公开(公告)号：EP2003690A3

公开(公告)日：2009-11-25

申请号：EP08156713.3

申请日：2008-05-22

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Taylor, Ralph S. ,  Sozansky, Wayne A.

IPC: H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/42 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2924/01019 ,  H01L2924/01079 ,  Y10T29/49002 ,  H01L2924/0665

Abstract: An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.

公开(公告)号：EP2003690A2

公开(公告)日：2008-12-17

申请号：EP08156713.3

申请日：2008-05-22

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Taylor, Ralph S. ,  Sozansky, Wayne A.

IPC: H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/42 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2924/01019 ,  H01L2924/01079 ,  Y10T29/49002 ,  H01L2924/0665

Abstract: An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.

Abstract translation: 用于将热量从集成电路装置传导到散热器中的改进的热界面材料是复合材料，其包括限定开口的金属丝网和结合到金属丝网的开口中的硬化结构粘结剂。 改进的复合热界面材料具有优于常规热界面材料的优异的粘合性能，同时还具有出色的导热性。

公开(公告)号：EP2003942A3

公开(公告)日：2009-11-18

申请号：EP08156905.5

申请日：2008-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A.

IPC: H05K3/30 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

公开(公告)号：EP2473016A1

公开(公告)日：2012-07-04

申请号：EP11193684.5

申请日：2011-12-15

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A. ,  Yeh, Shing

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y02P70/613

Abstract: A system (10) and method (300) for supporting an electronic component (12) attached to a circuit board (14). solder paste (40) is applied to a solder pad (16) underneath and aligned with a non-wetting region (18) of an electronic component (12) to form a support (34) formed of solder to prevent electronic component (12) lead (26) flexing. The amount of solder for forming the support (34) and the size of the solder pad (16) are selected to bring the support (34) into contact with, or in close proximity to, the non-wetting region (18).

Abstract translation: 一种用于在电子部件支撑系统（10）和方法（300）（12）连接到一个电路板（14）。 焊膏（40）被施加到焊料焊盘（16）的下方并且与电子元件（12）的非润湿区域（18）对齐以形成FORMED焊料的支撑件（34），以防止电子元件（12） 引线（26）挠曲。 焊料用于形成支撑件（34）和焊料焊盘（16）的大小的量被选择，以使支承件（34）接触到或靠近，非润湿区域（18）。

公开(公告)号：EP2003942A2

公开(公告)日：2008-12-17

申请号：EP08156905.5

申请日：2008-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A.

IPC: H05K3/30 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

Abstract translation: 将多个功率封装和热散热器组装到印刷电路板的改进方法包括在将功率封装的电引线焊接到印刷电路板之前将功率封装固定到散热器。 改进的过程允许功率封装的电引线在印刷电路板的引线孔中自由移动，因为在散热器和功率封装之间的平坦的平面表面接触到平坦的表面接触，从而消除或至少基本上减少引线弯曲 这在常规工艺中发生，其中在功率封装的引线已经被焊接到印刷电路板之后发生散热器附接到功率封装。