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    Thin multi-chip flex module
    111.
    发明申请
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US20090168363A1

    公开(公告)日：2009-07-02

    申请号：US12317892

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K7/20 ,  H05K3/34

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

    Circuit board unit and method for production thereof
    112.
    发明申请
    Circuit board unit and method for production thereof 有权
    电路板单元及其制造方法

    公开(公告)号：US20080160246A1

    公开(公告)日：2008-07-03

    申请号：US11977725

    申请日：2007-10-25

    Applicant: Ernst Buhler ,  Rino D'Amario ,  Reto Knaak

    Inventor： Ernst Buhler ,  Rino D'Amario ,  Reto Knaak

    IPC: H05K3/46 ,  B32B3/06 ,  H05K3/00

    CPC classification number: H01L23/3735 ,  B23H1/02 ,  B23H11/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/10166 ,  Y10T29/49139 ,  Y10T428/24008 ,  H01L2924/00

    Abstract: The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.

    Abstract translation: 本发明涉及电路板单元及其制造方法。 电路板单元包括在上侧具有导电轨道的电路板最顶层叠层，用于安装可表面安装的装置。 电路板最上层压板的厚度尺寸设计成使得由表面可安装装置散发的预期热量从电路板层压板的上侧输送到下侧，具有良好的效果。 电路板单元还包括布置在电路板最高层压板下面的电绝缘层压板，由具有良好导热性的材料制成的插入件和嵌入电绝缘层压板中的电绝缘体的嵌入在具有高散热性的表面可安装装置下方的位置， 布置在电绝缘层压板下面的冷却板和插入件。

    MODULE
    113.
    发明申请
    MODULE 审中-公开
    模块

    公开(公告)号：US20080158834A1

    公开(公告)日：2008-07-03

    申请号：US11952406

    申请日：2007-12-07

    Applicant: Tomohide Ogura ,  Motoyoshi Kitagawa

    Inventor： Tomohide Ogura ,  Motoyoshi Kitagawa

    IPC: H05K1/14

    CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3463 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1572

    Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

    Abstract translation: 模块包括：具有设置在其中的通孔的板，设置在板的下表面上的辅助板，安装在板的上表面上的第一电子部件，覆盖第一电子部件的导电盖， 电子部件安装在辅助板的上表面上。 辅助板包括密封通孔的密封部分。 第二电子部件定位在设置在板中的通孔中和辅助板的上表面上。 第二电子部件比第一电子部件高。 这个模块很薄。

    CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD
    114.
    发明申请
    CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD 审中-公开
    组装有微电子元件的电路板及其制造方法

    公开(公告)号：US20070120618A1

    公开(公告)日：2007-05-31

    申请号：US11556900

    申请日：2006-11-06

    Applicant: Nicolas PEULEVEY ,  Jerome Aucourt

    Inventor： Nicolas PEULEVEY ,  Jerome Aucourt

    IPC: H01P5/107

    CPC classification number: H05K1/0237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0272 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/043 ,  H05K2201/09981 ,  H05K2203/061 ,  H05K2203/063 ,  H01L2924/00014

    Abstract: Circuit board (1) and method of producing thereof, the circuit board having a cavity for microstrip to waveguide transition means (2) defined by a hollow space on the walls of which a protection layer (21) is provided. A microelectronic substrate (33) is placed upon an adhesive film (31) adhered onto a surface of the circuit board (1), the adhesive film being pre-cut in selected areas (32) thereof providing openings therethrough. A metal layer (5) is disposed on the resulting structure, wherein a selected part (51) of the metal layer (5) present on a surface of microelectronics substrate 33, facing the hollow space defined by the cavity for microstrip to waveguide transition means (2) is removed.

