公开(公告)号：WO98034443A1

公开(公告)日：1998-08-06

申请号：PCT/JP1998/000006

申请日：1998-01-05

IPC: H05K1/11 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board comprising a circuit board (6) having a conductor circuit (5) and a through-hole (60), and a junction pin (1) inserted in the through-hole. The junction pin is made of a material which does not melt at a heating temperature in joining the junction pin to a counterpart pad (81). The junction pin includes a junction top portion (11) which is greater than the aperture diameter of the through-hole and becomes a junction part with the counterpart pad, and a leg portion (12) of a size enabling insertion into the through-hole. The leg portion is inserted in the through-hole and joined with the through-hole by a conductive material such as a solder material (20). In place of the junction pin, a junction ball of a substantially spherical shape may be joined by the conductive material.

Abstract translation: 一种印刷电路板，包括具有导体电路（5）和通孔（60）的电路板（6）和插入所述通孔中的接合销（1）。 接头销由将接合销连接到配对垫（81）而在加热温度下不熔化的材料制成。 连接销包括大于通孔的孔直径的连接顶部（11），并且成为与配对垫的接合部分，以及能够插入到通孔中的尺寸的腿部（12） 。 腿部插入通孔中，并通过诸如焊料（20）的导电材料与通孔接合。 代替接合销，大致球形的接合球可以由导电材料接合。

公开(公告)号：WO1997025845A1

公开(公告)日：1997-07-17

申请号：PCT/US1997000185

申请日：1997-01-02

Applicant: SHELDAHL, INC.

Inventor： SHELDAHL, INC. ,  ROBERTS, Sidney, J. ,  NEUBURGER, Dean, P.

IPC: H05K03/46

CPC classification number: H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4647 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063

Abstract: A printed circuit assembly (10) and method of making the same utilize in one embodiment an adhesive layer (40) including a plurality of non-conductive "gauge particles" (44) disposed within a non-conductive adhesive (42). When the adhesive layer (40) is disposed between opposing printed circuit layers (20, 30) (be they insulating substrates, conductive layers, or other layers), individual gauge particles (44) are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations.

Abstract translation: 印刷电路组件（10）及其制造方法在一个实施例中用于包括设置在非导电粘合剂（42）内的多个非导电“规格颗粒”（44）的粘合剂层（40）。 当粘合剂层（40）设置在相对的印刷电路层（20,30）（它们是绝缘基板，导电层或其它层）之间时，各个测量颗粒（44）被插入或夹在层之间的各个点 颗粒的直径在其重叠区域中控制层分离，从而允许对层分离的仔细控制。 一种印刷电路组件及其在另一实施例中的应用方法，其中包括导电柱的层间互连技术，所述导电柱沉积在形成在相对的印刷电路板上的一对接触焊盘中的一个上，然后在所述一对接触焊盘 在层压期间。 在导电柱中可以使用可熔材料，以便于与接触垫的机械接合，并且柱突出穿过布置在印刷电路板之间的电介质层，由此在离散位置处形成电路板之间的电连接。

公开(公告)号：KR101263222B1

公开(公告)日：2013-05-10

申请号：KR1020097008492

申请日：2007-10-24

Applicant: 시티에스 코포레이션

Inventor： 로고진알렉산더

IPC: H01P1/205 ,  H01P1/213

CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

Abstract: 인쇄회로기판의표면에직접표면장착하기위해구성된공진기/필터(100)가제공된다. 상기공진기/필터는상기공진기/필터가연장하는적어도하나의공진기관통구멍(101 내지 104)과, 각각상부(112), 저부(113), 및전도성물질로커버된절연성재료의영역들을규정하는측부면(114 내지 117)들을포함한다. 상부블록면은적어도하나의제 1 전도성영역을한정한다. 상기블록의저부면상의제 2 전도성영역은필터가저부필터면을갖는기판상에장착되도록하는입력/출력접점을규정하며, 따라서특히높은주파수하에개선된감쇠성능을위해공진기관통구멍과기판사이에직접접지접점을제공한다. 복수의송 신라인실시예들(131, 156)이상기제 1 및제 2 전도성영역을전지접속한다.

