公开(公告)号：EP2222149A1

公开(公告)日：2010-08-25

申请号：EP10154189.4

申请日：2010-02-22

Applicant: FUJITSU LIMITED

Inventor： Takada, Rie ,  Tsubone, Kenichiro

IPC: H05K3/36 ,  H05K1/14 ,  H01L23/538

CPC classification number: H05K1/147 ,  H01L23/3672 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component mounting structure includes a first substrate (11) on which a first component (12) is mounted and a second substrate (15) connected to the first substrate. The second substrate is bent toward the first component.

Abstract translation: 一种电子部件安装结构包括连接到所述第一衬底的底物（11），其上的第一部件（12）被安装在第一基板和第二（15）。 所述第二基板向所述第一元件弯曲。

公开(公告)号：EP2003942A3

公开(公告)日：2009-11-18

申请号：EP08156905.5

申请日：2008-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A.

IPC: H05K3/30 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

公开(公告)号：EP1740027A3

公开(公告)日：2009-06-03

申请号：EP06076193.9

申请日：2006-06-08

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Walsh, Matthew R. ,  Tsai, Jeenhuei S.

IPC: H05K3/28

CPC classification number: H01L23/4334 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14655 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A technique for manufacturing an electronic assembly uses a mold (40) that has a first mold portion (44) and a second mold portion (42). The first mold portion (44) includes a plurality of spaced mold pins (46) extending from an inner surface. A cavity of the first and second mold portions (44,42) provides a mold cavity (111), when joined. A backplate (110) is also provided that includes a plurality of support pedestals (112) and an integrated heatsink (114) extending from a first side of the backplate (110). A substrate (102) includes a first side of an integrated circuit (IC) die (106A) mounted to a first side of the substrate (102). The backplate (110) and the substrate (102) are placed within the cavity of the second mold portion and the support pedestals (112) are in contact with the first side of the substrate (102). The first and second mold portions (44,42) are joined and the mold pins (46) contact a second surface of the substrate (102) during an overmolding process.

公开(公告)号：EP1659838A2

公开(公告)日：2006-05-24

申请号：EP05023557.1

申请日：2005-10-27

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Sugahara, Hiroto Brother Kogyo K.K.

IPC: H05K1/02

CPC classification number: H01L23/4006 ,  B41J2/14233 ,  B41J2002/14491 ,  B41J2202/08 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2023/4075 ,  H01L2023/4081 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/053 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/1056

Abstract: An electronic part-mounted substrate (1) includes a plate made of metal, an insulating material layer (4) which is formed of a ceramic material on a surface of the plate and which has a surface provided with a heat generating IC (5,6) thereon, and a thermal conductive member which is provided on a surface of IC. The heat, which is generated by IC (5,6) , is transmitted via the thermal conductive member (80) to the insulating material layer (4) and the plate, and the heat is dissipated to the outside. The heat generated by the electronic part can be dissipated more efficiently. The substrate is applicable to a liquid-jetting head.

公开(公告)号：EP0632685B1

公开(公告)日：1997-11-19

申请号：EP94108592.0

申请日：1994-06-01

Applicant: International Business Machines Corporation

Inventor： Cutting, Lawrence Richard ,  Gaynes, Michael Anthony ,  Johnson, Eric Arthur ,  Milkovich, Cynthia Susan ,  Perkins, Jeffrey Scott ,  Pierson, Mark Vincent ,  Poetzinger, Steven Eugene ,  Zalesinski, Jerzy

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/021 ,  H05K1/0298 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/3415 ,  H05K3/3452 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

公开(公告)号：EP0449640A1

公开(公告)日：1991-10-02

申请号：EP91302781.9

申请日：1991-03-28

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Hayasi, Satoru, c/o Mitsubishi Denki K.K.

