公开(公告)号：US20060205113A1

公开(公告)日：2006-09-14

申请号：US11079143

申请日：2005-03-14

Applicant: Robert Oberle

Inventor： Robert Oberle

IPC: H01L21/50

CPC classification number: H01L23/3164 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2924/0102 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/10628 ,  H05K2203/1311 ,  Y02P80/30 ,  H01L2924/00

Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract translation: 构造RFID单元的方法可以包括使用保护层来将导电粘合剂尚未完全设定的状态下将集成电路芯片模块保持在具有天线单元的基板层上。

公开(公告)号：US06462955B1

公开(公告)日：2002-10-08

申请号：US09395006

申请日：1999-09-13

Applicant: Jonathan F. Roberts

Inventor： Jonathan F. Roberts

IPC: H05K710

CPC classification number: H05K3/303 ,  H05K1/189 ,  H05K3/301 ,  H05K3/3421 ,  H05K13/0465 ,  H05K13/0482 ,  H05K2201/0394 ,  H05K2201/10393 ,  H05K2201/10628 ,  H05K2203/0173 ,  H05K2203/167 ,  Y02P70/613

Abstract: A component alignment casing system for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component which has a plurality of exposed leads, a prepared component which has a plurality of exposed traces, an alignment base onto which the prepared component and the surface mountable component are laid, and a compressive cover that attaches to said alignment base. The alignment base has a plurality of alignment ribs to isolate and align the exposed traces of the prepared component. The prepared component and surface mountable components are electrically connected and attached together, preferably by soldering. The method comprises laying the prepared component on the alignment base and ribs, and overlaying the surface mountable component, with its exposed leads, on to the alignment base and the prepared component, and electrically connecting the components together, preferably by soldering, to the alignment base. The cover is then snapped on, and supplies compressive force to assure good contact between the leads of the surface mountable component and the traces of the prepared component.

Abstract translation: 公开了一种用于连接电路的部件对准壳体系统，以及用于制造或组装部件对准套管系统的方法。 该系统具有至少一个可表面安装的部件，其具有多个暴露引线，具有多个暴露迹线的准备部件，放置准备的部件和可表面安装的部件的对准基座以及附接的压缩盖 到所述对准基座。 对准基座具有多个对准肋以隔离并对准所制备的部件的暴露痕迹。 所制备的组件和表面可安装部件优选通过焊接电连接并附接在一起。 该方法包括将准备的部件放置在对准基座和肋上，并将表面安装部件与其暴露的引线重叠在对准基座和准备的部件上，并将部件优选地通过焊接电连接到对准 基础。 然后盖上盖子，并提供压缩力以确保表面可安装部件的引线与准备的部件的迹线之间的良好接触。

公开(公告)号：US5373276A

公开(公告)日：1994-12-13

申请号：US38303

申请日：1993-03-29

Applicant: Anthony J. Suppelsa ,  Fadia Nounou ,  Anthony B. Suppelsa

Inventor： Anthony J. Suppelsa ,  Fadia Nounou ,  Anthony B. Suppelsa

IPC: H01F27/29 ,  H05K3/34 ,  H01F15/02 ,  H01F15/10

CPC classification number: H01F27/292 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10628 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613

Abstract: A self centering coil (200) includes a coil section (202) and also having curved end section (206) and (204) at opposite sides of the coil section (202). The curved end sections are preferably substantially flat and in a plane which is parallel to the center axis (306) of the coiled section (202).

Abstract translation: 自对中线圈（200）包括线圈部分（202），并且在线圈部分（202）的相对侧上还具有弯曲端部部分（206）和（204）。 弯曲的端部部分优选地基本上是平的并且在平行于盘绕部分（202）的中心轴线（306）的平面内。

公开(公告)号：US4864471A

公开(公告)日：1989-09-05

申请号：US904636

申请日：1986-09-08

Applicant: Hans Hargasser ,  Joachim Dathe

Inventor： Hans Hargasser ,  Joachim Dathe

IPC: H01L21/52 ,  H01L21/58 ,  H05K3/30

CPC classification number: H05K3/305 ,  H01L2224/83138 ,  H01L2924/10158 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0191 ,  Y02P70/613 ,  Y10S29/039 ,  Y10T29/4913

Abstract: A component for surface mounting is fixed by means of adhesive to a surface of a member. For improving the adhesion, the fixable surface of the component includes a structure which makes it possible, first, for this fixable surface to lie flush against the surface of the member. Second, the structure of the fixable surface also makes it possible for a quantity of adhesive adequate for fixing to remain between the fixable surface of the component and the surface of the member.

