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    CONDUCTIVE SHEET AND TOUCH PANEL
    111.
    发明公开
    CONDUCTIVE SHEET AND TOUCH PANEL 有权
    导电片和触摸屏

    公开(公告)号：EP2765490A1

    公开(公告)日：2014-08-13

    申请号：EP12857606.3

    申请日：2012-12-11

    Applicant: FUJIFILM Corporation

    Inventor： NAKAMURA, Hiroshige

    IPC: G06F3/041 ,  B32B15/14 ,  G06F3/044 ,  H01B5/14

    CPC classification number: H05K1/0296 ,  B32B15/14 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K2201/09245

    Abstract: The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet 12A (12B) which has an electrode pattern 16A (16B) constructed of a metal thin wire and an electrode terminal 60A (60B) that is electrically connected to an end of the electrode pattern 16A (16B), a transmittance of the electrode pattern 16A (16B) is 83% or more, and when the transmittance of the electrode pattern 16A (16B) is represented by a%, a transmittance of the electrode terminal 60A (60B) is controlled to be (a-20)% or more and (a-3)% or less.

    Abstract translation: 本发明提供不损害感测区域中的电极端子附近的可视性的导电片和触摸面板。 在具有由金属细线构成的电极图案16A（16B）和电连接到电极图案16A（16B）的一端的电极端子60A（60B）的导电片12A（12B）中，透射率 电极图案16A（16B）的透射率为83％以上，并且当电极图案16A（16B）的透射率由a％表示时，电极端子60A（60B）的透射率被控制为（a-20） ％以上和（a-3）％以下。

    CONDUCTIVE SHEET, TOUCH PANEL, AND DISPLAY DEVICE
    112.
    发明公开
    CONDUCTIVE SHEET, TOUCH PANEL, AND DISPLAY DEVICE 审中-公开
    LEITFÄHIGEFOLIE，BERÜHRUNGSBILDSCHIRMUND ANZEIGEVORRICHTUNG

    公开(公告)号：EP2764996A1

    公开(公告)日：2014-08-13

    申请号：EP12838840.2

    申请日：2012-10-02

    Applicant: FUJI-FILM Corporation

    Inventor： IWAMI Kazuchika

    IPC: B32B15/02 ,  B32B7/02 ,  G06F3/041 ,  G09F9/00

    CPC classification number: H05K1/0296 ,  B32B7/02 ,  B32B7/12 ,  B32B15/02 ,  B32B15/08 ,  B32B27/08 ,  B32B27/302 ,  B32B27/308 ,  B32B27/36 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/20 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04112 ,  H05K2201/09245

    Abstract: In the conductive sheets (10, 11) of the present invention, a mesh patter (20) in which multiple openings (18) having different forms are arranged in planar view is formed by means of conductive parts (14a, 14b) which are formed on at least one main surface of a base (12) and which are formed from multiple metal thin wires (16). The standard deviation of the areas of the multiple openings (18) is between 0.017 mm 2 and 0.038 mm 2 . With regard to the two-dimensional distribution of the center position of each of the openings (18), the standard deviation of each center position disposed along a predetermined direction relative to the average square deviation of a position in a direction that is perpendicular to the predetermined direction is 15.0 µm or greater. Or, with regard to the standard deviation along an angular direction in the power spectrum of the mesh patter (20), the standard deviation of said standard deviation throughout the radial direction of a value represented by a common logarithm of is between 0.965 and 1.065.

    Abstract translation: 在本发明的导电片（10,11）中，通过形成有导电部件（14a，14b）的平面图来形成具有不同形式的多个开口（18）的网格图案（20） 在基底（12）的至少一个主表面上并且由多个金属细线（16）形成。 多个开口（18）的面积的标准偏差在0.017mm 2和0.038mm 2之间。 关于每个开口（18）的中心位置的二维分布，沿着与预定方向垂直的方向上的位置的平均平方偏差沿预定方向布置的每个中心位置的标准偏差 预定方向为15.0μm以上。 或者，关于网格图案（20）的功率谱中的角度方向的标准偏差，在通常的对数表示的值的整个径向上的所述标准偏差的标准偏差在0.965和1.065之间。

    Telecommunications jack with crosstalk compensation and arrangements for reducing return loss
    113.
    发明公开
    Telecommunications jack with crosstalk compensation and arrangements for reducing return loss 有权
    串扰补偿安排电信连接，并减少反射损失

    公开(公告)号：EP2493032A2

    公开(公告)日：2012-08-29

    申请号：EP12168804.8

    申请日：2007-04-10

    Applicant: ADC GmbH

    Inventor： Hammond, JR., Bernard ,  Murray, David P. ,  George, Ian R.

    IPC: H01R24/00

    CPC classification number: H01R13/6466 ,  H01R4/2429 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a crosstalk compensation arrangement for reducing crosstalk at the jack. The circuit board also includes arrangements that reduce return loss at the jack.

