconducteur (131, 133) le long de leurs bords. Les blocs d'espacement (131, 133) sont serrés ensemble en une structure stratifiée compacte, de manière à former un support rigide soulageant les contraintes mécaniques au niveau des plis des doigts en forme de plaquettes (61).

公开(公告)号：US20190229449A1

公开(公告)日：2019-07-25

申请号：US16371708

申请日：2019-04-01

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H05K1/02 ,  B60J5/04 ,  H01B7/04 ,  B60R16/02 ,  H01B7/00 ,  H01R43/20

CPC classification number: H01R12/592 ,  B60J5/0413 ,  B60R16/0215 ,  B60Y2410/115 ,  H01B7/0045 ,  H01B7/04 ,  H01B7/08 ,  H01B7/421 ,  H01B13/01254 ,  H01R12/69 ,  H01R43/205 ,  H01R2201/26 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US20180287705A1

公开(公告)日：2018-10-04

申请号：US15475082

申请日：2017-03-30

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Yi WANG ,  Kevin LIU

IPC: H04B10/40 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  G02B6/42

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/12009 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4262 ,  G02B6/4281 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.

公开(公告)号：US09686867B2

公开(公告)日：2017-06-20

申请号：US13723364

申请日：2012-12-21

Applicant: Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

Inventor： Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

IPC: H05K1/18 ,  H05K3/06 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/0005 ,  H05K3/0052 ,  H05K3/06 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/1453 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as a polymer. The circuit pattern may be generated by etching or applying (e.g. sputtering) a copper foil layer onto the substrate. Circuit components and actuators may then be added at specified locations. The flat substrate may then be folded along the predefined locations to form the final machine. The machine may operate autonomously to perform a task.