公开(公告)号：EP2782432A3

公开(公告)日：2017-02-01

申请号：EP14158571.1

申请日：2014-03-10

Applicant: Kabushiki Kaisha Toyota Jidoshokki

Inventor： HIGASHIKAWA, Naoki ,  KONTANI, Kazuyoshi

IPC: H05K7/14 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K7/142 ,  H05K2201/041

Abstract: A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant" spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding portions to each other, a branch portion which extends toward a predetermined position between the two substrates from the frame body portion or the spacer member holding portions, and electrode holding portions which are provided at the branch portions, and hold electrodes at the predetermined positions.

公开(公告)号：EP3112977A1

公开(公告)日：2017-01-04

申请号：EP16150214.1

申请日：2016-01-05

Applicant: LG Electronics Inc.

Inventor： LEE, Joseph ,  KIM, Byungsoo

IPC: G06F1/20

CPC classification number: H05K7/20963 ,  G02F1/13452 ,  G06F1/203 ,  H04B1/3888 ,  H05K1/148 ,  H05K5/0017 ,  H05K2201/041 ,  H05K2201/05 ,  H05K2201/10128

Abstract: There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.

Abstract translation: 公开了一种移动终端，其包括：显示单元，其包括设置在预定部分中的驱动IC，设置在显示单元的后表面中的框架，柔性印刷电路板，其一部分连接到显示单元的驱动IC， 另一部分朝向显示单元的后表面弯曲;主板，联接到框架并被配置为经由柔性印刷电路板控制驱动IC;以及传热片，构造为覆盖显示单元的前表面，以及 所述柔性印刷电路板的所述第一表面的预定部分，其中所述传热片的至少预定部分与所述框架接触，使得在所述驱动IC和所述显示单元的光源中产生的热量可以是 转移到该框架，并且由于局部过热导致的移动终端的性能恶化可能降低并且用户握住移动设备的困难 终端也可能会减少。

公开(公告)号：EP3043382A1

公开(公告)日：2016-07-13

申请号：EP15200529.4

申请日：2015-12-16

Applicant: Delphi Technologies, Inc.

Inventor： ZIMMERMAN, David W. ,  SEARCY, James F. ,  DELHEIMER, Charles I.

IPC: H01L23/66 ,  H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K1/18 ,  H01P5/08 ,  H01Q1/38

CPC classification number: H01Q1/50 ,  H01L23/66 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q21/065 ,  H05K1/02 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/184 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10007 ,  H05K2201/10098 ,  H05K2203/049 ,  H01L2924/00

Abstract: A circuit board assembly (10) includes a low-frequency (LF) substrate (12), a monolithic microwave integrated circuit (MMIC (22)), electrical components (26), a high-frequency (HF) substrate (30), and an antenna (46). The LF substrate (12) is formed of FR-4 type material. The LF substrate (12) defines a waveguide (18) through the LFsubstrate (12). The MMIC (22) is attached to the top-side (14) of the LF substrate (12) and outputs a radio-frequency signal (20). The electrical components (26) are electrically attached to the LF substrate (12). The HF substrate (30) is soldered to the top side of the LF substrate (12). An opening (38) through the HF substrate (30) surrounds the MMIC (22). A vertical transition (44) guides the radio-frequency signal (20) output by the MMIC (22) to the waveguide (18). A plurality of wire bonds (40) electrically connects the MMIC (22) to the HF substrate (30) and couple the radio-frequency signal (20) from the MMIC (22) to the vertical transition (44). The antenna (46) is attached to the LF substrate (12) and configured to radiate the radio-frequency signal (20) from the waveguide (18).

