公开(公告)号：WO2008133432A1

公开(公告)日：2008-11-06

申请号：PCT/KR2008/002288

申请日：2008-04-23

Applicant: AHN, Young-Soo ,  AHN, Seung-Duc ,  CHUN, Ok-Hwa

Inventor： AHN, Young-Soo ,  AHN, Seung-Duc ,  CHUN, Ok-Hwa

IPC: G06F3/041

CPC classification number: G06F3/0416 ,  G06F3/045 ,  H05K3/361 ,  H05K2201/048

Abstract: Provided is a signal-applying structure of a window- integrated touch screen. The touch screen in accordance with the present invention includes a structure having a pad electrode for applying electrical signals to a lower plate and a through-hole for the passage-through of FPC, for easy integration of a touch screen having a position and character recognition function into a window used in a front part of a mobile device such as mobile phone, so as to protect a flat panel display and maintain flatness of the external appearance of a device.

Abstract translation: 提供了一种窗口集成触摸屏的信号施加结构。 根据本发明的触摸屏包括具有用于向下板施加电信号的焊盘电极和用于FPC的通过的通孔的结构，以便容易地集成具有位置和字符识别的触摸屏 功能到用于诸如移动电话的移动设备的前部中的窗口中，以便保护平板显示器并且保持设备的外观的平坦度。

公开(公告)号：WO01011931A1

公开(公告)日：2001-02-15

申请号：PCT/ES1999/000258

申请日：1999-08-06

IPC: H05K3/00 ,  H05K3/36 ,  H05K3/40 ,  H05K1/14 ,  H05K3/42

CPC classification number: H05K3/366 ,  H05K3/0047 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/09854

Abstract: System for connecting in orthogonal position an auxiliary board to a double face or multilayer printed circuit base board, said base board (1) having internally metallized orifices (2) which are transverse to a dielectric substrate (3) and which interconnect electrically tracks (4) defined in one or two faces of said plate (1). Conductor members (5) of the auxiliary board (6) are inserted into the orifices (2) and are connected electrically to tracks (7) of said board; the conductor layer/surface lining internally the metallized orifices (2) is divided in various portions which are electrically separated. In said auxiliary board (6), a dielectric substrate (10) has appendices (8), each of which comprising various separated conductor parts (9a, 9b) which are connected to corresponding tracks (7a, 7b) of the board (6). The conductor parts (9a, 9b) of each appendice (8) correspond in number and position to those of the separated parts (2a, 2b) of each metallized orifice (2).

Abstract translation: 用于将辅助板正交位置到双面或多层印刷电路基板的系统，所述基板（1）具有横向于电介质基板（3）的内部金属化喷孔（2），并且将电气轨道（4） ）限定在所述板（1）的一个或两个面中。 辅助板（6）的导体构件（5）插入孔（2）中并且电连接到所述板的轨道（7）; 金属化孔口（2）内部的导体层/表面衬里被分成各种电气分离的部分。 在所述辅助板（6）中，电介质基板（10）具有附件（8），每个附件包括连接到板（6）的相应轨道（7a，7b）的各种分开的导体部分（9a，9b） 。 每个附件（8）的导体部分（9a，9b）的数量和位置与每个金属化孔口（2）的分离部分（2a，2b）的数量和位置相对应。

公开(公告)号：WO01004656A1

公开(公告)日：2001-01-18

申请号：PCT/US2000/019069

申请日：2000-07-13

IPC: G01R33/02 ,  G01R33/06 ,  G01R33/09 ,  H05K3/36

CPC classification number: B82Y25/00 ,  G01R33/0206 ,  G01R33/06 ,  G01R33/093 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10446

Abstract: A multi-axis magnetometer (100) is provided having three magnetic field sensing circuits for sensing a magnetic field along the X, Y and Z axes. Each magnetic field sensing circuit includes an operational amplifier and a bridge chip (10) having at least one electrical conductor. The operational amplifier (12) is electrically connected to the at least one electrical conductor of the bridge chip (10) for receiving a portion of a current flowing through the at least one electrical conductor. The operational amplifier (12) provides an output voltage based on a magnitude of the portion of the current flowing through the at least one electrical conductor. The multi-axis magnetometer (100) further includes a voltage regulator (14) providing an operating voltage.

