METHOD OF MANUFACTURING FLEXIBLE FILM
    114.
    发明申请
    METHOD OF MANUFACTURING FLEXIBLE FILM 审中-公开
    制造柔性膜的方法

    公开(公告)号:US20090294296A1

    公开(公告)日:2009-12-03

    申请号:US12357909

    申请日:2009-01-22

    Abstract: A method of manufacturing a flexible film is disclosed. The method includes (a) forming at least one hole on an insulating film, (b) after the step (a), forming a first metal layer on a first surface corresponding to an inner circumferential surface of the hole, and at least one of a second surface corresponding to an upper surface of the insulating film and a third surface corresponding to a lower surface of the insulating film, and (c) forming a second metal layer on the first metal layer. A thickness of the first metal layer is smaller than a thickness of the second metal layer.

    Abstract translation: 公开了制造柔性膜的方法。 该方法包括:(a)在绝缘膜上形成至少一个孔,(b)在步骤(a)之后,在对应于该孔的内周表面的第一表面上形成第一金属层,以及至少一个 与所述绝缘膜的上表面对应的第二表面和与所述绝缘膜的下表面对应的第三表面,以及(c)在所述第一金属层上形成第二金属层。 第一金属层的厚度小于第二金属层的厚度。

    Method of manufacturing interconnect substrate
    119.
    发明申请
    Method of manufacturing interconnect substrate 有权
    制造互连基板的方法

    公开(公告)号:US20070212871A1

    公开(公告)日:2007-09-13

    申请号:US11716720

    申请日:2007-03-09

    Abstract: A method of manufacturing an interconnect substrate by electroless plating, including: (a) forming a catalyst layer with a specific pattern on a substrate; (b) immersing the substrate in a first electroless plating solution including a first metal to deposit the first metal on the catalyst layer to form a first metal layer; and (c) immersing the substrate in a second electroless plating solution including a second metal to deposit the second metal on the first metal layer to form a second metal layer, an ionization tendency of the first metal being higher than an ionization tendency of the second metal.

    Abstract translation: 一种通过化学镀制造互连基板的方法,包括:(a)在基板上形成具有特定图案的催化剂层; (b)将基板浸入包含第一金属的第一非电镀溶液中以将第一金属沉积在催化剂层上以形成第一金属层; 以及(c)将所述基板浸渍在包含第二金属的第二非电解镀液中以将所述第二金属沉积在所述第一金属层上以形成第二金属层,所述第一金属的电离倾向高于所述第二金属的电离倾向 金属。

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