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    Component side printed circuit soldering
    131.
    发明授权
    Component side printed circuit soldering 失效
    组件侧印刷电路焊接

    公开(公告)号：US3726007A

    公开(公告)日：1973-04-10

    申请号：US3726007D

    申请日：1971-02-02

    Applicant: MARTIN MARIETTA CORP

    Inventor： KELLER J

    IPC: B23K3/06 ,  H05K3/30 ,  H05K3/34

    CPC classification number: B23K3/0653 ,  B23K2201/42 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3468 ,  H05K2201/10689 ,  H05K2203/1581 ,  Y10T29/49144

    Abstract: A method of securing at least one multilead electronic component upon a supporting medium in an electrically correct manner, involving the leads of the component to a large extent disposed on the same side of the supporting medium or board as the component, with the component itself being passed through molten solder during the soldering of the component leads to the circuitry of the supporting medium. Because the necessity of through holes in the supporting medium is thus essentially eliminated, the practice of my method can result in the manufacture of circuit boards having an extremely high component density, with this method also making possible the use of wave solder techniques, and therefore the production of high density circuit boards and the like in a very rapid manner. A novel circuit board is also taught herein, involving at least one multilead component placed on a supporting medium with its lead terminations to a large extent located on the same side of the supporting medium as the component itself. Single sided as well as double sided boards of high density can be made in this manner.

    Abstract translation: 一种以电气正确的方式将至少一个多列电子部件固定在支撑介质上的方法，包括部件的引线在很大程度上被设置在与部件一起在支撑介质或板的同一侧上，部件本身是 在组件的焊接期间通过熔融焊料通过支撑介质的电路。 因为基本上消除了支撑介质中的通孔的必要性，所以我的方法的实践可以导致制造具有非常高的组分密度的电路板，这种方法也可以使用波峰焊技术，因此 以非常快速的方式生产高密度电路板等。

    Method of and radiant energy transmissive member for reflow soldering
    132.
    发明授权
    Method of and radiant energy transmissive member for reflow soldering 失效
    用于反射焊接的辐射能量传输方法

    公开(公告)号：US3657508A

    公开(公告)日：1972-04-18

    申请号：US3657508D

    申请日：1970-11-18

    Applicant: WESTERN ELECTRIC CO

    Inventor： STUDNICK WILLIAM R

    IPC: B23K1/005 ,  H05K3/34 ,  B23K1/04

    CPC classification number: H05K3/3494 ,  B23K1/0053 ,  B23K2201/42 ,  H05K2203/304

    Abstract: A radiant energy transmissive member, such as of quartz, is formed with a plurality of peculiarly contoured grooves therein to accommodate, align and facilitate the simultaneous reflow soldering of a plurality of wires or leads to aligned and preferably solder-coated elements, such as circuit path extremities on a printed circuit board. Each groove is contoured such that the solder confined therein, when heated to a molten state, will be drawn at least in part by capillary attraction over the top of the associated wire or lead, with the solder merging on either side with the adjacent element so as to form a reliable fillet-shaped reflow solder connection. Also, by masking one surface of the quartz member so as to be selectively opaque, the radiant energy can be directed more precisely in accordance with a resultant transparent pattern only specific areas to be heated.

    Abstract translation: 诸如石英的辐射能传递元件在其中形成有多个特殊轮廓的凹槽，以容纳，对准和促进多个电线或引线同时回流焊接到对准且优选焊接涂覆的元件，例如电路 印刷电路板上的路径四肢。 每个凹槽的轮廓使得当加热到熔融状态时，限制在其中的焊料将至少部分地通过毛细管吸引在相关联的导线或引线的顶部上被拉伸，焊料在相邻元件的任一侧上合并，因此 以形成可靠的圆角回流焊接。 此外，通过掩盖石英构件的一个表面以便选择性地不透明，可以根据所得到的透明图案更精确地引导辐射能量，仅限制特定的被加热区域。

    Dip-soldering method and apparatus
    135.
    发明授权
    Dip-soldering method and apparatus 失效
    浸焊方法和设备

