公开(公告)号：US11650566B2

公开(公告)日：2023-05-16

申请号：US16734233

申请日：2020-01-03

Applicant: STMicroelectronics S.r.l.

Inventor： Luca Fontanella ,  Andrea Labombarda ,  Marco Bianco ,  Davide Ghezzi ,  Christian Raineri ,  Paolo Gatti

IPC: B81B7/00 ,  G05B19/406 ,  G05B23/02

CPC classification number: G05B19/406 ,  G05B23/0218 ,  B81B2201/02 ,  B81B2201/0228 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/01 ,  G05B2219/34351

Abstract: A system for detecting and evaluating environmental quantities and events is formed by a detection and evaluation device and a mobile phone, connected through a wireless connection. The device is enclosed in a containment casing housing a support carrying a plurality of inertial sensors and environmental sensors. A processing unit is coupled to the inertial sensors and to the environmental sensors. A wireless connection unit, is coupled to the processing unit and a wired connection port, is coupled to the processing unit. A programming connector is coupled to the processing unit and is configured to couple to an external programming unit to receive programming instructions of the processing unit. A storage structure is coupled to the processing unit and a power-supply unit supplied power in the detection and evaluation device. The mobile phone stores an application, which enables a basicuse mode, an expert use mode, and an advanced use mode.

公开(公告)号：US20190148566A1

公开(公告)日：2019-05-16

申请号：US16185837

申请日：2018-11-09

Applicant: Infineon Technologies AG

Inventor： Franz-Peter Kalz ,  Jochen Dangelmaier

IPC: H01L31/0216 ,  H01L31/18 ,  B81B7/02 ,  B81C1/00

CPC classification number: H01L31/0216 ,  B81B7/0025 ,  B81B7/02 ,  B81B2201/02 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00047 ,  B81C2201/0143 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18

Abstract: A semiconductor sensor device includes a substrate including a first main face and a second main face opposite the first main face, a semiconductor element including a sensing region, the semiconductor element on the first main face of the substrate and being electrically coupled to the substrate, a lid on the first main face of the substrate and forming a cavity, wherein the semiconductor element is in the cavity, and a vapor deposited dielectric coating covering the semiconductor element and the first main face of the substrate, the vapor deposited dielectric coating having an opening over the sensing region, wherein the second main face of the substrate is at least partially free of the vapor deposited dielectric layer.

公开(公告)号：US20180327252A1

公开(公告)日：2018-11-15

申请号：US15772983

申请日：2016-11-04

Applicant: The University of Manchester

Inventor： Aravind Vijayaraghavan ,  Christian Berger

IPC: B81B3/00 ,  B81C1/00 ,  H01L29/16 ,  H01H1/00

CPC classification number: B81B3/007 ,  B81B2201/02 ,  B81B2203/04 ,  B81C1/00158 ,  H01H1/0094 ,  H01L29/1606 ,  H04R2307/023

Abstract: There is disclosed a device and method for fabricating such a device. The device includes cavities formed in a substrate. A laminated membrane is mounted to the substrate and spans the cavities. The laminated membrane includes a layer of a flexible material, typically a polymer, and a layer of a two-dimensional material that is typically graphene.

公开(公告)号：US20180259376A1

公开(公告)日：2018-09-13

申请号：US15866553

申请日：2018-01-10

Applicant: OMRON Corporation

Inventor： Takanobu YAMAUCHI ,  Naotsugu UEDA ,  Kayo NAKAMURA ,  Ryusuke SAKAI

IPC: G01D21/02 ,  G01L9/12 ,  G01L9/00 ,  B81B7/00 ,  B81C99/00

CPC classification number: G01D21/02 ,  B81B7/0058 ,  B81B7/0087 ,  B81B2201/02 ,  B81C99/003 ,  G01L9/0019 ,  G01L9/125

Abstract: An environmental sensor including sensor elements to measure multiple physical quantities associated with a surrounding environment, and includes a state determination unit that determines whether the environmental sensor is in a first state in which the sensor is fixed at a predetermined installation location or in a second state in which the sensor is away from an installation location, and an operation switch unit that switches an operation of each sensor element that measures the physical quantities based on whether a state determined by the determination unit is the first state or the second state.

公开(公告)号：US20180186626A1

公开(公告)日：2018-07-05

申请号：US15858321

申请日：2017-12-29

Applicant: NEWTONOID TECHNOLOGIES, L.L.C.

Inventor： FIELDING B. STATON ,  DAVID STRUMPF

IPC: B81B7/04 ,  G01K7/22 ,  B81B7/00 ,  B23Q11/00

CPC classification number: B81B7/04 ,  B23Q11/0032 ,  B81B7/0029 ,  B81B2201/02 ,  B81B2201/03 ,  E04H9/00 ,  E04H9/14 ,  G01K7/22

Abstract: A construction component for detecting the application of energy and responding to the energy input wherein a plurality of particles are distributed throughout the component with each particle being configured to sense component state information. The component includes at least one processor configured to receive sensing information from the plurality of particle sensors. The processor configured to receive component state information and to process the information to determine a response to selectively alter attributes of the construction component to affect the behavior of the component. The plurality of particles capable of converting a portion of the energy applied to the construction component into an alternative form of energy, wherein the converted energy is harvested for utilization elsewhere.

公开(公告)号：US10013969B2

公开(公告)日：2018-07-03

申请号：US15353720

申请日：2016-11-16

Applicant: FUIJIFILM SonoSite, Inc.

