公开(公告)号：US5285057A

公开(公告)日：1994-02-08

申请号：US826137

申请日：1992-01-27

Applicant: Masaru Murohara

Inventor： Masaru Murohara

IPC: B42D15/10 ,  G06K19/077 ,  H05K1/02 ,  H05K1/11 ,  G06K19/06

CPC classification number: G06K19/07703 ,  G06K19/07743 ,  H05K1/0271 ,  H05K1/111 ,  H05K2201/09245 ,  H05K2201/09281 ,  H05K2201/10674 ,  Y02P70/611

Abstract: An IC card has a contact portion which is exposed on one surface of a printed circuit board and has multiple terminals provided to electrically contact an external device. Wirings are arranged on the other surface of the printed circuit board at a position facing the contact portion with the printed circuit board in between, and are printed at least at positions opposite to gaps between the terminals. The arrangement of the wirings thus prevents that portion of the IC card at the gaps from becoming thinner than the other portion of the IC card.

Abstract translation: IC卡具有暴露在印刷电路板的一个表面上的接触部分，并且具有多个用于电接触外部设备的端子。 布线布置在印刷电路板的另一个表面上，位于与印刷电路板之间的接触部分的位置上，并且至少打印在与端子之间的间隙相对的位置处。 因此，布线的布置防止IC卡在间隙处的部分变得比IC卡的另一部分薄。

公开(公告)号：US11744011B2

公开(公告)日：2023-08-29

申请号：US17290304

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kenichi Ogawa ,  Naoko Okimoto ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0064 ,  H05K3/1208 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

公开(公告)号：US11688984B2

公开(公告)日：2023-06-27

申请号：US17351652

申请日：2021-06-18

Applicant: TE Connectivity Germany GmbH

Inventor： Dominik Heiss ,  Philipp Kowarsch ,  Tobias Meissner ,  Frank Wittrock

IPC: H01R4/36 ,  H01R27/02 ,  H01R13/50 ,  H01R13/52 ,  H01R13/66 ,  H01R43/20 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58

CPC classification number: H01R27/02 ,  H01R13/50 ,  H01R13/521 ,  H01R13/6683 ,  H01R43/205 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/2009

Abstract: A high-current contact device includes a first contact element transmitting electrical energy, a circuit carrier, a first data contact transmitting data, and a data interface. The first contact element extends through the circuit carrier along a mating axis at a feedthrough. A conductor track of the circuit carrier electrically connects the first data contact to the data interface. A carrier of the circuit carrier is injection-molded and mechanically supports the first data contact, the conductor track, and the data interface.

公开(公告)号：US20190239946A1

公开(公告)日：2019-08-08

申请号：US16246695

申请日：2019-01-14

Applicant: NIPPON MEKTRON, LTD.

Inventor： Akio YOSHIDA ,  Ryoichi TOYOSHIMA ,  Mitsunori SASAKI ,  Hiroyasu HASEGAWA

IPC: A61B18/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/06 ,  H05K3/18

CPC classification number: A61B18/1492 ,  A61B2018/00351 ,  A61B2018/00577 ,  A61B2018/00636 ,  H05K1/118 ,  H05K1/18 ,  H05K3/061 ,  H05K3/188 ,  H05K2201/09027 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09827 ,  H05K2201/10151 ,  H05K2203/0117 ,  H05K2203/0723 ,  H05K2203/1545

Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.

公开(公告)号：US20160156087A1

公开(公告)日：2016-06-02

申请号：US15017812

申请日：2016-02-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro BABA ,  Kuniaki YOSUI

IPC: H01P3/08

CPC classification number: H01P3/082 ,  H01P3/06 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/147 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10189

Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section.