    Abstract translation: 本公开涉及一种电信插座，其包括具有用于接收插头的端口的壳体。 因此，该插座包括接触弹簧的多元性angepasst以与插头电接触当插头插入外壳的端口，和导线端接触头用于终止导线插孔复数。 插口还包括一电路板没有接触弹簧电连接到电线端子接触。 该电路板包括用于在插孔减少串扰的串扰补偿装置。 因此，该电路板包括安排确实减少了在插孔回波损耗。

    Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
    114.
    发明公开
    Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method 有权
    为多层基板和该过程生产的多层基板的制造方法

    公开(公告)号：EP2467004A2

    公开(公告)日：2012-06-20

    申请号：EP12159297.6

    申请日：2001-12-13

    Applicant: Denso Corporation

    Inventor： Kondo, Koji ,  Kamiya, Tetsuaki ,  Harada, Toshikazu ,  Onoda, Ryuichi ,  Kamiya, Yasutaka ,  Masuda, Gentaro ,  Yazaki, Yoshitaro ,  Yokochi, Tomohiro

    IPC: H05K3/46

    CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

    Abstract: A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed at a predetermined location and filled with an interlayer connection material (50); and adhering the single-sided conductor patterned films to each other to form a multilayer substrate; wherein an arbitrary two of single-sided conductor patterned films (21 a, 21 b) are laminated so that surfaces thereof on which the conductor patterns (22) are not formed face with each other, while remaining single-sided conductor patterned films (21) are laminated in such a manner that a surface on which the conductor pattern (22) is formed and a surface on which the conductor pattern (22) is not formed face with each other, whereby electrodes (32, 37) are formed by the conductive patterns (22) at both sides of the multilayer substrate (101).

    Abstract translation: 提供了一种多层基板的制造方法（101），包括：层叠的单面导体图案薄膜（21，21，21 b）中，每一个都具有一个树脂薄膜（23），导体图案（22，22A ）仅形成在树脂膜，电影的单侧，和通孔（24，24A，24B）在预定位置形成，并填充有（在层间连接材料50）; 粘附和单面导体图案薄膜的海誓山盟以形成多层基板; worin单面导体图案薄膜的任意两（21 A，21 B）被层压所以没有表面与其上的导体图形（22）不形成彼此面对，而剩余的单面导体图案薄膜（21 ）层压在寻求一种方式做在其上的导体图案（22）形成的表面和其上的导体图案（22）不与海誓山盟形成面相对的表面上，由此电极（32，37）是由所形成的 导电图案（22），在所述多层基板（101）的bothsides。

    Wiring system
    115.
    发明公开
    Wiring system 有权
    布线系统

    公开(公告)号：EP2413673A3

    公开(公告)日：2012-02-29

    申请号：EP11175657.3

    申请日：2011-07-27

    Applicant: IN2TEC LIMITED

    Inventor： Lewison, John

    IPC: H05K1/02 ,  H01B7/08 ,  H01B11/04

    CPC classification number: H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09672

    Abstract: A wiring system comprises a flexible substrate and at least one pair of conductors deposited on the substrate, wherein the conductors are each arranged in a pattern defining a respective conductive path, and the paths of the pair of conductors are arranged to cross one another at a plurality of crossover points, and wherein the conductors of the or each pair are arranged on the same side of the substrate.

    ULTRASONIC PROBE AND ULTRASONIC ENDOSCOPE WITH ULTRASONIC PROBE
    118.
    发明公开
    ULTRASONIC PROBE AND ULTRASONIC ENDOSCOPE WITH ULTRASONIC PROBE 有权
    ULTRASCHALLSONDE UND ULTRASCHALLENDOSKOP MIT ULTRASCHALLSONDE

    公开(公告)号：EP2027818A1

    公开(公告)日：2009-02-25

    申请号：EP07745048.4

    申请日：2007-06-11

    Applicant: Olympus Medical Systems Corp.

    Inventor： SATO, Sunao ,  WAKABAYASHI, Katsuhiro ,  MIZUNUMA, Akiko ,  FUJIMURA, Takanao ,  SAWADA, Yukihiko ,  IMAHASHI, Takuya ,  ADACHI, Hideo

    IPC: A61B8/12

    CPC classification number: A61B8/12 ,  A61B1/0051 ,  A61B1/015 ,  A61B1/042 ,  A61B8/4416 ,  A61B8/445 ,  A61B8/4455 ,  A61B2562/028 ,  A61B2562/222 ,  G01S7/52079 ,  G01S15/892 ,  H05K1/147 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/10083

    Abstract: Disclosed herein is to allow a reduction in diameter of an ultrasound probe and an ultrasound endoscope and allow reliable and easy electrical connection of signal lines extending from ultrasound transducers. A transducer wiring pad group 102 provided in a distal end portion of an ultrasound transducer printed circuit board 101 provided with signal patterns that transmit and receive signals to and from a plurality of ultrasound transducers, a flexible printed circuit board wiring pad group 108 arranged in a longitudinal axis direction of the ultrasound transducer printed circuit board 101, a second signal pattern group 106 that is connected between the transducer wiring pad group 102 and the flexible printed circuit board wiring pad group 108 and bends at substantially 90 degrees in the middle thereof, and a relay flexible printed circuit board 121 that is connected to the flexible printed circuit board wiring pad group 108 and changes a direction of a signal pattern into the longitudinal axis direction are provided.

    Abstract translation: 本文公开了允许减小超声波探头和超声波内窥镜的直径，并允许从超声换能器延伸的信号线的可靠且容易的电连接。 设置在超声波换能器印刷电路板101的远端部分中的传感器布线垫组102，其设置有向多个超声波换能器发送信号和从多个超声换能器接收信号的信号图案;柔性印刷电路板布线垫组108， 超声波换能器印刷电路板101的纵轴方向，连接在振子布线垫组102和柔性印刷电路基板配线垫组108之间的第二信号图案组106，其中部大致成90度弯曲， 提供连接到柔性印刷电路板布线焊盘组108并将信号图案的方向改变为纵轴方向的继电器柔性印刷电路板121。

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