Abstract translation: 提供具有用于感测沿着X，Y和Z轴的磁场的三个磁场感测电路的多轴磁力计（100）。 每个磁场感测电路包括运算放大器和具有至少一个电导体的桥接芯片（10）。 运算放大器（12）电连接到桥芯片（10）的至少一个电导体，用于接收流过至少一个电导体的一部分电流。 运算放大器（12）基于流过至少一个电导体的电流的一部分的大小来提供输出电压。 多轴磁力计（100）还包括提供工作电压的电压调节器（14）。

公开(公告)号：WO00074445A1

公开(公告)日：2000-12-07

申请号：PCT/EP2000/004945

申请日：2000-05-30

IPC: H05K3/34 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K3/366 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09645 ,  H01L2924/00

Abstract: According to the invention, the power substrate is used as a base plate in a housing (1) which, together, form a standardized power part from whose top surface (11) connection pins (5) project. Said projection pins are soldered inside interfacial connection via holes of the control printed circuit board (4). The printed circuit board (4) comprises contact pads (7) which are located in an open strip area (6) and which serve as control terminals and power terminals by means of which the module can be soldered directly into the slotted opening of a system printed circuit board (8).

Abstract translation: 电源基板作为在壳体（1）的底板被插入并形成与此一起提供一个标准化的功率部分，从它的上侧（11）突出的销（5），其被焊接在Durchstecklötung与驱动电路板的接触孔（4）。 的印刷电路板（4）具有一个剩余的自由带部分（6）的接触垫（7），为控制和电源连接，通过该模块可以直接焊接到系统中的印刷电路板的槽状开口（8）。

公开(公告)号：WO2018194983A1

公开(公告)日：2018-10-25

申请号：PCT/US2018/027807

申请日：2018-04-16

Applicant: RING INC.

Inventor： SIMINOFF, James ,  SIMINOFF, Mark

IPC: H01R13/193 ,  H01R31/06 ,  H01R13/66

CPC classification number: H01R33/94 ,  H01R12/707 ,  H01R12/7088 ,  H01R12/714 ,  H01R13/622 ,  H01R13/6397 ,  H01R13/748 ,  H01R31/065 ,  H01R33/72 ,  H01R33/9456 ,  H01R33/971 ,  H05K1/144 ,  H05K3/368 ,  H05K5/0052 ,  H05K5/0069 ,  H05K5/0073 ,  H05K5/0247 ,  H05K5/069 ,  H05K2201/041 ,  H05K2201/048 ,  H05K2201/10318 ,  H05K2201/10356 ,  H05K2201/2018

Abstract: A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.

公开(公告)号：WO2018081301A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/058343

申请日：2017-10-25

Applicant: NEPTUNE TECHNOLOGY GROUP INC.

Inventor： PARKER, Wilson Philip ,  DORRIS, Jeffrey Keith ,  PAPENBURG, Frederick Guhl

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/10598

Abstract: A printed circuit board assembly is provided. The assembly has a substantially rigid member, the substantially rigid member having a first protrusion, a support member with a first slot that accepts the protrusion in such a way to produce flex in at least one of the rigid member and the support member. The flex exerts compression on the protrusion that prevents it from disengaging the slot.

Abstract translation: 提供印刷电路板组件。 该组件具有基本刚性的构件，该基本上刚性的构件具有第一突起，具有第一槽的支撑构件，该第一槽以这样的方式容纳突起以在刚性构件和支撑构件中的至少一个中产生弯曲。 Flex会在突起上施加压力，以防止其脱离插槽。

公开(公告)号：WO2015177060A1

公开(公告)日：2015-11-26

申请号：PCT/EP2015/060829

申请日：2015-05-18

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： VAN RIJSWIJK, Nicolaas Antonie

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H01R12/737 ,  H01R12/7023 ,  H05K1/11 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).

