公开(公告)号：CN1299318A

公开(公告)日：2001-06-13

申请号：CN98814120.5

申请日：1998-11-27

Applicant: 波雷坦合成物有限公司

Inventor： Y·科恩 ,  D·瑞恩 ,  L·瓦罕斯基

IPC: B32B27/00 ,  B32B27/12 ,  D03D3/00 ,  D03D15/00 ,  D03D17/00 ,  D03D25/00

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: 一种用于印制电路板或天线的基材的超高分子量聚乙烯(UHMWPE)复合材料(12)。基材包含至少一层由超高分子量聚乙烯复合材料(12)构成的介电层和至少一层由导电材料构成的导电层(16);介电层与导电层是互相紧密地粘合的。

公开(公告)号：CN1029604C

公开(公告)日：1995-08-30

申请号：CN89102268.6

申请日：1989-04-13

Applicant: 出光兴产株式会社

Inventor： 山崎亨明 ,  舟木圭介

IPC: B32B27/08 ,  B32B15/08 ,  C08L25/00 ,  B29D9/00

CPC classification number: B32B27/08 ,  B32B27/30 ,  B32B27/302 ,  B32B2038/0028 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2325/00 ,  G11B5/7305 ,  H01G4/18 ,  H01G4/20 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10S428/91 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31746 ,  Y10T428/31757 ,  Y10T428/31797

Abstract: 公开了一种有一大体上的间同立构构型苯乙烯基聚合物层和一热塑性树脂层的树脂层压片材，一种有一上述苯乙烯基聚合物层和一金属层的敷金属层压片材，和制造上述层压片材的方法。在层压片材中，苯乙烯基聚合物层和热塑性树脂层可以是双轴向拉伸的。预计这类层压片材可用来作静电电容器、挠性印刷电路底片、包装食品薄膜和包括磁带和装饰用薄膜在内的各种用途的薄膜。

公开(公告)号：CN1037483A

公开(公告)日：1989-11-29

申请号：CN89102268.6

申请日：1989-04-13

Applicant: 出光興产株式会社

Inventor： 山崎亨明 ,  舟木圭介

IPC: B32B27/08 ,  B32B15/08 ,  C08L25/00 ,  B29D9/00 ,  B29L23/00

CPC classification number: B32B27/08 ,  B32B27/30 ,  B32B27/302 ,  B32B2038/0028 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2325/00 ,  G11B5/7305 ,  H01G4/18 ,  H01G4/20 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10S428/91 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31746 ,  Y10T428/31757 ,  Y10T428/31797

Abstract: 公开了一种有一大体上的间同立构构型苯乙烯基聚合物层和一热塑性树脂层的树脂层压片材，一种有一上述苯乙烯基聚合物层和一金属层的敷金属层压片材，和制造上述层压片材的方法。在层压片材中，苯乙烯基聚合物层和热塑性树脂层可以是双轴向拉伸的。预计这类层压片材可用来作静电电容器、挠性印刷电路底片、包装食品薄膜和包括磁带和装饰用薄膜在内的各种用途的薄膜。

公开(公告)号：NO895178A

公开(公告)日：1990-06-25

申请号：NO895178

申请日：1989-12-21

Applicant: GOODRICH CO B F

Inventor： BENEDIKT GEORGE M ,  ALEKSA DAVID M ,  TENNEY LINWOOD P

IPC: B32B15/08 ,  B05D1/18 ,  B32B3/12 ,  B32B7/02 ,  B32B9/00 ,  B32B15/14 ,  C08G61/08 ,  C08J5/12 ,  C08J5/24 ,  H01B3/30 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B7/04 ,  H05K1/02

CPC classification number: C08J5/128 ,  B32B3/12 ,  B32B15/14 ,  C08G61/08 ,  C08J5/24 ,  C08J2365/00 ,  H01B3/30 ,  H05K1/032 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/0723

公开(公告)号：US11993740B2

公开(公告)日：2024-05-28

申请号：US17508218

申请日：2021-10-22

Applicant: KANEKA CORPORATION

Inventor： Yuichi Imamura ,  Keisuke Oguma ,  Masayoshi Kido

IPC: G02F1/1333 ,  C09K19/02 ,  C09K19/38 ,  C09K19/54 ,  H05K1/02 ,  C08F255/02 ,  C08L51/00

CPC classification number: C09K19/38 ,  C09K19/02 ,  C09K19/542 ,  H05K1/024 ,  C08F255/023 ,  C08L51/003 ,  C09K2219/03 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0183

Abstract: The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.

公开(公告)号：US11930595B2

公开(公告)日：2024-03-12

申请号：US17162122

申请日：2021-01-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Weifeng Yin ,  Cui Huo ,  Rui Liu ,  Yongjing Xu ,  Shanyin Yan

IPC: H05K1/03 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/08

CPC classification number: H05K1/0373 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/085 ,  C09J2203/326 ,  H05K2201/0158 ,  H05K2201/0195

Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.

公开(公告)号：US11643586B2

公开(公告)日：2023-05-09

申请号：US17040733

申请日：2019-03-26

Applicant: SHPP Global Technologies B.V.

Inventor： Jian Wang ,  Shijie Song ,  Yaqin Zhang

IPC: C09K5/14 ,  C08J3/20 ,  C08L71/12 ,  H05K1/02 ,  H05K1/03

CPC classification number: C09K5/14 ,  C08J3/203 ,  C08L71/123 ,  H05K1/024 ,  H05K1/0373 ,  C08L2203/20 ,  C08L2205/035 ,  C08L2207/066 ,  H05K2201/0158

Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US20180332720A1

公开(公告)日：2018-11-15

申请号：US16031748

申请日：2018-07-10

Applicant: Amphenol Corporation

Inventor： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC: H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/20

CPC classification number: H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

公开(公告)号：US20180288296A1

公开(公告)日：2018-10-04

申请号：US15705217

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  H05K1/02 ,  G02B5/20 ,  G02B7/00 ,  G02B7/02 ,  H04M1/02 ,  H05K1/18 ,  G02B3/00 ,  H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20180012923A1

公开(公告)日：2018-01-11

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.