Abstract translation: 用于表面安装的部件通过粘合剂固定到部件的表面。 为了改善附着力，组件的可固定表面包括使得可以首先使该固定表面与构件的表面齐平的结构。 第二，可固定表面的结构也使得一定量的用于固定的粘合剂可以保留在构件的可固定表面和构件的表面之间。

公开(公告)号：US4860433A

公开(公告)日：1989-08-29

申请号：US84332

申请日：1987-08-11

Applicant: Norio Miura

Inventor： Norio Miura

IPC: H01F27/29 ,  H01F41/10 ,  H05K3/32

CPC classification number: H05K3/328 ,  H01F27/292 ,  H01F41/10 ,  H01L2224/78301 ,  H01L2924/19107 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285 ,  Y10T29/49071 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49179

Abstract: An inductance element comprises conductive paths of copper and a spool member arranged on a substrate, and insulated winding formed by a fine copper wire whose surface is coated with an insulating film of urethane etc. is wound around the spool member so that both end portions thereof are subjected to ultrasonic vibration by an ultrasonic bonding apparatus to be connected to the conductive paths by ultrasonic bonding. Thus, the end portions of the winding can be processed by local heating with application of ultrasonic vibration, whereby the coil needs not be entirely heated and an inductance element can be readily implemented directly on the substrate.

Abstract translation: 电感元件包括铜的导电路径和布置在基板上的卷轴构件，由表面涂覆有聚氨酯等的绝缘膜的细铜线形成的绝缘绕组缠绕在卷轴构件上，使得其两端部 通过超声波接合装置进行超声波振动，通过超声波接合与导电路径连接。 因此，可以通过施加超声波振动的局部加热来加工绕组的端部，由此不需要完全加热线圈，并且可以容易地在基板上实现电感元件。

公开(公告)号：EP3330832A1

公开(公告)日：2018-06-06

申请号：EP17190409.7

申请日：2017-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kim, Hyung Dal ,  Kwon, Oh Hyuck ,  Kang, Han Vit ,  Kim, Jun Young ,  Kim, Moon Kyeong ,  Kim, Sang Seob ,  Park, Jung Sik ,  Jung, Hee Seok ,  Cho, Sung ,  Shin, Heung Sik ,  Oh, Ji Woong

IPC: G06F1/16 ,  G06K9/00 ,  H05K1/02 ,  G02F1/1333 ,  H05K1/14

CPC classification number: H05K3/363 ,  A61B5/1172 ,  G02F1/1333 ,  G02F1/13338 ,  G02F1/13452 ,  G06F1/1637 ,  G06K9/00013 ,  G06K9/0004 ,  H04M1/0277 ,  H04M2250/16 ,  H05K1/028 ,  H05K1/147 ,  H05K1/188 ,  H05K1/189 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/056 ,  H05K2201/099 ,  H05K2201/10128 ,  H05K2201/10628

Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.