公开(公告)号：KR1020070029081A

公开(公告)日：2007-03-13

申请号：KR1020060086195

申请日：2006-09-07

Applicant: 샤프 가부시키가이샤

Inventor： 우에다준

IPC: H01L23/12

CPC classification number: H01L23/3121 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/0715 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/2018 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic circuit module and its manufacturing method are provided to reduce the size, to decrease fabrication costs and to obtain an excellent heat radiating capability by using an improved arrangement of first and second circuit boards. An electronic circuit module comprises a semiconductor substrate, a semiconductor IC(Integrated Circuit) part on the substrate and a passive element part. The electronic circuit module further includes first and second circuit boards. At least one out of the semiconductor IC part and the passive element part is loaded on part mount surfaces of the first and the second circuit boards(1,2). The part mount surfaces of the first and the second circuit boards are arranged opposite to each other.

Abstract translation: 提供电子电路模块及其制造方法，通过使用第一和第二电路板的改进布置来减小尺寸，降低制造成本并获得优异的散热能力。 电子电路模块包括半导体衬底，衬底上的半导体IC（集成电路）部分和无源元件部分。 电子电路模块还包括第一和第二电路板。 半导体IC部件中的至少一个和无源元件部件被装载在第一和第二电路板（1,2）的部件安装表面上。 第一和第二电路板的部件安装表面彼此相对布置。

公开(公告)号：KR100368773B1

公开(公告)日：2003-04-10

申请号：KR1019970016213

申请日：1997-04-29

Applicant: 이비덴 가부시키가이샤

Inventor： 다까다마사루 ,  쯔까다키요다까 ,  나까노모리오

IPC: H05K1/11

CPC classification number: H05K9/0039 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/066 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/041 ,  Y10T29/49128 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: 전자 부품을 탑재하기 위한 탑재부를 구비하는 절연 기판 및 상기 절연 기판의 저면상에 배치된 히트싱크판을 포함하는 전자 부품 탑재 기판에 있어서, 상기 절연 기판이 신호 또는 파우워용 배선 패턴, 접지 패턴 및 접지공을 구비하며, 상기 접지 패턴의 전기적 연결을 위해 상기 접지공은 그 내벽 상에 금속 도금막이 구비되어 있고, 상기 히트싱크판과의 전기적 연결을 위해 상기 접지공의 내부에는 땜납이 채워져 있는 전자 부품 탑재 기판이 개시되어 있다.

Abstract translation: 一种电子元件安装基板，包括：绝缘基板，设置有用于安装电子元件的安装部分和设置在绝缘基板的下表面上的散热板，其中绝缘基板设置有用于信号的布线图案或者 电源，接地图案和接地孔，接地孔的内壁上设置有金属镀膜，用于电连接到接地图案，焊锡填充在接地孔的内部，用于电连接到热量 - 板。

公开(公告)号：KR1020020073294A

公开(公告)日：2002-09-23

申请号：KR1020020013484

申请日：2002-03-13

Applicant: 세이코 엡슨 가부시키가이샤

Inventor： 호시나가즈시게

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/10666

Abstract: PURPOSE: To prevent an increase in electric resistance of a wiring formed on a board, even if it has high wiring density. CONSTITUTION: A wiring board 7 is press-bonded to a bard expansion 2c by an ACF 6b, board terminals 21 made of ITO on the wiring expansion 2c are conductively connected to first terminals formed on the backside of the wiring board 7 having second terminals 27 on its surface, and the second terminals 27 make electrical continuity to the first terminals on the backside via through- holes. A wiring pattern on the wiring board 7 is formed of a material having lower electric resistance than that of an ITO forming the board terminals 21, thus suppressing wiring resistance on the board expansion 2c.

Abstract translation: 目的：为了防止板上形成的布线的电阻增加，即使布线密度高。 构成：通过ACF 6b将配线基板7压接在吟诵式膨胀部2c上，在布线用膨胀部2c上由ITO构成的基板端子21与形成在具有第二端子27的配线基板7的背侧上的第一端子导电连接 并且第二端子27通过通孔对背面上的第一端子进行电连续性。 布线基板7上的布线图形由具有比构成基板端子21的ITO低的电阻的材料形成，从而抑制板扩张部2c的布线电阻。

公开(公告)号：KR100271656B1

公开(公告)日：2000-11-15

申请号：KR1019980020097

申请日：1998-05-30

Applicant: 현대반도체 주식회사

Inventor： 오성호

IPC: H01L23/50

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: PURPOSE: A ball grid array(BGA) semiconductor package is provided to decrease manufacturing cost, by obviating the necessity of an additional unit for precise alignment when a conductive ball is placed on a substrate for packaging. CONSTITUTION: A semiconductor chip(91) is adhered to a recess(53) formed in the center of a lower substrate(51). A wire(93) connects one end of an interconnection(59) formed on the upper surface of the lower substrate with the semiconductor chip. An encapsulating member(97) surrounds the upper surface of the recess, the wire and the semiconductor chip. A lower penetration hole(55) of which the upper portion is broader than the lower portion, is formed in the outside of the recess. A conductive ball is disposed in the lower penetration hole. An upper penetration hole(75) of which the upper portion is narrower than the lower portion, is formed in a position corresponding to the conductive ball. An upper substrate(71) having the upper penetration hole is adhered to the lower substrate.