    公开(公告)号：US3056015A

    公开(公告)日：1962-09-25

    申请号：US5974160

    申请日：1960-09-30

    Applicant: BENDIX CORP

    Inventor： LOVELACE MONTE H

    IPC: B23K3/06

    CPC classification number: B23K3/0653 ,  B23K2201/42

    Abstract: 948,531. Soldering. BENDIX CORPORATION. Sept. 19, 1961 [Sept. 30, 1960], No. 33539/61. Heading B3R. A dip-soldering device comprises means for passing current through a bath of molten solder and means for providing in the region of the bath a magnetic field such that its interaction with the electromagnetic field created by the current produces movement of the bath. A trough 11, Fig. 1, extending across a transport table comprising platforms 12, 13 has its ends closed by insulating blocks 15, 16 supporting electrodes 20, 21 which protrude into the ends of the trough, electrode 20 being connected to an A.C. or D.C. supply 23 by conductor 22 and electrode 21 connected to the supply by conductor 24 beneath the trough. Thermocouples 25, 26 in the trough maintain a constant bath temperature by regulating the applied voltage and fingers 30, 31 on arms 32, 33 sense the level of solder and operate switches in the circuit of a motor or motors, e.g. the motor 43 for feeding solder wire 41 into the trough. A similar solder supply may be provided at the other end of the trough. Fluxed printed circuit boards in carriers 51 are moved over the trough by a drive chain 50 and openings 65 in the platforms are supplied with heated air or nitrogen to pre-heat and postheat the circuit boards-the latter to allow gradual cooling. Current flows through the solder 80, Fig. 2, and returns via conductor 24, the current in the solder melting it and providing a convex meniscus 81 and also producing a flux in opposition to that produced by conductor 24, the force produced tending to rotate the molten solder. Alternatively, a resistance heater extending through the solder and supplied via conductor 24 primarily heats the solder and a small current is passed through the solder by electrodes at each end to produce a field in opposition to the return conductor field. The field produced by the return conductor may be provided alternatively by one or more permanent or electromagnets below the trough, permanent when A.C. is passed through the solder and A.C. electromagnets when D.C. is passed through the solder. In a modification, a quartz block 114, Fig. 3, has a hairpin-shaped trough 111 filled with solder 116 heated and agitated by current passed through the solder by electrodes 120, 121. The legs of solder roll in opposite directions. The solder level may be controlled by a photoelectric device.

    Printed circuit board header attachment station
    138.
    发明授权
    Printed circuit board header attachment station 失效
    印刷电路板插头连接台

    公开(公告)号：US6152353A

    公开(公告)日：2000-11-28

    申请号：US245125

    申请日：1999-01-14

    Applicant: Paymon Sani-Bakhtiari ,  David Lekx

    Inventor： Paymon Sani-Bakhtiari ,  David Lekx

    IPC: B23K1/008 ,  B23K3/00 ,  B23K3/04 ,  H05K3/34 ,  B23K31/02 ,  B23K31/00

    CPC classification number: H05K3/3421 ,  B23K1/008 ,  B23K3/00 ,  B23K3/04 ,  H05K3/3494 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/1003 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/0195 ,  H05K2203/111 ,  H05K3/3415 ,  H05K3/3447 ,  Y02P70/613

    Abstract: The printed circuit board (PCB) header attachment station mounts a header (PCB) onto a PCB having pre-existing solder joints, such as underneath a direct mount IC chip. The apparatus applies a soldering paste to PCB lands configured to receive the pins of the header; nests the header component in stacked alignment with the PCB in order to bring the header pins into contact with the respective PCB lands; heats the PCB to a temperature approaching the reflow temperature of the solder in the pre-existing PCB solder joints; and actuates a compliant heating block or bar to heat the header pins to an extent sufficient for the pins to conduct enough heat to locally reflow the solder on the corresponding PCB lands without reflowing the solder in the pre-existing solder joints. The local reflow of the solder precludes solder reflow in the surrounding pre-existing joints which may coalesce under the direct mount IC chip and render the PCB defective.

    Abstract translation: 印刷电路板（PCB）接头连接站将标头（PCB）安装到具有预先存在的焊点的PCB上，例如直接安装的IC芯片下方。 该设备将焊膏施加到被配置为接收头部的销的PCB焊盘; 将头部组件与PCB堆叠对齐，以使插头插脚与相应的PCB焊盘接触; 将PCB加热到预先存在的PCB焊点中接近焊料回流温度的温度; 并致动符合要求的加热块或棒，以将集管插头加热到足以使引脚传导足够热量的程度，以在相应的PCB焊盘上局部回流焊料，而不回流预先存在的焊点中的焊料。 焊料的局部回流排除了可能在直接安装的IC芯片下聚结的周围预先存在的接头中的回流焊，并使PCB有缺陷。

    Solder column tip compliancy modification for use in a BGA socket connector
    140.
    发明授权
    Solder column tip compliancy modification for use in a BGA socket connector 失效
    用于BGA插座连接器的焊接柱头符合性修改

    公开(公告)号：US6126456A

    公开(公告)日：2000-10-03

    申请号：US400145

    申请日：1999-09-21

    Applicant: Jeffrey S. Campbell ,  Robert W. Nesky

    Inventor： Jeffrey S. Campbell ,  Robert W. Nesky

    IPC: B23K1/00 ,  B23K3/06 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K7/10 ,  H05K1/00

    CPC classification number: B23K3/0607 ,  B23K1/0008 ,  B23K3/0623 ,  H05K3/325 ,  H05K7/1061 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13019

    Abstract: A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.

    Abstract translation: 一种插座连接器系统，用于在第一电路基板和第二电路基板之间形成可分离的电接触。 树突插入件设置在第一电路基板和第二电路基板之间。 焊料体设置在第一电路基板和枝晶插入件之间。 焊料体可以包括几种类型的焊料柱或焊球中的一种。 焊料体具有与枝晶插入件接合的接触端。 接触端有空隙。 当压缩力施加在第一电路基板和第二电路基板上时，接触端的区域与枝晶插入件接合。 这提供了多个接触端的所有区域以接合和形成与接触垫的可靠的电接触。

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