公开(公告)号：EP1578579B1

公开(公告)日：2009-06-03

申请号：EP03772564.5

申请日：2003-11-20

Applicant: Koninklijke Philips Electronics N.V.

Inventor： BROER, Dirk, J. ,  MOL, Grietje, N. ,  DE WITZ, Christiane, M., R.

IPC: B29C39/00 ,  C08J5/18 ,  B81C1/00 ,  B81B3/00

CPC classification number: B29C37/0053 ,  B29C33/42 ,  B29C43/021 ,  B29C2035/0827 ,  B29L2011/0016 ,  B29L2031/756 ,  B81B3/0035 ,  B81B2201/047 ,  B81C2201/034

Abstract: The invention relates to a micro-mechanical thermal structure for modulating a light beam and a method for manufacturing such a structure. The micro-mechanical structure comprises two layers of material with different thermal expansion coefficients in a first direction and a second direction respectively, in which the first direction is transverse to the second direction and the two layers comprise an oriented polymer and the director of the molecules of the oriented polymer of the first layer is transverse to the director of the molecules of the oriented polymer of the second layer. An array of such micro-mechanical structures may form a thermo-optical modulator for modulating light. The method comprises a step of providing a mold with an orientation-inducing layer to obtain a molecular orientation in a mono-meric state of liquid crystalline monomers and a step of fixing the molecular orientation by photo-polymerization.

公开(公告)号：EP1356511B1

公开(公告)日：2009-01-07

申请号：EP02729355.4

申请日：2002-01-08

Applicant: Silverbrook Research Pty. Limited

Inventor： SILVERBROOK, Kia

IPC: H01L21/822 ,  H01L23/04

CPC classification number: B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

Abstract: Caps (156, 160) are bonded to one or both sides of a wafer (150) to overlay in plan view all or part of a microfabricated device or group of devices (152). One or more etches (164) are applied from the cap side to remove material and to separate the wafer (150) into discrete units.

公开(公告)号：EP1341655B1

公开(公告)日：2008-10-15

申请号：EP01998434.3

申请日：2001-12-03

Applicant: Aquamarijn Holding BV

Inventor： VAN RIJN, Cornelis, Johannes, Maria ,  VOGELAAR, Laura ,  NIJDAM, Wietze ,  BARSEMA, Jonathan, Nathaniel ,  WESSLING, Matthias

IPC: B29C33/00 ,  B01D67/00 ,  B01D69/06 ,  B01D29/01 ,  B29C41/38 ,  B29C67/02

CPC classification number: B01D67/0088 ,  A61F2/06 ,  A61F2002/044 ,  A61F2002/046 ,  A61L27/50 ,  A61L27/56 ,  B01D67/0009 ,  B01D67/0018 ,  B01D67/002 ,  B01D67/0069 ,  B01D67/0072 ,  B01D67/0093 ,  B01D69/00 ,  B01D69/02 ,  B01D69/08 ,  B01D69/12 ,  B01D71/02 ,  B01D71/64 ,  B01D71/68 ,  B01D2323/06 ,  B01D2323/08 ,  B01D2323/30 ,  B01D2325/022 ,  B01D2325/04 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00824 ,  B01J2219/00833 ,  B01J2219/00835 ,  B01J2219/00844 ,  B01J2219/0086 ,  B01J2219/00864 ,  B01J2219/00907 ,  B01L3/0241 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0819 ,  B29C33/0033 ,  B29C41/08 ,  B29C41/38 ,  B29C67/02 ,  B29K2105/0073 ,  B29L2031/737 ,  B81B2201/10 ,  B81C99/008 ,  B81C2201/0115 ,  B81C2201/034 ,  G01N27/44704 ,  H01L31/18 ,  Y10T428/24

Abstract: Using phase separation technique perforated as well as non-perforated polymeric structures can be made with high aspect ratios (>5). By varying the phase separation process the properties (e.g. porous, non-porous, dense, open skin) of the moulded product can be tuned. Applications are described in the field of micro fluidics (e.g. micro arrays, electrophoretic boards), optics, polymeric solar cells, ball grid arrays, and tissue engineering.

公开(公告)号：EP1358489B1

公开(公告)日：2006-12-27

申请号：EP02729357.0

申请日：2002-01-08

Applicant: Silverbrook Research Pty. Limited

Inventor： SILVERBROOK, KIA, Silverbrook Research Pty Ltd

IPC: G01P15/08 ,  H01L21/822 ,  H01L23/04 ,  G01P1/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.

