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公开(公告)号：US09969610B2
公开(公告)日：2018-05-15
申请号：US15416206
申请日：2017-01-26
Applicant: Raytheon Company
Inventor： Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L31/0203 , B81B7/00 , B81C1/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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公开(公告)号：US09862594B2
公开(公告)日：2018-01-09
申请号：US14207461
申请日：2014-03-12
Applicant: Versana Micro Inc.
Inventor： Bishnu Prasanna Gogoi
CPC classification number: B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
Abstract: A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The wearable device couples a first parameter to be measured directly to the direct sensor. Conversely, the wearable device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the wearable device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device.
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公开(公告)号：US09771258B2
公开(公告)日：2017-09-26
申请号：US14748482
申请日：2015-06-24
Applicant: Raytheon Company
Inventor： Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L23/498 , B81C1/00 , B81B7/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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114.发明申请公开(公告)号：US20170137281A1
公开(公告)日：2017-05-18
申请号：US15320719
申请日：2015-07-07
Applicant: ULIS
Inventor： Jérôme Favier , David Bunel
CPC classification number: B81B7/0038 , B81B2201/0207 , B81C1/00269 , B81C1/00285 , B81C2203/0145 , B81C2203/019 , G01J5/20 , H01L23/564 , H01L31/186 , H01L2224/48091 , H01L2924/00014
Abstract: A method of manufacturing a device having a microelectronic component housed in a hermetically sealed vacuum housing, including forming a getter in said housing, pumping out and heating the device to degas elements housed in said housing, after said pumping, hermetically sealing the housing in fluxless fashion.Further, each material forming the device likely to degas into the inner space is a mineral material, the getter is capable of substantially trapping hydrogen only and is inert to oxygen and/or to nitrogen and the heating and the sealing are performed at a temperature lower than 300° C.
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公开(公告)号：US09533875B2
公开(公告)日：2017-01-03
申请号：US14357046
申请日：2012-11-09
Applicant: U Electronics Co., Ltd.
Inventor： Yong Hee Han , Hyung Won Kim , Mi Sook Ahn
CPC classification number: B81B7/0038 , B81B7/007 , B81B2201/0207 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00269 , B81C1/00285 , B81C2203/0118 , G01P15/0802 , H01L31/02016 , H01L2224/291 , H01L2924/014
Abstract: A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.
Abstract translation: 微机电系统（MEMS）传感器封装包括具有形成在其上的读出集成电路（ROIC）的第一晶片，对应于第一晶片设置的第二晶片，并且在其一侧上具有凹部，并且在 凹部，沿着MEMS传感器的周围形成的接合焊料，并密封连接第一和第二晶片的MEMS传感器，以及形成为将第一晶片的ROIC电路电连接到第二晶片的MEMS传感器的焊盘焊接。 根据本公开内容，在其上形成有ROIC的晶片和其上形成有MEMS传感器的晶片的接合和封装中，可以减小封装的尺寸，并且可以通过形成用于电气的内部焊接焊料来稳定地提供电信号 连接ROIC和MEMS传感器。
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Patent Agency Ranking
公开(公告)号：US20160273968A1
公开(公告)日：2016-09-22
申请号：US14658242
申请日：2015-03-16
Applicant: Vlad Joseph Novotny
Inventor： Vlad Joseph Novotny
CPC classification number: B81C1/00285 , B81B2201/0207 , B81B2203/0109 , B81B2207/015 , B81C1/00333 , B81C2203/0136 , B81C2203/0145 , G01J5/024 , G01J5/045 , G01J5/24 , G01J2005/204 , H01L27/14643
Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.
Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。
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117.发明授权Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays 有权用于晶圆级封装的红外焦平面阵列的抗反射涂层盖晶片中的应力消除方法公开(公告)号：US09427776B2
公开(公告)日：2016-08-30
申请号：US13688714
申请日：2012-11-29
Applicant: Raytheon Company
Inventor： Roland W. Gooch , Buu Q. Diep , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy
CPC classification number: B81C1/00325 , B05D5/061 , B81B7/0067 , B81B2201/0207 , B81C2203/0118
Abstract: Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
Abstract translation: 提供了通过盖晶片的抗反射涂层引起的减少晶片弓的方法。 该方法可以利用其中具有至少一个开口的荫罩，其位于帽晶片中的相对凹陷区域。 该方法还可以包括将至少一层抗反射涂层材料通过荫罩沉积到盖晶片的平面侧上，以在平面侧上提供不连续的涂层。
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118.发明授权Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权在半导体衬底上具有单片集成多传感器装置的运输装置及其方法公开(公告)号：US09327965B2
公开(公告)日：2016-05-03
申请号：US14207443
申请日：2014-03-12
Applicant: Versana Micro Inc.
Inventor： Bishnu Prasanna Gogoi
CPC classification number: B81B7/02 , B81B2201/0207 , B81B2201/0214 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2207/012 , B81B2207/05 , B81B2207/09 , H01L27/14 , H01L27/16 , H01L27/22 , H01L41/1132 , H01L41/1138 , H01L2924/00 , H05K7/02
Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。
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119.发明授权公开(公告)号：US09291507B1
公开(公告)日：2016-03-22
申请号：US14231052
申请日：2014-03-31
Applicant: Weidong Wang , John Bumgarner
Inventor： Weidong Wang , John Bumgarner
CPC classification number: G01J5/40 , B81B2201/0207 , G01J2005/0077 , H01L27/14618 , H01L27/14649
Abstract: An IR imaging system comprising microelectromechanical systems (MEMS) differential capacitive infrared sensors within a sensor array formed on a monolithic integrated circuit substrate, or flip chip bonded onto a signal processing chip fabricated separately, to include, a bimaterial deflectable element anchored to the substrate, a surface electrode fabricated on a top surface of the substrate and positioned below the deflectable element, the surface electrode and the deflectable element separated by a gap to form a first variable capacitor, a sealing ring surrounding the deflectable element and the surface electrode, an infrared transparent sealing cap electrode coupled to the sealing ring to form a vacuum cavity around the deflectable element and the surface electrode, the deflectable element and the sealing cap electrode separated by a gap to form a second variable capacitor and a micro-lens fabricated on the sealing cap electrode to focus the infrared radiation onto the bimaterial deflectable element.
Abstract translation: 一种红外成像系统，包括形成在单体集成电路基板上的传感器阵列内的微机电系统（MEMS）差分电容式红外传感器或者分别结合到单独制造的信号处理芯片上的倒装芯片，以包括锚定到基板的双材料可偏转元件， 表面电极，其制造在所述基板的顶表面上并且位于所述可偏转元件的下方，所述表面电极和所述可偏转元件由间隙隔开以形成第一可变电容器，围绕所述可偏转元件和所述表面电极的密封环，红外线 透明密封帽电极，其耦合到所述密封环，以在所述可偏转元件周围形成真空腔，所述表面电极，所述可偏转元件和所述密封帽电极由间隙隔开以形成第二可变电容器和在所述密封件上制造的微透镜 帽电极将红外辐射聚焦到双材料上 可回应元素
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120.发明申请WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING 有权WAFER LEVEL包装红外（IR）FOCAL PLANE ARRAY（FPA）与EVANESCENT WAVE COUPLING公开(公告)号：US20150321905A1
公开(公告)日：2015-11-12
申请号：US14270945
申请日：2014-05-06
Applicant: Raytheon Company
Inventor： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy , Buu Q. Diep
CPC classification number: B81B7/0067 , B81B7/0035 , B81B2201/0207 , B81C1/00317 , G01J5/045 , G01J5/08 , G01J5/20 , H01L37/00
Abstract: A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when. the cover wafer is bonded to the device wafer.
Abstract translation: 一种用于检测具有预定波长的电磁辐射的结构。 该结构包括具有传感元件的器件晶片，其响应于电磁辐射而设置在器件晶片的表面的预定区域上。 提供了覆盖晶片，其具有对电磁辐射透明的区域，以将电磁辐射穿过透明区域传递到感测元件的表面上。 提供了一种键间隔结构，用于当从盖玻片的透明区域的相对表面以小于预定波长的一小部分的距离来支撑感测元件的表面时。 盖晶片被结合到器件晶片。
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