Abstract translation: 高频信号传输线包括元件，设置在元件处并包括第一端和第二端的线性信号线，以及设置在元件处并沿信号线延伸的至少一个接地导体。 元件包括堆叠的绝缘层。 接地导体与信号线相对设置，绝缘层位于它们之间。 接地导体是连续导体。 信号线，接地导体和元件产生特性阻抗。 信号线包括第一部分和第二部分。 第一部分是不间断部分，其在第一端产生大于或等于第一特征阻抗的特征阻抗并且包括第一端。 第二部分产生小于第一特征阻抗的特性阻抗，并且与第一部分相邻。 第二部分比第一部分长。 信号线在第二部分比第一部分宽。

公开(公告)号：US09288905B2

公开(公告)日：2016-03-15

申请号：US14076667

申请日：2013-11-11

Applicant: Seagate Technology LLC

Inventor： Prapan Aparimarn ,  Chaovalit Chiyatan ,  Piriyakorn Jirawattanakasem ,  Joompondej Bamrungwongtaree

IPC: H05K1/00 ,  H05K1/11 ,  G11B5/48 ,  H05K1/05 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  G11B5/486 ,  H05K1/0296 ,  H05K1/056 ,  H05K1/11 ,  H05K3/3436 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09727 ,  Y02P70/611

Abstract: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Abstract translation: 印刷电路基板可以配置有至少一个设计和成形以减少焊料桥接的内部引线。 印刷电路基板可以具有多个内部引线，每个内部引线具有限定隔离通道的连续曲线边界。 隔离通道可以配置有将第一内部引线与相邻的第二内部引线分开的均匀距离。

公开(公告)号：US20150223324A1

公开(公告)日：2015-08-06

申请号：US14483749

申请日：2014-09-11

Applicant: LG INNOTEK CO., LTD.

Inventor： Byeong Seob KIM ,  Ji Sung AHN

IPC: H05K1/02 ,  G06F1/16 ,  G06F3/044

CPC classification number: H05K1/0259 ,  G06F1/1643 ,  G06F3/044 ,  G06F2203/04107 ,  H05K3/361 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09727

Abstract: A touch window includes a substrate, a sensing electrode on the substrate, a wire electrically connected with the sensing electrode, a ground wire adjacent to the wire, and a printed circuit board connected with the wire and the ground wire. An overlap length between the ground wire and the printed circuit board is longer than an overlap length between the wire and the printed circuit board. Alternatively or simultaneously, a line width of the ground wire is wider than an interval or gap between the wire parallel to the printed circuit.

Abstract translation: 触摸窗包括基板，基板上的感测电极，与感测电极电连接的导线，与导线相邻的接地线以及与导线和接地线连接的印刷电路板。 接地线和印刷电路板之间的重叠长度大于导线和印刷电路板之间的重叠长度。 或者或同时地，接地线的线宽比平行于印刷电路的线之间的间隔或间隙宽。

公开(公告)号：US09078361B2

公开(公告)日：2015-07-07

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US20150123137A1

公开(公告)日：2015-05-07

申请号：US14532590

申请日：2014-11-04

Applicant: LG DISPLAY CO., LTD.

Inventor： SeYeoul Kwon ,  Sangcheon Youn ,  Anna Ha

IPC: H01L27/12 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L27/124 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1225 ,  H01L27/1244 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/78696 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/16 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/051 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: Provided is a configuration for a semiconductor layer and a line for reducing the segment length of the semiconductor layer with respect to the bending direction of the flexible substrate. Such a configuration reduces the probability of cracks occurring in the semiconductor layer of the thin-film transistor, thereby improving the stability and durability of the thin-film transistor employed in a curved or a flexible display device. The configuration includes a thin-film transistor (TF) on the flexible substrate. The TFT includes the semiconductor layer extending obliquely with respect to the direction of the line.

Abstract translation: 提供了一种用于半导体层和用于减小半导体层相对于柔性基板的弯曲方向的段长度的配置。 这样的结构降低了在薄膜晶体管的半导体层中发生裂纹的可能性，从而提高了在弯曲或柔性显示装置中使用的薄膜晶体管的稳定性和耐久性。 该配置包括柔性基板上的薄膜晶体管（TF）。 TFT包括相对于线的方向倾斜延伸的半导体层。

公开(公告)号：US20150060111A1

公开(公告)日：2015-03-05

申请号：US14012195

申请日：2013-08-28

Applicant: RONALD STEVEN COK

Inventor： RONALD STEVEN COK

IPC: H05K1/02

CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

Abstract translation: 压印的微结构包括具有与之相关的第一层的衬底。 第一，第二和第三微通道印在第一层中，并且分别位于其中的第一，第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触，并且具有印刷桥微通道，桥接微线与第一和第二连接微线接触并与第三微线分离，使得第一和第二 微线电连接并与第三微线电隔离。