IPC: H05K7/20 ,  H01L23/40

CPC classification number: H05K1/0203 ,  H01L23/4006 ,  H01L24/01 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2924/181 ,  H02M7/003 ,  H05K3/325 ,  H05K7/20436 ,  H05K7/20463 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: An electrical device for mounting electrical components includes an integrally die-cast aluminum base 20 having at an upper side thereof recesses 20a for receiving the electrical components and at the bottom side thereof radiator fins 20b for radiating heat generated by the electrical components. The terminals 31 of the electrical components accommodated in the recesses of the metal base 20 are substantially at the same height and electrical interconnection among them is secured via the conductors 21a carried on a printed circuit board 21. A high heat conductivity resin material 29 is interposed between the recesses and components 22, 23, and 27 that generate a large amount of heat. On the other hand, a heat insulating resin material 30 is interposed between the recess and the component 26 that generates a small or negligible amount of heat.

Abstract translation: 用于安装电气部件的电气装置包括一体的压铸铝基座20，其具有在其上侧的用于接收电气部件的凹部20a和用于散发由电气部件产生的热量的散热片20b的散热片20b的底侧。 容纳在金属基座20的凹部中的电气部件的端子31基本上处于相同的高度，并且通过承载在印刷电路板21上的导体21a来确保它们之间的电气互连。插入高导热性树脂材料29 在产生大量热量的凹部和部件22,23和27之间。 另一方面，绝热树脂材料30插入在凹部和产生小的或可忽略的热量的部件26之间。

公开(公告)号：EP3132662A1

公开(公告)日：2017-02-22

申请号：EP15713345.5

申请日：2015-02-18

Applicant: Raytheon Company

Inventor： KYHL, Cary C. ,  HESTON, Scott M. ,  ELLIOTT, James M.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装装置可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：EP3013126A1

公开(公告)日：2016-04-27

申请号：EP15190913.2

申请日：2015-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： BANG, Jung-Je ,  KIM, Mi-Jin ,  LEE, Sae-Bom ,  HAN, Hyun-Joo ,  KIM, Kun-Tak

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H05K3/34

CPC classification number: H05K3/321 ,  H01L21/563 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29194 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2924/1421 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/023 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/1056 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material (40) on a heating component (P1) mounted on the printed circuit board (P); mounting a shield unit (41) on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract translation: 提供了一种用于制造印刷电路板组件的方法。 一种方法包括在安装在印刷电路板（P）上的加热部件（P1）上应用液化辐射热材料（40） 将屏蔽单元（41）安装在与液化辐射热材料接触的印刷电路板上; 同时固化液化辐射热材料并粘合屏蔽单元。

公开(公告)号：EP2782133A2

公开(公告)日：2014-09-24

申请号：EP13195878.7

申请日：2013-12-05

Applicant: FUJITSU LIMITED

Inventor： Masuda, Satoshi

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/047

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member, a semiconductor device mounted on an upper face of the upper substrate, a first ground line connected to the semiconductor device and formed on the upper substrate, and a ground metal part connected to the base metal part and disposed in the lower base member, wherein the ground metal part is connected to the first ground line on the upper substrate.

Abstract translation: 本发明提供一种高频模块，其特征在于，具备：下部基体部件，其上表面形成有凹部，在其下面形成有接地的基体金属部;上部基板，其配置在下部凹部的内侧 基部构件，安装在上基板的上表面上的半导体器件，连接到半导体器件并形成在上基板上的第一接地线以及连接到基部金属部并设置在下基部构件中的接地金属部 其中，所述接地金属部分连接到所述上基板上的所述第一接地线。

公开(公告)号：EP2361005A4

公开(公告)日：2014-06-18

申请号：EP09831829

申请日：2009-11-30

Applicant: MURATA MANUFACTURING CO

Inventor： HARA KOICHI

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/552 ,  H01L25/16 ,  H05K1/02 ,  H05K3/00 ,  H05K9/00

CPC classification number: H01L23/3675 ,  H01L23/433 ,  H01L23/552 ,  H01L24/50 ,  H01L25/16 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2203/1572