Inventor： Wei Li ,  Paul Dunham ,  Chak-Yoon Aw ,  N. Chris Chaggares

IPC: B06B1/06 ,  G01N29/14 ,  G01N29/28 ,  G10K11/30 ,  G10K11/168 ,  H01L41/08 ,  B81B3/00 ,  B06B1/02 ,  G01N29/24

CPC classification number: G10K11/30 ,  B06B1/0292 ,  B06B1/0611 ,  B81B3/0021 ,  B81B2201/02 ,  G01N29/06 ,  G01N29/221 ,  G01N29/2406 ,  G01N29/2437 ,  G01N29/28 ,  G10K11/168 ,  H01L41/0825

Abstract: Matching layers configured for use with ultrasound transducers are disclosed herein. In one embodiment, a transducer stack can include a capacitive micromachined ultrasound transducer (CMUT), an acoustic lens, and a matching layer therebetween. The matching layer can be made from a compliant material (e.g. an elastomer and/or an liquid) and configured for use with CMUTs. The matching layer can include a bottom surface overlying a top surface of the transducer and a top surface underlying a bottom surface of the lens.

公开(公告)号：US09815686B2

公开(公告)日：2017-11-14

申请号：US15293147

申请日：2016-10-13

Applicant: Vmicro ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： Benjamin Walter ,  Marc Faucher

IPC: H01L27/14 ,  B81B3/00

CPC classification number: B81B3/0045 ,  B81B3/0021 ,  B81B3/0024 ,  B81B3/0086 ,  B81B2201/02 ,  B81B2201/031 ,  B81B2203/0118 ,  G01P15/123 ,  G01Q10/045 ,  G01Q20/04

Abstract: A microelectromechanical device comprising a mechanical structure extending along a longitudinal direction, linked to a planar substrate by an anchorage situated at one of its ends and able to flex in a plane parallel to the substrate, the mechanical structure comprises a joining portion, which links it to each anchorage and includes a resistive region exhibiting a first and second zone for injecting an electric current to form a resistive transducer, the resistive region extending in the longitudinal direction from an anchorage and arranged so a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein: the first injection zone is carried by the anchorage; and the second injection zone is carried by a conducting element not fixed to the substrate and extending in a direction, termed lateral, substantially perpendicular to the longitudinal direction.

公开(公告)号：US20170133004A1

公开(公告)日：2017-05-11

申请号：US15353720

申请日：2016-11-16

Applicant: FUIJIFILM SonoSite, Inc.

Inventor： Wei Li ,  Paul Dunham ,  Chak-Yoon Aw ,  N. Chris Chaggares

IPC: G10K11/30 ,  H01L41/08 ,  G01N29/24 ,  B06B1/06 ,  B06B1/02 ,  G10K11/168 ,  B81B3/00

CPC classification number: G10K11/30 ,  B06B1/0292 ,  B06B1/0611 ,  B81B3/0021 ,  B81B2201/02 ,  G01N29/06 ,  G01N29/221 ,  G01N29/2406 ,  G01N29/2437 ,  G01N29/28 ,  G10K11/168 ,  H01L41/0825

Abstract: Matching layers configured for use with ultrasound transducers are disclosed herein. In one embodiment, a transducer stack can include a capacitive micromachined ultrasound transducer (CMUT), an acoustic lens, and a matching layer therebetween. The matching layer can be made from a compliant material (e.g. an elastomer and/or an liquid) and configured for use with CMUTs. The matching layer can include a bottom surface overlying a top surface of the transducer and a top surface underlying a bottom surface of the lens.

公开(公告)号：US20160380404A1

公开(公告)日：2016-12-29

申请号：US15140282

申请日：2016-04-27

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Apoorva MURARKA ,  Annie I-Jen WANG ,  Wendi CHANG

IPC: H01S3/105 ,  H01S3/0933 ,  G01L1/24 ,  H01S3/16 ,  B81C1/00 ,  H01S3/08 ,  H01S3/094

CPC classification number: H01S3/1053 ,  B81B2201/02 ,  B81B2201/042 ,  B81C1/00158 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L1/24 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  H01L29/84 ,  H01S3/07 ,  H01S3/08059 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/106 ,  H01S3/1305 ,  H01S3/16 ,  H01S3/1693

Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

公开(公告)号：US09417425B2

公开(公告)日：2016-08-16

申请号：US14341344

申请日：2014-07-25

Applicant: GlobalMEMS TAIWAN CORPORATION LIMITED

Inventor： Su-Jhen Lin ,  Ming-Ching Wu

IPC: G02B7/02 ,  H02K41/02 ,  G02B7/08 ,  G02B7/182 ,  G02B26/08 ,  H02K33/18 ,  G02B7/18 ,  G02B26/10 ,  B81B3/00 ,  H02K35/00

CPC classification number: G02B7/08 ,  B81B3/00 ,  B81B3/0018 ,  B81B2201/02 ,  B81B2201/04 ,  B81B2201/042 ,  G02B7/18 ,  G02B7/182 ,  G02B26/0833 ,  G02B26/085 ,  G02B26/101 ,  H02K33/18 ,  H02K35/00 ,  H02K41/02

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorentz force to drive the movable carrier element to move against the return force of the two return springs.

Abstract translation: 通过在硅衬底上的典型的表面微加工和体微加工工艺形成的微机电系统（MEMS）载体，其具有框架，可移动载体元件，导电线圈，两个复位弹簧和一对永磁体 。 可移动的载体元件形成在框架内并沿着路径移动，导电线圈形成在可动载体元件上或嵌入可移动的载体元件中。 两个复位弹簧形成在可移动的载体元件和框架之间，从而将可移动的载体元件连接到框架上，并向载体元件提供返回力，并且该对永久磁铁形成一个磁场，用于与 导电线圈，用于产生电磁洛伦兹力，以驱动可移动的载体元件克服两个复位弹簧的返回力移动。