    Abstract translation: 电路板（1）及其制造方法，所述电路板具有用于微波至腔室的波导过渡装置（2），所述空腔由设置有保护层（21）的壁上的中空空间限定。 将微电子基板（33）放置在附着在电路板（1）的表面上的粘合膜（31）上，在其选定的区域（32）中预先切割粘合膜，从而提供穿过其中的开口。 金属层（5）设置在所得结构上，其中存在于微电子基板33的表面上的金属层（5）的选定部分（51）面向由用于微带的空腔限定的中空空间至波导过渡装置 （2）被移除。

    Temperature controlled hybrid assembly
    115.
    发明授权
    Temperature controlled hybrid assembly 失效
    温控混合组合

    公开(公告)号：US4841170A

    公开(公告)日：1989-06-20

    申请号：US939522

    申请日：1986-12-08

    Applicant: Larry E. Eccleston

    Inventor： Larry E. Eccleston

    IPC: G05D23/24 ,  H01L23/34 ,  H01L25/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16

    CPC classification number: H01L23/345 ,  G05D23/1919 ,  G05D23/24 ,  H01L23/34 ,  H05K1/0212 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/167 ,  H05K2201/043 ,  H05K2201/10151 ,  H05K2203/1115 ,  H05K2203/1581 ,  H05K2203/165

    Abstract: A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.

    Abstract translation: 混合电路结构包括安装在单个基板上的电路及其加热电路。 通过将电路元件安装在基板的一个表面和相对表面上的加热电路元件来节省宝贵的基板空间。 包括温度控制电路，优选地安装在与电路部件相同的表面上。 用于增益控制和其他功能的精密电阻器可以设置在可以直接安装到单个基板或其间的隔板的单独基板上。 精密电阻与温度控制加热电路热接触，从而进一步提高电路的稳定性。

    A STRIPLINE ARRANGEMENT AND A METHOD FOR PRODUCTION THEREOF
    119.
    发明公开
    A STRIPLINE ARRANGEMENT AND A METHOD FOR PRODUCTION THEREOF 有权
    带状线安排及其制备方法

    公开(公告)号：EP1820235A1

    公开(公告)日：2007-08-22

    申请号：EP04809026.0

    申请日：2004-12-01

    Applicant: Telefonaktiebolaget LM Ericsson (publ)

    Inventor： RIVAS, Patrik ,  BERNDTSSON, Andreas

    IPC: H01P3/08 ,  H05K1/14 ,  H01R9/00

    CPC classification number: H01P3/085 ,  H05K1/0237 ,  H05K1/144 ,  H05K3/325 ,  H05K3/4046 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/10303 ,  Y10T29/49126 ,  Y10T29/49156

    Abstract: The present invention relates to a stripline arrangement (10’) comprising a number of stripline layers each comprising a laminate layer (1A, 1B) and conducting layers (2A, 2B, 3A, 3B) provided on each of said laminate layers (1A, 1B), said conducting layers (2A, 2B, 3A, 3B) each comprising a conductive pattern, RF signal (microwave) input and output ports respectively, and an interconnecting arrangement (5) for interconnecting said layers. At least two of said stripline layers are arranged such that a given overlapping zone (L’) is provided between each other facing conducting layers (2A, 2B) of said striplines layers, said interconnecting arrangement (5) comprising a bonding arrangement provided between adjacent and one another facing and overlapping conducting layers (2A, 2B). Connectors (4A, 4B) are provided substantially perpendicularly with respect to an extension plane of the respective stripline layers and crossing said laminate layers (1A, 1B) and conducting layers for, in said overlapping zone, providing contact between the adjacent conducting layers of adjacent stripline layers.

    CIRCUIT IMPRIME FLEX-RIGIDE PAR COLLAGE
    120.
    发明公开
    CIRCUIT IMPRIME FLEX-RIGIDE PAR COLLAGE 审中-公开
    柔性 - 刚性印刷布线板接合

    公开(公告)号：EP1803338A1

    公开(公告)日：2007-07-04

    申请号：EP05775280.0

    申请日：2005-06-02

    Applicant: Bree Industrie

    Inventor： DEGOTTEX, Jean-Marc ,  OUCHAKOFF, Carol

    IPC: H05K3/36

    CPC classification number: H05K3/4691 ,  H05K3/0047 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/043

    Abstract: The invention concerns the field of printed circuits. The invention concerns a method for connecting a rigid circuit to a flexible printed circuit, characterized in that it consists, successively, in bonding the end of the flexible printed circuit on the end of the rigid circuit, so as to ensure that the electric contact pads of both circuits are superimposed back-to-back, piercing said assembly at said electric contact pads, and electrically connecting said punch-throughs by silk-screening deposition of a conductive paste.

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