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    콘택트 및 접속장치
    111.
    发明公开
    콘택트 및 접속장치 无效
    接触和连接装置

    公开(公告)号：KR1020090065461A

    公开(公告)日：2009-06-22

    申请号：KR1020080128235

    申请日：2008-12-17

    Applicant: 호시덴 가부시기가이샤

    Inventor： 오모리야스히로

    IPC: H01R11/11 ,  H01R11/12

    CPC classification number: H05K3/301 ,  F21V19/008 ,  H01H85/202 ,  H01R33/0836 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10295 ,  H05K2201/10393

    Abstract: A contact and a connection device are provided to stably connect and support an electronic computer such as a cold cathode fluorescent lamp by using a hollow space. An electronic component(10) is connected to a contact(200). The contact includes a base part(210), a supporting part(220), and at least two clamp(230). The base part is a plate having a U or O-shape, and has a first plate and two second plates. The second plates are respectively continued at both ends of the first plate and are bent to the same direction. The supporting part is formed on the base part and supports a lead terminal(12) of the electronic component. The clamp is formed to both sides of the supporting part on the base part and receives the lead terminal of the electronic component between the supporting parts.

    Abstract translation: 提供接触和连接装置，通过使用中空空间来稳定地连接和支撑诸如冷阴极荧光灯的电子计算机。 电子部件（10）连接到触点（200）。 触点包括基部（210），支撑部（220）和至少两个夹（230）。 基部是具有U形或O形的板，并且具有第一板和两个第二板。 第二板分别在第一板的两端连续并向同一方向弯曲。 支撑部分形成在基部上并且支撑电子部件的引线端子（12）。 夹具形成在基座部分上的支撑部分的两侧，并且在支撑部件之间接收电子部件的引线端子。

    어플리케이션 카드 상의 전자 모듈의 조립 및 분해 방법,전자 모듈 및 고정 클립의 제조 방법
    112.
    发明公开
    어플리케이션 카드 상의 전자 모듈의 조립 및 분해 방법,전자 모듈 및 고정 클립의 제조 방법 无效
    一种在应用卡上组装和拆卸电子模块的方法，一种制造电子模块的方法和一种固定夹

    公开(公告)号：KR1020040008218A

    公开(公告)日：2004-01-28

    申请号：KR1020037016191

    申请日：2002-06-19

    Applicant: 웨이브콤

    Inventor： 드비비코프알렉시스

    IPC: H05K13/04

    CPC classification number: H05K3/3415 ,  H05K1/141 ,  H05K3/303 ,  H05K13/0491 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10393 ,  Y02P70/613

    Abstract: The invention relates to a method for assembly and/or disassembly of at least one electronic module (1) on an application card (2), said module comprising at least two component elements, that is, at least one printed circuit (12) and at least one other component element (11, 13) mechanically connected by at least one solder joint (14, 15) to said printed circuit (12), said module further comprising a set of extension elements (16) by soldering of said module (1) to an application card (2). According to the invention, said method provides a spring-effect (3) mechanical connection of said component elements (11, 12, 13) to said at least one module (1) such as to guarantee the mechanical connection after the soldering of said set of extension elements for the assembly and/or assembly of said module (1) on said application card (2).

    Shield package substrate
    116.
    发明专利
    Shield package substrate 审中-公开
    屏蔽包装基板

    公开(公告)号：JP2011054640A

    公开(公告)日：2011-03-17

    申请号：JP2009200228

    申请日：2009-08-31

    Applicant: Funai Electric Co Ltd ,  船井電機株式会社

    Inventor： INOUE YOSHIHIKO

    IPC: H01L23/00 ,  H01L23/36

    CPC classification number: H01L23/552 ,  H01L23/3675 ,  H01L23/4006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/167 ,  H05K1/0203 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/10393

    Abstract: PROBLEM TO BE SOLVED: To provide a shield package substrate that uses an electromagnetic shield plate as a heat sink and improving the heat radiation function, without so much sacrificing the shielding function of unwanted radiation noise that is originally demanded of the electromagnetic shield plate.
    SOLUTION: In the shield package substrate, an overall circuit board 10 on which an electronic component 20 is mounted is covered with the electromagnetic shield plate 30. A heat conductive member 40 is interposed in a mutual space between an outer surface 21 of the electronic component 20 and a top plate 33 of the electromagnetic shield plate 30, disposed with a space between the electronic component 20. It is desirable that the thermally conductive member 40 be partially brought into contact with a part that includes a highest temperature region appearing in the heating temperature distribution of the outer surface 21. It is desirable that the top plate 33 of the electromagnetic shield plate 30 be formed so as to arrange a projection 51 and the thermally conductive member 40 be positioned by the projection 51.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种屏蔽封装基板，其使用电磁屏​​蔽板作为散热器并且改善散热功能，而不必太多地牺牲最初要求电磁屏蔽的不需要的辐射噪声的屏蔽功能 盘子。 解决方案：在屏蔽封装基板中，安装有电子部件20的整体电路板10被电磁屏蔽板30覆盖。导热部件40插入在相互间隔的 电子部件20和电磁屏蔽板30的顶板33在电子部件20之间设置有空间。理想的是，导热部件40部分地与包括出现最高温度区域的部分接触 在外表面21的加热温度分布中。希望形成电磁屏蔽板30的顶板33，以便布置突起51，并且导热部件40由突起51定位。 版权所有（C）2011，JPO＆INPIT