Abstract translation: 电路板组件（10）包括低频（LF）衬底（12），单片微波集成电路（MMIC（22）），电气部件（26），高频（HF）衬底（30） 和天线（46）。 LF基板（12）由FR-4型材料形成。 LF衬底（12）通过LF衬底（12）限定波导（18）。 MMIC（22）附接到LF衬底（12）的顶侧（14）并输出射频信号（20）。 电气部件（26）电连接到LF基板（12）。 HF基板（30）被焊接到LF基板（12）的顶侧。 通过HF衬底（30）的开口（38）围绕MMIC（22）。 垂直转换（44）将由MMIC（22）输出的射频信号（20）引导到波导（18）。 多个引线键合（40）将MMIC（22）电连接到HF衬底（30）并将射频信号（20）从MMIC（22）耦合到垂直转变（44）。 所述天线（46）附接到所述LF衬底（12）并且被配置为从所述波导（18）辐射所述射频信号（20）。

公开(公告)号：EP2566298A4

公开(公告)日：2015-12-16

申请号：EP11775043

申请日：2011-04-27

Applicant: LUMIOTEC INC

Inventor： KAGOTANI AKIHITO ,  ARISAWA MAKOTO ,  KAMADA HIDEKI

IPC: H05B33/06 ,  B32B17/10 ,  F21V29/74 ,  H01L51/52 ,  H05B33/04 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05B33/06 ,  B32B17/10036 ,  B32B17/10541 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/20 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/529 ,  H01L2251/5361 ,  H05B33/02 ,  H05B33/04 ,  H05K1/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/09836 ,  H05K2201/10128

Abstract: Disclosed is an organic EL illumination device-which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)-wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.

公开(公告)号：EP2804452A3

公开(公告)日：2014-12-24

申请号：EP14163650.6

申请日：2014-04-07

Applicant: Panasonic Corporation

Inventor： IWAO, Seiichi ,  ASAKAWA, Koji ,  IBUKI, Yasuo ,  NISHIMURA, Shinji ,  WATANABE, Kazunori

IPC: H05K3/28 ,  H05K3/36 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K3/281 ,  H05K1/141 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10371

Abstract: A wiring board (20) includes a component-side patters (23) formed on a components mounting surface (22), a board-side pattern (25) is formed on a board mounting surface (24), a through hole via (26) electrically connecting the component-side pattern (23) and the board-side pattern (25). An electric insulation sheet (30) is adhered to the board mounting surface (24) to cover the through hole via (26) in the board mounting surface (24).

公开(公告)号：EP2792223A1

公开(公告)日：2014-10-22

申请号：EP12806408.6

申请日：2012-12-11

Applicant: Thales

Inventor： LEDAIN, Bernard ,  HENRIOT, Dominique ,  KERTESZ, Philippe

IPC: H05K3/46

CPC classification number: H05K3/4623 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4614 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49124

Abstract: The invention relates to a process for producing a printed circuit board comprising at least two elementary circuits (CE1, CE2) drilled with metallised holes (T
CE1 ) the apertures of which are covered with a first metal and at least one first intermediate layer (Cl1) made of a compressible material drilled with holes (T
C11 ) opposite elementary circuits (CE1, CE2) and the apertures of which are covered with a second metal, said first intermediate layer (Cl1) being placed between the two elementary circuits (CE1, CE2) and brazed to each of the circuits (CE1, CE2) by thermal diffusion of two metals forming an alloy at an alloy formation temperature (T). At least two second intermediate thermoplastic layers (CI2a, CI2b) having a melting point (Tf) above the alloy formation temperature (T) are provided between the first intermediate layer (Cl1) and said elementary circuits (CE1, CE2), these second layers not covering the first and second metal.

Abstract translation: 本发明涉及一种用于制造印刷电路板的方法，该印刷电路板包括至少两个钻有金属化孔（T CE1）的基本电路（CE1，CE2），其孔隙用第一金属和至少一个第一中间层（C1 1 ）由可钻孔的可压缩材料制成，所述可钻孔具有与基本电路（CE1，CE2）相对的孔（T C11）并且其孔隙被第二金属覆盖，所述第一中间层（C1 1）位于两个基本电路（CE1， CE2）并且通过在合金形成温度（T）下形成合金的两种金属的热扩散钎焊到每个电路（CE1，CE2）。 在第一中间层（Cl1）和所述基本电路（CE1，CE2）之间提供具有高于合金形成温度（T）的熔点（Tf）的至少两个第二中间热塑性塑料层（CI2a，CI2b），这些第二层 不覆盖第一和第二金属。

公开(公告)号：EP2635097A1

公开(公告)日：2013-09-04

申请号：EP12157276.2

申请日：2012-02-28

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Jeanneteau, Laurent ,  Rigolle, Thibaut ,  Viroli, Alex ,  Fattorini, Andrea

