公开(公告)号：EP2667990B1

公开(公告)日：2016-12-14

申请号：EP12739136.5

申请日：2012-01-25

Applicant: Lockheed Martin Corporation

Inventor： ZINN, Alfred, A.

IPC: B82Y30/00 ,  H05K1/09 ,  B22F1/00 ,  B22F9/24 ,  H05K3/12

CPC classification number: B22F1/0018 ,  B22F1/0062 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  B22F2301/10 ,  B22F2304/054

公开(公告)号：EP1946626B1

公开(公告)日：2013-03-06

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Panasonic Corporation

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

公开(公告)号：EP2513912A1

公开(公告)日：2012-10-24

申请号：EP10807764.5

申请日：2010-12-15

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  WU, Junjun ,  SARAF, Pragnya ,  RANGANATHAN, Thangamani

IPC: H01B1/22 ,  H01C7/105 ,  H01L21/60

CPC classification number: H01C7/108 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0218 ,  H05K2201/0738 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on- conductor core shell particle constituent for the VSD material.

公开(公告)号：EP2346680A4

公开(公告)日：2012-04-18

申请号：EP09813434

申请日：2009-08-20

Applicant: LOCKHEED CORP

Inventor： ZINN ALFRED A

IPC: H05K3/34 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

公开(公告)号：EP2024119A1

公开(公告)日：2009-02-18

申请号：EP07784258.1

申请日：2007-05-31

Applicant: Cabot Corporation

Inventor： KIM, Hyungrak

IPC: B22F9/24 ,  B22F1/02

CPC classification number: B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0218 ,  Y10S977/777 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: Metallic nanoparticles and processes for forming metallic nanoparticles. In one aspect, the invention is to a process for forming nanoparticles comprising the step of heating a solution comprising a first metal precursor and a nucleating agent (e.g., nucleate nanoparticles or a nucleate precursor) in the presence of a base under conditions effective to form the nanoparticles. The first metal precursor preferably comprises a cationic metal species having a low reduction potential. The invention is also to a nanoparticle or plurality of nanoparticles, each nanoparticle comprising a core having a largest dimension less than about 10 nm; and a metal layer substantially surrounding the core and having a largest dimension less than about 200 nm.

公开(公告)号：EP2017031A1

公开(公告)日：2009-01-21

申请号：EP07742163.4

申请日：2007-04-23

Applicant: Senju Metal Industry Co., Ltd

Inventor： KATO, Rikiya ,  YAMAGATA, Sakie

IPC: B23K35/26

CPC classification number: H05K3/3484 ,  B22F1/0003 ,  B22F1/0059 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2982

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used.
A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface. Although the solder paste performs bonding by means of an intermetallic compound without melting to form a single phase structure, the Ni plating acts as a barrier which retards the formation of the intermetallic compound so as to leave enough time to permit wetting of the lands of a printed circuit board or electrodes of an electronic part.

公开(公告)号：EP1946626A1

公开(公告)日：2008-07-23

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder (8) is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder (8) has a flake or dendrite shape including a core segment (8a) of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment (8b) of the metal with good-wettability for the molten solder and to be solid-solved in the core segment (8a) molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles (18) . Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

公开(公告)号：EP1541654A4

公开(公告)日：2008-07-09

申请号：EP02765410

申请日：2002-09-04

Applicant: NAMICS CORP ,  SUGANUMA KATSUAKI

Inventor： KOMAGATA MICHINORI ,  SHIRAI YUKIO ,  SUZUKI KENICHI ,  SUGANUMA KATSUAKI

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5 : 22.5 to 0 : 100; and a circuit connected by using the conductive adhesive.

公开(公告)号：EP1921176A2

公开(公告)日：2008-05-14

申请号：EP07119869.1

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Dr., Richard K. ,  Doesburg, Jacobus C.

IPC: C23C4/12 ,  C23C24/04

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent soldcrability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

公开(公告)号：EP1387367B1

公开(公告)日：2007-01-10

申请号：EP02710342.3

申请日：2002-01-24

Applicant: JSR Corporation

Inventor： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  YOSHIMURA, Nakaatsu, c/o JSR CORPORATION

IPC: H01B3/00 ,  H01B3/12 ,  C08K3/22 ,  C08K9/00 ,  H05K1/03 ,  H01G4/20 ,  C08K9/02 ,  C08K9/04

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 形成电介质组合物雅定到本发明通过由......组成为特征：在其中部分或电介质都具有30或更大的介电常数的无机颗粒的表面的复合颗粒被涂覆有导电金属或它们的化合物，或导电 有机化合物或传导性无机材料; 和（B）的树脂成分构成的聚合性化合物和聚合物中的至少一种制成。 另外，另一种电介质形成用组合物雅鼎的发明是通过含有为特征：（J）具有0.1微米或更小，并且平均粒径的无机超微粒子构成超细颗粒 - 树脂复合粒子（B ）的树脂成分构成的聚合性化合物和聚合物中的至少一种的，worin部分或全部涂有树脂成分（B）的无机超微粒子（J）的表面的，和超细颗粒的树脂复合粒子 含有20％（重量）或更多的无机超微粒子（J）的; 并用0.1〜2微米的平均粒径和30或更大的介电常数，或无机复合颗粒的无机颗粒，其中导电金属或它们的化合物，或导电性有机化合物或导电无机材料沉积在所述部分 或全部的无机颗粒的表面。