    仮止め装置
    117.
    发明专利
    仮止め装置 有权

    公开(公告)号：JPWO2007108184A1

    公开(公告)日：2009-08-06

    申请号：JP2008506167

    申请日：2006-12-11

    Applicant: 三菱電機株式会社

    Inventor： 秀樹 時本 ,  秀樹 時本

    IPC: H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K2201/10393 ,  H05K2203/0165 ,  Y10T29/53174 ,  Y10T29/53178

    Abstract: 中央部に穴があり、その穴周辺部に段差部を有する枠状構造部材と、上記枠状構造部材の上記段差部に載置する基板と、上記基板を上記段差部に押圧する基部、少なくとも1個以上の回路部品を上記基板上に押圧する押圧部を連結部で一体化した同時押え部材と、上記同時押え部材の基部を回動可能かつ上下動可能に支持するように上記枠状構造部材に設けた軸と、上記同時押え部材を常時上記枠状構造部材面に押圧する押圧部材とを備えたものである。

    Contact and connecting device
    118.
    发明专利
    Contact and connecting device 审中-公开
    联系和连接设备

    公开(公告)号：JP2009146820A

    公开(公告)日：2009-07-02

    申请号：JP2007325011

    申请日：2007-12-17

    Applicant: Hosiden Corp ,  ホシデン株式会社

    Inventor： OMORI YASUHIRO

    IPC: H01R33/02 ,  H01J5/50 ,  H01R33/975

    CPC classification number: H05K3/301 ,  F21V19/008 ,  H01H85/202 ,  H01R33/0836 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10295 ,  H05K2201/10393

    Abstract: PROBLEM TO BE SOLVED: To provide a contact and a connecting device capable of stably connecting and supporting an electronic component such as a cold cathode fluorescent lamp in midair.
    SOLUTION: A contact 200 for connection with a cold cathode fluorescent lamp 10 includes a base 210, a supporting part 220 that is provided on the base 210 for supporting a lead terminal 12 of the cold cathode fluorescent lamp 10, and at least two clamps 230 that are provided on the base 210 so as to be located on respective outer sides of the supporting part 220 and capable of sandwiching and holding the lead terminal 12 of the cold cathode fluorescent lamp 10 between themselves and the supporting part 220.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够在空中稳定地连接和支撑诸如冷阴极荧光灯的电子部件的接触和连接装置。 解决方案：用于与冷阴极荧光灯10连接的触点200包括基座210，支撑部分220，其设置在基座210上，用于支撑冷阴极荧光灯10的引线端子12，并且至少 两个夹具230，其设置在基座210上，以便位于支撑部件220的相应的外侧上，并且能够将冷阴极荧光灯10的引线端子12夹持并保持在它们之间和支撑部件220之间。 P>版权所有（C）2009，JPO＆INPIT

    Receptacle
    119.
    发明专利
    Receptacle 审中-公开
    容器

    公开(公告)号：JP2004079202A

    公开(公告)日：2004-03-11

    申请号：JP2002233740

    申请日：2002-08-09

    Applicant: Sharp Corp ,  シャープ株式会社

    Inventor： MUNEMURA ATSUSHI

    IPC: H01R13/73 ,  H05K3/30 ,  H05K3/34 ,  H01R12/22 ,  H01R12/04

    CPC classification number: H05K3/301 ,  H01R12/7029 ,  H01R12/707 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10393 ,  H05K2201/10598

    Abstract: PROBLEM TO BE SOLVED: To provide a receptacle, by which stress applied to a soldered part of a terminal is reduced when such forcing insertion or pulling out of a plug as pried is made.
    SOLUTION: The receptacle is equipped with a housing having an insertion hole for receiving a plug for transmission of optical signals and mounted on a printed board, a photoelectric converting element housed in the housing for giving and receiving the optical signals to and from the received plug for transmission of optical signals, and a bond member made of a metal for covering and fixing the housing to the printed board, the housing has a positioning recessed part recessed corresponding to the form of the band member and a collar part projected on the positioning recessed part at its outer peripheral surface excluding a surface opposite to the printed board, the band member is accommodated and fixed to the positioning recessed part so as to be locked to the collar part and has protrusion pieces protruding from portions opposite to each other through the housing, and the protrusion pieces are inserted into through-holes formed in the printed circuit board in advance and soldered.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种插座，当插入或拔出塞子时，施加到端子的焊接部分的应力减小。 解决方案：插座配备有具有用于接收用于传输光信号的插头并安装在印刷电路板上的插入孔的壳体，容纳在壳体中的光电转换元件，用于给予和接收光信号 接收的用于传输光信号的插头以及由金属制成的接合构件，用于将外壳覆盖并固定到印刷电路板上，壳体具有对应于带构件的形状凹陷的定位凹入部分，以及凸出部分 定位凹部在其外周面除了与印刷基板相反的表面之外，带状部件被容纳并固定到定位凹部以便锁定到凸缘部分并且具有从彼此相对的部分突出的突出部件 通过壳体，并且将突起片预先插入形成在印刷电路板中的通孔中并焊接。 版权所有（C）2004，JPO

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