公开(公告)号：EP1655269A1

公开(公告)日：2006-05-10

申请号：EP04722391.2

申请日：2004-03-22

Applicant: Japan Science and Technology Corporation

Inventor： TANAKA, Shuji, 206, 4-22, Hachiman 1-chome ,  ESASHI, Masayoshi, 11-9,Yagiyama-minami 1-chome

IPC: C03B11/00 ,  B81C1/00

CPC classification number: B32B18/00 ,  B81C99/009 ,  B81C2201/034 ,  C03B11/082 ,  C03B11/086 ,  C03B2215/22 ,  C03B2215/32 ,  C03B2215/412 ,  C04B35/565 ,  C04B37/001 ,  C04B37/006 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/123 ,  C04B2237/365 ,  C04B2237/568 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708

Abstract: A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.

Abstract translation: 一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。 在制造玻璃压制模具的这种方法中，通过插入金属薄膜可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

公开(公告)号：EP1358489A4

公开(公告)日：2005-08-10

申请号：EP02729357

申请日：2002-01-08

Applicant: SILVERBROOK RES PTY LTD

Inventor： SILVERBROOK KIA

IPC: B29C35/08 ,  B29C43/36 ,  B81B7/00 ,  B81C1/00 ,  G01P1/02 ,  G01P15/08 ,  H01L23/02 ,  H01L23/08 ,  H01L23/16 ,  H01L23/31 ,  H01L21/822 ,  H01L23/04

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.

公开(公告)号：EP1065378A3

公开(公告)日：2001-05-02

申请号：EP00305389.9

申请日：2000-06-27

Applicant: California Institute of Technology

Inventor： Unger, Marc A. ,  Chou, Hou-Pu ,  Thorsen, Todd A. ,  Scherer, Axel ,  Quake, Stephen R.

IPC: F04B43/04 ,  F15C5/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure for a micropump or valve comprising: forming a first elastomeric layer on top of a first micromachined mold (10), the first micromachined mold (10) having a first raised protrusion (11) which forms a first recess (21) extending along a bottom surface of the first elastomeric layer (20); forming a second elastomeric layer (22) on top of a second micromachined mold, the second micromachined mold having a second raised protrusion (13) which forms a second recess (23) extending along a bottom surface of the second elastomeric layer, bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel (30) forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造用于微型泵或阀门的弹性体结构的方法，包括：在第一微机械加工模具（10）的顶部形成第一弹性体层，所述第一微机械加工模具（10）具有第一凸起突起（11） （21），其沿着所述第一弹性体层（20）的底表面延伸; 在第二微机械加工模具的顶部上形成第二弹性体层（22），所述第二微机械加工模具具有形成沿所述第二弹性体层的底表面延伸的第二凹部（23）的第二凸起突起（13），将所述底部 所述第二弹性体层的表面延伸到所述第一弹性体层的顶表面上，使得在所述第一弹性体层和所述第二弹性体层之间的所述第二凹陷中形成控制通道（30） 以及将第一弹性体层定位在平面基底的顶部上，使得在第一弹性体层和平面基底之间的第一凹陷中形成流动通道。

公开(公告)号：EP0331208A2

公开(公告)日：1989-09-06

申请号：EP89105374.6

申请日：1986-03-18

Applicant: Kernforschungszentrum Karlsruhe GmbH

Inventor： Ehrfeld, Wolfgang, Dr. ,  Hagman, Peter, Dr. ,  Maner, Asim, Dr. ,  Münchmeyer, Dietrich, Dr. ,  Becker, Erwin, Prof. Dr.

