公开(公告)号：EP3127969B1

公开(公告)日：2018-06-20

申请号：EP15773385.8

申请日：2015-04-01

Applicant: Korea Electronics Technology Institute

Inventor： KIM, Yoonjin ,  CHO, Jinwoo ,  SHIN, Kwonwoo ,  SEO, Yonggon ,  KIM, Yeonwon ,  JANG, Sanghyeon ,  JO, Namje

IPC: C09D11/52 ,  H01B1/20 ,  B22F9/24 ,  H01B5/14

CPC classification number: H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent. In addition, the present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：EP3077871B1

公开(公告)日：2018-03-07

申请号：EP14821905.8

申请日：2014-11-19

Applicant: Eastman Kodak Company

Inventor： WANG, Yongcai ,  LEBENS, John Andrew ,  WRIGHT, Mitchell Lawrence ,  CUMMINGS, Julie A.

IPC: G03F7/00

CPC classification number: H05K1/09 ,  G03F7/0002 ,  G03F7/0035 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/04 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/032

Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity

公开(公告)号：EP2911160A4

公开(公告)日：2016-06-01

申请号：EP13847147

申请日：2013-10-18

Applicant: NAMICS CORP

Inventor： YOSHII YOSHIAKI

IPC: H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D201/00 ,  H01B1/16 ,  H01B5/14 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18

CPC classification number: C09D5/24 ,  C09D7/12 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: Provided is sintering type conductive paste excellent in electromigration resistance, soldering heat resistance, and adhesion to a substrate. The conductive paste of the present invention contains silver powder (A), glass frit (B), an organic binder (C), and powder (D) containing copper, tin, and manganese. It is preferred that the conductive paste of the present invention contains from 0.1 to 5.0 parts by mass of the powder (D) based on 100 parts by mass of the silver powder (A).

公开(公告)号：EP2880105A4

公开(公告)日：2016-03-30

申请号：EP13825256

申请日：2013-07-30

Applicant: BYD CO LTD

Inventor： LI HAIBIN ,  HU WEN ,  LIN HONGYE

IPC: C09D11/10 ,  C09D11/037 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K3/18

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/104 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/032 ,  H05K2203/0709 ,  H05K2203/107

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.

公开(公告)号：EP2520139B1

公开(公告)日：2016-03-16

申请号：EP10800869.9

申请日：2010-12-29

Applicant: E. I. du Pont de Nemours and Company

Inventor： NAIR, Kumaran, Manikantan ,  GORDON, Scott, E. ,  MCCOMBS, Mark, Frederick

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

公开(公告)号：EP2820596A4

公开(公告)日：2016-01-20

申请号：EP13764036

申请日：2013-03-20

Applicant: LG INNOTEK CO LTD

Inventor： LIM SEOL HEE

IPC: G06K19/077 ,  C25D3/14 ,  C25D3/16 ,  C25D5/02 ,  C25D5/12 ,  H05K1/18

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

公开(公告)号：EP2752505A4

公开(公告)日：2015-07-01

申请号：EP12829006

申请日：2012-08-30

Applicant: JX NIPPON MINING & METALS CORP

Inventor： NAGAURA TOMOTA ,  SAKAGUCHI KAZUHIKO

IPC: C23C28/00 ,  B32B15/01 ,  C25D1/04 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D5/14 ,  C25D7/06 ,  C25D9/08 ,  C25D11/38 ,  H05K1/09 ,  H05K3/02

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

公开(公告)号：EP2821528A1

公开(公告)日：2015-01-07

申请号：EP13754984.6

申请日：2013-02-27

Applicant: Mitsui Mining & Smelting Co., Ltd

Inventor： YOSHIKAWA, Kazuhiro

IPC: C25D1/04 ,  B32B7/06 ,  B32B15/04 ,  C25D7/06 ,  C25D15/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/09 ,  B23K26/382 ,  B23K26/40 ,  B23K2203/12 ,  B32B7/06 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/42 ,  B32B2307/538 ,  B32B2307/748 ,  C25D1/04 ,  C25D1/22 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D7/0614 ,  C25D9/08 ,  H05K3/007 ,  H05K3/025 ,  H05K3/385 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/107 ,  Y10T428/12049

Abstract: The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.

Abstract translation: 本发明的目的是改善在激光束钻孔覆铜层压板中，前述镀铜层压板被用作在激光束钻孔的处理表面黑化处理过的表面处理性能。 为了达到这个目的，铜箔（1）附接载体箔被提供，所述铜箔（1），具有层状结构，其中包括载体箔（2）/剥离层（3）/堆积的附着载体箔 铜层（4）并且其特征在于DASS含有金属组分的颗粒（5）剥离层（3）和所述本体铜（4）层之间设置。 当覆铜层压板是通过使用与载体箔的铜箔附着。制造，黑化层治疗与确保优异的激光束钻孔性能可以在基体铜层的表面上形成的颜色。

公开(公告)号：EP2628824B1

公开(公告)日：2014-09-17

申请号：EP12155801.9

申请日：2012-02-16

Applicant: Atotech Deutschland GmbH

Inventor： Janssen, Boris Alexander

IPC: C23C18/36 ,  H05K3/24

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

公开(公告)号：EP2752505A1

公开(公告)日：2014-07-09

申请号：EP12829006.1

申请日：2012-08-30

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA,Tomota ,  SAKAGUCHI,Kazuhiko

IPC: C23C28/00 ,  B32B15/01 ,  C25D7/06

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

Abstract translation: 本发明提供了一种载体附着的铜箔，其中在层叠到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在层压到绝缘基板之后从载体上剥离。 一种载体附着铜箔，其包含铜箔载体，层叠在所述铜箔载体上的中间层和层叠在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1000-40,000μg/ dm 2的Ni，所述Cr层含有10-100μg/ dm 2的Cr。