Abstract translation: 印刷电路板布置和用于以大致垂直的角度将产品安装到主印刷电路板（100）的方法，印刷电路板装置包括主印刷电路板（100），其包括细长槽（102）和 产品（128），包括被配置为插入到细长槽（102）中的连接器部分（130）。 连接器部分130使得产品（128）可以以与主印刷电路板（100）基本垂直的角度附接。 所述细长槽（102）包括突起（104），并且所述连接器部分（130）包括弹簧部分（132），所述弹簧部分构造成当所述连接器部分（130）插入所述细长槽 102）。 这导致将产品（128）的连接器部分（130）压紧到细长狭槽（102）的至少一个侧壁的力。

公开(公告)号：WO2015149688A1

公开(公告)日：2015-10-08

申请号：PCT/CN2015/075521

申请日：2015-03-31

Applicant: 奇点新源国际技术开发(北京)有限公司

Inventor： 邵起明 ,  郑明吉 ,  刘彬

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K3/366 ,  H05K2201/048

Abstract: 一种印刷电路板及线缆。具体包括：第一印刷电路板PCB和第二PCB形成的十字空间结构的PCB及十字焊接焊点；其中，第一PCB上设置有第一连接部位，第二PCB上设置有第二连接部位，第一连接部位与第二连接部位进行卡接，形成十字空间结构；十字焊接焊点设置在十字空间结构中的第一连接部位与第二连接部位进行卡接时形成的十字卡接部位处，用于固定第一PCB和第二PCB。提高了PCB在实际应用中的可靠性。

公开(公告)号：WO2015135733A1

公开(公告)日：2015-09-17

申请号：PCT/EP2015/053541

申请日：2015-02-19

Applicant: CONTI TEMIC MICROELECTRONIC GMBH

Inventor： BEART, Karin ,  BOCK, Johannes ,  PECHTOLD, Michael ,  SCHUCH, Bernhard ,  HENNIGER, Jürgen

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K1/14 ,  F16H61/00

CPC classification number: H05K1/186 ,  F16H61/0006 ,  H05K1/0298 ,  H05K1/141 ,  H05K3/4046 ,  H05K2201/048 ,  H05K2201/10151 ,  H05K2201/10628

Abstract: Sensorbaustein in einem KFZ-Steuergerät umfassend einen gehäusten Sensor (3) mit Anschlusspins (2, 4) und eine mehrlagige Leiterplatte, wobei die mehrlagige Leiterplatte eine obere Außenlage (7a,6)und eine untere Außenlage (7b, 6), jeweils umfassend eine elektrisch leitende Leiterbahnschicht (7a, 7b) und eine isolierende Leiterplattenbasisschicht (6), und mindestens eine Innenlage (8, 6) zwischen den beiden Außenlagen umfasst, wobei bei der Innenlage (6, 8) eine Leiterplattenbasisschicht (6) zwischen zwei Leiterbahnschichten (8) angeordnet ist, und wobei das Material der Leiterplattenbasisschicht (6) der Leiterplatte ein mit Harz getränktes Glasfaserbasisgewebe ist und der Sensor (3) zwischen der oberen Leiterbahnschicht (7a) und der unteren Leiterbahnschicht (7b) vollständig mit Material der Leiterplattenbasisschicht (6) umschlossen, angeordnet ist.

Abstract translation: 传感器模块，包括在机动车辆中控制单元的封装的传感器（3），其具有连接销（2,4）和一个多层印刷电路板，其中，所述多层印刷电路板的上部外层（7A，6）和一个下部外层（7B，6），每一个都包括 导电迹线层（7A，7B）和绝缘电路板基材层（6），和至少一个内层（8,6）的两个外层之间，其中所述内片（6,8）的印刷电路板基体层（6）两个导体线路层之间（8 ）被布置，并且其中所述电路板的电路板基体层（6）的材料是一种树脂浸渍的玻璃纤维基网和所述传感器（3）的上布线层（7a）和所述下部布线层（7B）完全由电路板基材层的材料包围（6）之间 布置。

公开(公告)号：WO2012074963A1

公开(公告)日：2012-06-07

申请号：PCT/US2011/062313

申请日：2011-11-29

Applicant: HSIO TECHNOLOGIES, LLC ,  RATHBURN, James

Inventor： RATHBURN, James

IPC: H01R12/00

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。