公开(公告)号：EP1784063A1

公开(公告)日：2007-05-09

申请号：EP05300903.1

申请日：2005-11-08

Applicant: Alcatel Lucent

Inventor： Peulevey, Nicolas ,  Aucourt, Jerome

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/02 ,  H01P5/107

CPC classification number: H05K1/0237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0272 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/043 ,  H05K2201/09981 ,  H05K2203/061 ,  H05K2203/063 ,  H01L2924/00014

Abstract: Circuit board (1) and method of producing thereof, the circuit board having a cavity for microstrip to waveguide transition means (2) defined by a hollow space on the walls of which a protection layer (21) is provided. A microelectronic substrate (33) is placed upon an adhesive film (31) adhered onto a surface of the circuit board (1), the adhesive film being pre-cut in selected areas (32) thereof providing openings therethrough. A metal layer (5) is disposed on the resulting structure, wherein a selected part (51) of the metal layer (5) present on a surface of microelectronics substrate (33), facing the hollow space defined by the cavity for microstrip to waveguide transition means (2) is removed.

Abstract translation: 及其生产的电路板（1）和方法，具有（2）的中空空间中设置保护层（21），其中在墙壁上限定为微带到波导转变装置A空腔电路板上。 一种微电子衬底（33）时的粘合剂膜粘附到所述电路板（1）的表面（31）放置，所述粘合剂膜被预切割成选定区域（32）穿过其设置开口那里。 的金属层（5）设置在所得到的结构，worin金属层（5）的选定部分（51）本（33）的微电子衬底的表面上，对着用于微带到波导由空腔限定的中空空间 过渡装置（2）被除去。

公开(公告)号：EP1355353A3

公开(公告)日：2006-06-28

申请号：EP03252279.9

申请日：2003-03-07

Applicant: Hamilton Sundstrand Corporation

Inventor： Greiner, Ralf ,  Maier, Josef ,  Paintner, Kai ,  Sinning, Richard

IPC: H01L25/16

CPC classification number: H05K3/4614 ,  H01L2224/48472 ,  H01L2924/19107 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/305 ,  H05K3/4629 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2203/049

Abstract: A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

公开(公告)号：EP1460688A3

公开(公告)日：2005-04-27

申请号：EP04006380.2

申请日：2004-03-17

Applicant: Hitachi, Ltd.

Inventor： Ishi, Toshiaki, c/o Hitachi, Ltd., Int. Prop. Gr. ,  Tsuyuno, Nobutake, c/o Hitachi, Ltd., Int. Prop. G ,  Masuda, Mitsuhiro, c/o Hitachi, Ltd., Int. Prop. G ,  Urushiwara, Noriyoshi, c/o Hitachi, Ltd., Int. Pr. ,  Matsushita, Akira, c/o Hitachi, Ltd., Int. Prop.

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/043 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards (12, 13) on which electronic components are mounted. The wiring circuit boards (12, 13) are fixed to a heat sink (14) having a high heat conductivity via an adhesive (9, 10). The entirety of the wiring circuit boards (12, 13) and heat sink (14), as well as a part of an external connection terminal (8) are hermetically sealed and integrally molded by a thermosetting resin composition (7). The electronic circuit apparatus is small and highly reliable and can be provided at low cost.

Abstract translation: 一种在需要高密封性和耐久性的应用中能够保持高散热性和封装密度的树脂密封电子电路装置。 电子电路装置包括至少两个安装电子部件的布线电路板（12,13）。 布线电路板（12,13）通过粘合剂（9,10）固定到具有高导热性的散热器（14）。 整个布线电路板（12,13）和散热片（14）以及外部连接端子（8）的一部分被热固性树脂组合物（7）密封并整体模制。 该电子电路装置小而高度可靠，可以低成本地提供。

公开(公告)号：EP0219627B1

公开(公告)日：1991-06-05

申请号：EP86110664.9

申请日：1986-08-01

Applicant: Oerlikon-Contraves AG

Inventor： Elsener, Josef

IPC: H01L23/52 ,  H01L23/14

CPC classification number: H05K1/021 ,  H01L23/142 ,  H01L23/5383 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/182 ,  H05K1/185 ,  H05K2201/043 ,  H05K2201/0919 ,  H05K2203/049 ,  H01L2924/00

公开(公告)号：EP0219627A1

公开(公告)日：1987-04-29

申请号：EP86110664.9

申请日：1986-08-01

Applicant: Oerlikon-Contraves AG

Inventor： Elsener, Josef

IPC: H01L23/52 ,  H01L23/14

CPC classification number: H05K1/021 ,  H01L23/142 ,  H01L23/5383 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/182 ,  H05K1/185 ,  H05K2201/043 ,  H05K2201/0919 ,  H05K2203/049 ,  H01L2924/00