Abstract translation: 目的：提供球栅阵列（BGA）半导体封装以降低制造成本，因为当将导电球放置在用于封装的基板上时，通过消除用于精确对准的附加单元的必要性。 构成：将半导体芯片（91）粘附到形成在下基板（51）的中心的凹部（53）。 电线（93）将形成在下基板的上表面上的互连（59）的一端与半导体芯片相连接。 密封构件（97）围绕凹部的上表面，导线和半导体芯片。 在凹部的外侧形成有下部贯通孔（55），该下部贯通孔（55）的上部比下部的宽度大。 导电球设置在下贯穿孔中。 其上部比下部窄的上部贯通孔（75）形成在与导电性球体对应的位置。 具有上部贯通孔的上部基板（71）粘接到下部基板。

公开(公告)号：KR1019990077732A

公开(公告)日：1999-10-25

申请号：KR1019990007851

申请日：1999-03-10

Applicant: 알카텔-루센트 유에스에이 인코포레이티드

Inventor： 드가니이논 ,  타이킹리엔

IPC: H05K3/34

CPC classification number: H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: 본발명은땜납범프어레이(solder bump array)를사용하여, 도금된관통홀(through hole)을갖는양면회로보드를상호접속기판에부착시키는기법에관한것이다. 땜납범프를관통홀상에직접위치시키는고용융점땜납(high melting point solder)으로관통홀을채워, 보드면적을줄이고상호접속길이를감소시킨다.

Abstract translation: 本说明书描述了使用焊料凸块阵列将具有电镀通孔的双面电路板连接到互连基板的技术。 通孔填充有高熔点焊料，其允许焊料凸块直接位于通孔上，从而节省了电路板面积并减小了互连长度。

公开(公告)号：KR20070074363A

公开(公告)日：2007-07-12

申请号：KR20060002379

申请日：2006-01-09

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： KIM SHIN ,  OH SE YONG

IPC: H01L21/60

CPC classification number: H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package with an improved solder joint reliability and a manufacturing method thereof are provided to enhance thermal and mechanical shock characteristics of the semiconductor package itself by using a solder connection part. A semiconductor package includes a PCB(Printed Circuit Board) on which a PSR(Photo Solder Resist) is coated, an adhesive member, a semiconductor chip and a solder connection part. The PCB includes a plurality of metal line layers(107) and a plurality of through holes. The adhesive member(104) is attached on an upper surface of the PCB. The semiconductor chip(102) is electrically connected with the metal line layers of the PCB. The semiconductor chip is mounted on the adhesive member. The solder connection part(110) is filled in the through hole.

Abstract translation: 提供了具有改进的焊点可靠性的半导体封装及其制造方法，以通过使用焊料连接部来提高半导体封装本身的热和机械冲击特性。 半导体封装包括其上涂覆有PSR（光阻焊）的PCB（印刷电路板），粘合构件，半导体芯片和焊料连接部。 PCB包括多个金属线层（107）和多个通孔。 粘合剂构件（104）附着在PCB的上表面上。 半导体芯片（102）与PCB的金属线层电连接。 半导体芯片安装在粘合部件上。 焊料连接部（110）填充在通孔中。

公开(公告)号：KR1020060123775A

公开(公告)日：2006-12-04

申请号：KR1020067018982

申请日：2005-02-15

Applicant: 모토로라 솔루션즈, 인크.

Inventor： 갈,도마스피. ,  파이퍼,마이클 ,  폴락,안토니 ,  포메로이,마이클제이.

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: A vent assembly (50) for an electronic control module (28) is provided. The vent assembly (50) may be adheringly coupled to a printed circuit board (38). The vent assembly (50) being adapted to prevent the ingress of moisture and permit the egress of certain gases.

Abstract translation: 提供了一种用于电子控制模块（28）的排气组件（50）。 排气组件（50）可以附着地联接到印刷电路板（38）。 排气组件（50）适于防止湿气进入并允许某些气体流出。