公开(公告)号：DE102005062344B4

公开(公告)日：2010-08-19

申请号：DE102005062344

申请日：2005-12-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN ,  ENGL MARIO

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/66

公开(公告)号：DE102009019371A1

公开(公告)日：2009-12-03

申请号：DE102009019371

申请日：2009-04-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  WIETSCHORKE HELMUT

IPC: G01R33/09 ,  H01L43/08

公开(公告)号：DE102008051464A1

公开(公告)日：2009-05-20

申请号：DE102008051464

申请日：2008-10-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  KOLLER ADOLF

IPC: H01L23/50 ,  H01L21/60

公开(公告)号：DE102007007142B4

公开(公告)日：2008-11-13

申请号：DE102007007142

申请日：2007-02-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KOLLER ADOLF ,  THEUSS HORST ,  OTREMBA RALF ,  HOEGLAUER JOSEF ,  STRACK HELMUT ,  PLOSS REINHARD

IPC: H01L21/50 ,  H01L25/07

Abstract: A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components.

公开(公告)号：DE102006028718B4

公开(公告)日：2008-11-13

申请号：DE102006028718

申请日：2006-06-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PRESSEL KLAUS ,  KOLLER ADOLF ,  THEUSS HORST

IPC: H01L21/301

公开(公告)号：DE102006056361A1

公开(公告)日：2008-06-05

申请号：DE102006056361

申请日：2006-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L23/48 ,  H01L21/60

Abstract: The invention relates to a module having a carrier element with electrical contact elements and a component applied to the carrier element with electrical connections on the side remote from the carrier element. The electrical connections of the component are electrically connected to contact elements of the carrier element via polymer-containing connecting elements.

公开(公告)号：DE102006045900A1

公开(公告)日：2008-03-13

申请号：DE102006045900

申请日：2006-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L23/04 ,  B81B1/00 ,  B81B7/04 ,  B81C1/00 ,  G01P15/08

Abstract: The method involves arranging a sensor (3a,3b,3c) with a sensing area (4a,4b,4c) on a support (6) and the sensing area represents the support. The material is applied to the sensor and support is removed from the sensing area. The sensor is integrated in a semiconductor chip (5a,5b,5c). The support is formed from the other material. Independent claims are also included for the following: (1) sensor module has a sensor with a sensing area on its main surface (2) array from sensor module consists of a support.

公开(公告)号：DE102006025960A1

公开(公告)日：2008-01-17

申请号：DE102006025960

申请日：2006-06-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST

IPC: H01L21/60 ,  H01L21/288 ,  H01L21/50 ,  H01L21/58

Abstract: A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated chip, wherein the active faces of the chips face one another, includes: forming metallic contact zones on active faces of first and second wafers, positioning and fixing the wafers one above another at a predetermined distance such that the active faces of the wafers face one another and the contact zones are aligned, placing the fixed wafers in a bath for electroless metal deposition onto the contact zones; and removing the fixed wafers in the event that the metal layers growing on the aligned contact zones of the first and second wafers have grown together.

公开(公告)号：DE102006003931B3

公开(公告)日：2007-08-02

申请号：DE102006003931

申请日：2006-01-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN

IPC: H01L23/50 ,  H01L21/66

Abstract: A semiconductor device includes surface-mountable external contacts on an underside of the semiconductor device, wherein the external contacts are arranged on external contact pads and surrounded by a solder-resist layer. The external contacts of the outer edge regions include external contact pads that merge into inspection tags, wherein the inspection tags can be wetted by solder and are not covered by the solder-resist layer.

公开(公告)号：DE102005046008B4

公开(公告)日：2007-05-24

申请号：DE102005046008

申请日：2005-09-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  DANGELMAIER JOCHEN

IPC: B81B1/00 ,  B81C1/00

Abstract: A semiconductor sensor device includes a sensor chip. The sensor chip includes a sensor region and contact areas on its upper side and is further arranged in a cavity housing. The cavity housing includes side walls, a housing bottom, a cavity, external contacts on the outside of the cavity and contact pads on an upper side of the housing bottom facing the cavity. The sensor chip is embedded into a rubber-elastic plastic composition within the cavity of the cavity housing such that the sensor region of the sensor chip faces the housing bottom and the contact areas of the sensor chip are electrically connected to the contact pads on the housing bottom via elastic flip-chip contacts.