Abstract: Die elektronischen Halbleiterbauelemente oder Hybridbauelemente (1) der mehrschichtigen gedruckten Schaltungsplatte sind zur Verbesserung der Wärmeableitung und zur Erzielung einer grösseren Packungsdichte gehäuselos unmittelbar auf einer gemeinsamen metallischen Trägerplatte (2) befestigt. Die elektronischen Bauelemente (1) sind jeweils in fensterartigen Aufnahmeöffnungen (8) einer ersten an der Trägerplatte (2) befestigten und mit Leiterschichten (5,9,10,11) versehenen Leiterplatte (6) angeordnet und mit Leitern (4) verbonded. Ein Teil der elektrischen Verbindungen der Schaltungsplatte befindet sich in einer die erste Leiterplatte (6) überdeckenden zweiten, mit einer weiteren Leiterschicht (121 versehenen Leiterplatte (7), durch welche die Aufnahmeöffnungen (8) verschlossen werden. Die einzelnen Leiterschichten (5,9 bis 12) sind mittels durchmetallisierter Verbindungs- und/oder Sacklochbohrungen (14, 14',15) elektrisch miteinander verbunden.

Abstract translation: 为了改善散热并实现更高的封装密度，多层印刷电路板的电子半导体部件或混合部件（1）直接安装在公共金属载体板（2）上，而不会包围。 电子部件（1）分别布置在安装在承载板（2）上并具有导体层（5,9,10,11）的第一导体板（6）的窗状接收开口（8）中，并且分别 结合到导体（4）。 电路板的一些电连接处于覆盖第一导体板（6）的第二导体板（7）中，并且设置有另外的导体层（12）并封闭接收开口（8）。 单个导体层（5,9至12）通过电镀穿通连接孔和/或盲孔（14,14'，15）电连接。

公开(公告)号：EP2220678A4

公开(公告)日：2012-04-25

申请号：EP08756454

申请日：2008-05-29

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H05K1/18 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1916884B1

公开(公告)日：2011-04-06

申请号：EP06022498.7

申请日：2006-10-27

Applicant: Agie Charmilles SA ,  CHARMILLES TECHNOLOGIES S.A.

Inventor： Bühler, Ernst ,  D'Amario, Rino ,  Knaak, Reto

IPC: H05K1/02 ,  H01L23/34

CPC classification number: H01L23/3735 ,  B23H1/02 ,  B23H11/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/10166 ,  Y10T29/49139 ,  Y10T428/24008 ,  H01L2924/00

公开(公告)号：EP1494362A4

公开(公告)日：2010-06-09

申请号：EP03715739

申请日：2003-04-02

Applicant: SONY CORP

Inventor： KAWAKAMI SATORU ,  IMAI TADASHI

IPC: H04B1/08 ,  H04B1/18 ,  H04N5/44 ,  H04N5/50 ,  H04N5/64 ,  H05K1/02 ,  H05K1/14 ,  H05K3/46 ,  H05K9/00

CPC classification number: H05K9/006 ,  H04B1/005 ,  H04B1/08 ,  H04B1/18 ,  H04N5/50 ,  H04N5/64 ,  H04N21/4263 ,  H04N21/6143 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/0715 ,  H05K2201/0723

公开(公告)号：EP1820235B1

公开(公告)日：2008-07-23

申请号：EP04809026.0

申请日：2004-12-01

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： RIVAS, Patrik ,  BERNDTSSON, Andreas

IPC: H01P3/08 ,  H05K1/14 ,  H01R9/00

CPC classification number: H01P3/085 ,  H05K1/0237 ,  H05K1/144 ,  H05K3/325 ,  H05K3/4046 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/10303 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: The present invention relates to a stripline arrangement (10’) comprising a number of stripline layers each comprising a laminate layer (1A, 1B) and conducting layers (2A, 2B, 3A, 3B) provided on each of said laminate layers (1A, 1B), said conducting layers (2A, 2B, 3A, 3B) each comprising a conductive pattern, RF signal (microwave) input and output ports respectively, and an interconnecting arrangement (5) for interconnecting said layers. At least two of said stripline layers are arranged such that a given overlapping zone (L’) is provided between each other facing conducting layers (2A, 2B) of said striplines layers, said interconnecting arrangement (5) comprising a bonding arrangement provided between adjacent and one another facing and overlapping conducting layers (2A, 2B). Connectors (4A, 4B) are provided substantially perpendicularly with respect to an extension plane of the respective stripline layers and crossing said laminate layers (1A, 1B) and conducting layers for, in said overlapping zone, providing contact between the adjacent conducting layers of adjacent stripline layers.

公开(公告)号：EP1480500B1

公开(公告)日：2007-05-16

申请号：EP03011229.6

申请日：2003-05-16

Applicant: Friwo Mobile Power GmbH

Inventor： Bothe, Michael ,  Mörbe, Stefan ,  Becks, Michael ,  Grad, Peter

IPC: H05K1/14 ,  H05K1/16

CPC classification number: H05K1/144 ,  H01F27/2804 ,  H05K1/0306 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/043 ,  H05K2201/1003 ,  H05K2201/10083