IPC: C25D1/10 ,  B01D59/18

CPC classification number: B81C99/008 ,  B81C2201/0128 ,  B81C2201/032 ,  B81C2201/034 ,  C25D1/10

Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen einer Vielzahl plattenförmiger Mikrostrukturkörper aus Metall, bei dem durch wiederholtes Abformen eines die Mikrostrukturen auf­weisenden Werkzeugs mit einer elektrisch isolierenden Abform­masse Negativformen der Mikrotrukturen erzeugt werden, die galvanisch mit einem Metall aufgefüllt werden, wonach die Ne­gativformen entfernt werden, und bei dem die elektrisch iso­lierende Abformmasse mit einer elektrisch leitenden, als Elek­trode für die Galvanik dienenden Schicht verbunden wird, wobei die Dicke der elektrisch isolierenden Abformmasse der Höhe der herzustellenden Mikrostrukturen entspricht. Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Verfahren der gat­tungsgemäßen Art so zu gestalten, daß der Herstellungsaufwwand verringert und damit bessere Voraussetzungen für eine Massen­herstellung geschaffen werden. Zur Lösung schlägt die vorlie­gende Erfindung vor, daß vor dem Abformen eine Schicht (31) aus der elektrisch isolierende Abformmasse mit der Schicht (3) aus elektrisch leitender Abformmasse verbunden wird, und daß das Werkzeug (31) soweit in die Schicht (31) aus der elek­trisch isolierenden Abformmasse eingedrückt wird, bis die Stirnflächen (33a) der Mikrostrukturen (33) des Werkzeugs (31) die Schicht (30) aus elektrisch leitender Abformmasse berüh­ren.

Abstract translation: 本发明涉及一种方法，用于制造多个由金属板形微观结构体，通过重复模制具有与Mikrotrukturen的电绝缘模制化合物的负形式，其中，其被流电填充有金属，随后负模具移除工具的微结构中创建，并且 其中所述电绝缘模制化合物被结合到导电的，用作用于电镀层的电极，其中所述微结构的高度的电绝缘模制化合物的厚度要生产对应。 本发明的目的来设计的一般类型的方法，使得减少Herstellungsaufwwand并创建大规模生产更好的条件。 为了解决本发明提出的是，电绝缘模制化合物与层（3）的层（31）被模制之前，连接在导电印模材料，并且所述工具（31），只要进入的层（31） 电绝缘模制化合物被按压，直到端面（33A）接触的工具（31）导电性模塑复合物的层（30）的所述微结构（33）。

公开(公告)号：WO2019046392A1

公开(公告)日：2019-03-07

申请号：PCT/US2018/048490

申请日：2018-08-29

Applicant: HOOWAKI, LLC

Inventor： HULSEMAN, Ralph A. ,  MCPHERSON, Cameron ,  RAVIKUMAR, Nakul ,  VON WAHLSTATT, Lukas Blucher

IPC: B23H9/00 ,  B29C59/02 ,  B29C33/00 ,  B29C45/00 ,  B29C47/00

CPC classification number: B81C1/00206 ,  B81B2203/0361 ,  B81B2203/0376 ,  B81B2207/056 ,  B81C1/00031 ,  B81C2201/0154 ,  B81C2201/034

Abstract: A method for providing a microstructured surface comprising selecting a material having a desired hardness; selecting a microstructure pattern having an arrangement of microfeatures providing a touch aesthetic to be applied to said material, wherein the width and aspect ratio of the microstructures are configured to provide said touch aesthetic for the hardness of the material selected; selecting said microstructure pattern to further include a physical property independent of said touch aesthetic to be applied to said material, wherein at least one of a pitch and spacing of said microfeatures is configured to provide said physical property; determining the dimensions of said microstructure pattern to be applied to the surface of said material to achieve the desired properties; and, applying the microstructure pattern to said material.

公开(公告)号：WO2013067184A3

公开(公告)日：2013-07-11

申请号：PCT/US2012063066

申请日：2012-11-01

Applicant: 3M INNOVATIVE PROPERTIES CO ,  ZHANG JUN-YING ,  GORMAN MICHAEL R ,  ZHANG HAIYAN ,  JOHNSTON RAYMOND P ,  CARPENTER BARRY S ,  CLARK JOHN C

Inventor： ZHANG JUN-YING ,  GORMAN MICHAEL R ,  ZHANG HAIYAN ,  JOHNSTON RAYMOND P ,  CARPENTER BARRY S ,  CLARK JOHN C

IPC: B81C99/00

CPC classification number: B05B1/14 ,  B81B2203/0353 ,  B81C99/0085 ,  B81C2201/034 ,  Y10T29/4998

Abstract: Methods of making nozzles are disclosed. More specifically, methods of making nozzles that may be used as components of a fuel injection system are disclosed.

Abstract translation: 公开了制造喷嘴的方法。 更具体地，公开了可以用作燃料喷射系统的部件的制造喷嘴的方法。