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/40 ,  H05K1/05

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及到电气和/或电子电路，其包括印刷电路板（20），至少一个单独的电路板（10）和至少一个电源连接器（12），用于所述印刷电路板（20）。 该至少一个电源连接器（12）连接或可连接到相应的配对。 （22）一种数电气和/或电子组件中的单独的电路板（10）被出售。 所述至少一个单独的电路板（10）是由多个焊点（16）连接到印刷电路板（20）。 焊点（16）通过的通孔的技术连接到单独电路板（10）。 焊点（16）由SMD连接到印刷电路板（20）（表面安装器件）技术。 至少一个电源连接器（12）是在单独的电路板（10）通过的通孔技术夯实。

公开(公告)号：EP2615890A1

公开(公告)日：2013-07-17

申请号：EP12195946.4

申请日：2012-12-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Hong, Sungwon

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K3/368 ,  H05K1/144 ,  H05K3/403 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49124

Abstract: A circuit board having a board-to-board connector and a method of manufacturing the same are provided. The circuit board includes at least one of a recess and a hole having a connection portion exposed to be electrically connected to a connection portion of a connector header of another circuit board, a terminal on the circuit board, and a conduction line for connecting the terminal and the connection portion. Thereby, a cost and required space for a board-to-board connection can be reduced.

Abstract translation: 提供了具有板对板连接器的电路板及其制造方法。 电路板包括凹部和孔中的至少一个，具有暴露于电连接到另一个电路板的连接器插头的连接部分的连接部分，电路板上的端子和用于连接端子的导线 和连接部分。 因此，可以降低板对板连接的成本和所需的空间。

公开(公告)号：EP2559327A1

公开(公告)日：2013-02-20

申请号：EP11730863.5

申请日：2011-04-11

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Johannes ,  LEITGEB, Markus

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: - providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), - arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and - connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract translation: 一种用于INTEGRA廷方法的部件到印刷电路板，包括以下步骤：提供两个完成印刷电路板元件，其更特别地由相互连接的板层或层中的多个，worin至少一个印刷电路板元件具有切口或凹陷 ，安排部件到印刷电路板元件中的一个或在所述至少一个印刷电路板元件的切口被集成，以及连接与所述部件的印刷电路板元件被容纳在该切口中，作为结果 有可能在一个印刷电路板，以获得组件或传感器的安全和可靠的住宿。 进一步，提供了一种这种类型的，其包括集成在其中的电子元件的的印刷电路板。

公开(公告)号：EP0213675A2

公开(公告)日：1987-03-11

申请号：EP86201452.9

申请日：1986-08-22

Applicant: PHILIPS ELECTRONICS UK LIMITED ,  Philips Electronics N.V.

Inventor： Francis, Leslie Herbert ,  Baker, Robert John

IPC: H01J29/92 ,  H01B7/08

CPC classification number: H01J29/92 ,  H01J2329/00 ,  H05K1/118 ,  H05K3/4046 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/10401

Abstract: A cathode ray tube has a thin flexible circuit (48) comprising one or more films of polyimide with a plurality of conductive tracks deposited directly thereon for establishing electrical connection between a multi-pin leadthrough (45) passing through the wall of the tube's envelope (31) and terminals of electrically operable components within the envelope, e.g. electron gun (35) and beam-deflection electrodes (36,39 and 40). A number of track-carrying films may be stacked together to form a laminate structure. Such a flexible circuit avoids outgassing problems and, being thin and flexible, occupies minimal space and is easily routed around internal components to ease assembly

Abstract translation: 阴极射线管具有薄的柔性电路（48），该电路包括一个或多个聚酰亚胺薄膜，多个直接沉积在其上的导电线路用于在穿过管子外壳壁的多引脚引线（45）之间建立电连接 （例如31）和电可操作部件的端子， 电子枪（35）和射束偏转电极（36,39和40）。 多个轨道承载膜可以堆叠在一起以形成层压结构。 这种柔性电路避免了放气问题，并且薄且灵活，占用最小的空间并且易于围绕内部组件布线以便于组装