公开(公告)号：EP3183947A1

公开(公告)日：2017-06-28

申请号：EP16732762.6

申请日：2016-06-16

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： SIMPSON, Reginald ,  NEHRING, Ronald ,  ROUABHI, Mokhtar

IPC: H05K3/32 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0203 ,  H01L23/66 ,  H01L2223/6644 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

Abstract translation: 公开了功率放大器组件和部件。 根据一些实施例，提供了一种功率放大器组件（10），其包括功率放大器（12），该功率放大器具有带有栅极接触表面的栅极引线（14），具有漏极接触表面的漏极引线（13） 表面（15）具有长度和宽度。 延伸的散热块（11）抵靠源接触表面安装以将热量从表面传导（18）并且延伸源的电路径。 延长的散热块的长度至少大于源接触表面的长度。

公开(公告)号：EP2919243A4

公开(公告)日：2016-08-10

申请号：EP13852402

申请日：2013-11-11

Applicant: KITAGAWA IND CO LTD

Inventor： NAKAMURA TATSUYA

IPC: H01G2/06 ,  H01G2/04 ,  H01G2/10 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H05K1/18

CPC classification number: H01G2/106 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H05K1/184 ,  H05K2201/10015 ,  H05K2201/10628

公开(公告)号：EP2919243A1

公开(公告)日：2015-09-16

申请号：EP13852402.0

申请日：2013-11-11

Applicant: Kitagawa Industries Co., Ltd.

Inventor： NAKAMURA, Tatsuya

IPC: H01G2/04 ,  H01G2/02

CPC classification number: H01G2/106 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H05K1/184 ,  H05K2201/10015 ,  H05K2201/10628

Abstract: A capacitor holder includes: a cylindrical portion made of a resin having a cylindrical shape and externally fitted to a capacitor; a pair of protrusions formed integrally with the cylindrical portion, the protrusions protruding in an outward direction of the cylindrical portion from positions opposed to each other with respect to an axis of the cylindrical portion; and a pair of metal pins protruding along the axis from axial end surfaces of the paired protrusions, the metal pins configured to solder the cylindrical portion and the protrusions to a printed circuit board. In the capacitor holder, a distance between the axis and outer circumferences of the protrusions is less than 0.76 times of an inner diameter of the cylindrical portion.

Abstract translation: 电容器支架包括：圆柱形部分，其由具有圆柱形状的树脂制成并外部安装到电容器; 与所述圆筒部一体地形成的一对突起，所述突起从所述圆筒部的轴线相对的位置向所述圆筒部的向外方向突出; 以及一对金属销，其沿着轴线从所述成对突起的轴向端面突出，所述金属销被配置为将所述圆柱形部分和所述突起焊接到印刷电路板。 在电容器支架中，突起之间的距离和外周之间的距离小于圆柱形部分的内径的0.76倍。

公开(公告)号：EP2306796A1

公开(公告)日：2011-04-06

申请号：EP09172201.7

申请日：2009-10-05

Applicant: ABB Research Ltd.

Inventor： Chunlei, Liu ,  Kicin, Slavo ,  Schulz, Nicola

IPC: H05K3/32

CPC classification number: H05K3/321 ,  H01L23/4951 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/2732 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/29139 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/45124 ,  H01L2224/73263 ,  H01L2224/83091 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/8384 ,  H01L2224/84091 ,  H01L2224/84095 ,  H01L2224/84207 ,  H01L2224/8484 ,  H01L2224/9221 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/1034 ,  H05K2201/10628 ,  H05K2203/0285 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84

Abstract: The invention relates to a method of joining at least two components (12, 16, 36) of an electrical circuit module (30) for establishing a mechanical and electrical interconnection between the components (12, 16, 36), wherein the joining is realized by a sintering process for sintering a metal joint (26, 34) between the components (12, 16, 36) and wherein ultrasonic vibration energy is supplied at least temporarily during the sintering process for supporting said sintering process.
The invention further relates to a corresponding composite (10) comprising at least two components (12, 16, 36) of an electrical circuit module (30) and a corresponding electrical circuit module (30).

Abstract translation: 本发明涉及一种用于建立部件（12，16，36）之间的机械和电互连连接的电路模块（30）的至少两个部件（12，16，36），worin接合的方法实现 通过用于烧结部件（12，16，36）和worin超声波振动能量之间的金属接头（26,34）的烧结过程中用于支撑所述烧结过程在烧结过程被供给至少暂时。 本发明还涉及一种相应的复合物（10），包括电路模块（30）和一个对应的电电路模块（30）的至少两个部件（12，16，36）。