Abstract:
ZnO 계 박막 트랜지스터의 제조방법에 관해 개시된다. ZnO 계 박막 트랜지스터는 채널 층의 산소함량에 매우 민감한 특성 변화를 보인다. 바텀 게이트 방식의 박막 트랜지스터의 제조에서 불가피한 채널 층의 손상과 이에 따른 깊은 음의 문턱 전압을 보상시키기 위하여 불안정한 상태의 산소를 다량 함유하는 저온 패시베이션 층이나 식각 저지층 등의 산화물 층을 이용하여 열처리(annealing)시 산화물 층과 채널 층과의 계면 반응에 의해 캐리어의 농도를 감소시킨다.
Abstract:
PURPOSE: An organic photoelectric device and an image sensor are provided to implement a high integration by efficiently absorbing light of a green wavelength range. CONSTITUTION: An anode faces a cathode. An active layer is located between the anode and the cathode. The active layer includes a quinacridone derivative and a thiophene derivative. The thiophene derivative includes a cyanovinyl group.
Abstract:
PURPOSE: An organic pixel including organic photodiode, a manufacturing method thereof, and an apparatuses including the same are provided to respectively operate charge accumulation and charge transmission according to the voltage of a transmission control signal. CONSTITUTION: An interconnection layer(30) is formed on a semiconductor substrate(20). The interconnection layer includes a first contact(31a), a first electrode(35), and a metal line(37). The first electrode receives a transmission control signal(TG) through the metal line. An organic photodiode(40) is formed on the interconnection layer. The organic photodiode includes an insulating layer(41), a second electrode(49), and a photoelectric conversion region(43). The photoelectric conversion region includes an electron donation organic material and an electron acceptation organic material.
Abstract:
PURPOSE: A composition for forming an oxide semiconductor, an inkjet printing process using the same, and an electronic device including the oxide semiconductor thin film are provided to obtain an oxide semiconductor without defects through an inkjet printing process by using a composition containing a fixed quantity of sol stabilizer. CONSTITUTION: A gate electrode(20) and a gate insulation layer(21) covering the gate electrode are formed on a substrate(10). A channel layer(22) corresponding to the gate electrode is formed on the gate insulation layer. A source electrode(24a) and a drain electrode(24b) are formed on both sides of the channel layer. An etch stopper is formed between the source electrode and the drain electrode. The gate electrode controls the current flow between the source electrode and the drain electrode.
Abstract:
게이트 전극, 상기 게이트 전극과 중첩하며 제1 금속 산화물을 포함하는 반도체, 상기 게이트 전극과 상기 반도체 사이에 위치하며 제2 금속 산화물을 포함하는 게이트 절연막, 그리고 상기 반도체와 전기적으로 연결되어 있는 소스 전극 및 드레인 전극을 포함하고, 상기 제1 금속 산화물 및 상기 제2 금속 산화물은 하나 이상의 금속을 공통적으로 포함하는 박막 트랜지스터 및 그 제조 방법과 상기 박막 트랜지스터를 포함하는 표시 장치를 제공한다.
Abstract:
An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode, and a method for preparing an oxide semiconductor thin film transistor by using the etchant are provided to prevent the back etching of an oxide semiconductor and the dissolution of an oxide semiconductor and to improve etching rate. An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode comprises hydrogen peroxide, ammonium hydroxide, and water. A manufacturing method of an oxide semiconductor thin film transistor comprises the steps of forming a gate on a substrate(110), and forming a gate insulating layer(114) on the substrate so as to cover the gate; forming a channel layer(116) comprising an oxide semiconductor on the gate insulating layer; and forming a metal layer for the formation of a source and a drain electrode at on both surfaces of the channel layer, and pattering it by using the etchant to form a source and drain electrodes(118a,118b).
Abstract:
A plasma processing apparatus having linear antennas is provided to improve density uniformity of plasma by changing a thickness of a dielectric for surrounding the linear antenna. A plasma processing apparatus having linear antennas includes a reaction chamber(110), a substrate supporting plate(120), linear antennas(132), an RF power source(138), and a dielectric(142). The substrate supporting plate is installed in a lower side of the inside of the reaction chamber in order to support a substrate to be processed. The linear antennas are used for inducing electric field to generate electric field. The linear antennas are installed in parallel to each other at an upper side of the inside of the reaction chamber. The RF power source is connected to the linear antennas in order to supply RF power to the linear antennas. The dielectric is formed to surround each of the linear antennas. The thickness of the dielectric is gradually reduced from a RF power input terminal of each linear antenna to a grounding terminal(132b).
Abstract:
A method for manufacturing an oxide semiconductor thin film transistor is provided to improve stability and reliability of the semiconductor thin film transistor by using an oxide semiconductor made of a channel material. A gate insulating layer(114) is formed on a substrate with a gate(112). A channel layer(116) made of the oxide semiconductor is formed on a gate insulating layer. A source electrode(118a) and a drain electrode(118b) are formed in both sides of the channel layer. The plasma process is performed to supply the oxygen to the channel layer. The protection layer covering the source and drain electrodes, and the channel layer is formed. After forming the protection layer, the thermal process is performed.
Abstract:
A polycrystalline silicon thin film and a method of thin film transistor applying the same are provided to obtain medium quality of a poly-crystal silicon and a amorphous silicon in order to be used in a high quality electronic product. A silicon thin film(20) is formed with high density plasma chemical vapor deposition having plasma density more than 2.00E+11cm-3 on a substrate(10). Hydrogen gas is included to reaction gas. The gas forming the silicon thin film comprises one selected from the group of Ar and He. A polycrystalline silicon thin film and a method of thin film transistor applying the same comprises a step for forming a channel region and active layer having a source region and a drain region of the both sides of the channel regions.