公开(公告)号：US06523253B1

公开(公告)日：2003-02-25

申请号：US09583927

申请日：2000-05-31

Applicant: Joe A. Harrison ,  Edward R. Stanford

Inventor： Joe A. Harrison ,  Edward R. Stanford

IPC: H05K330

CPC classification number: G06F1/189 ,  G06F1/183 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10325 ,  H05K2201/10734 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49169

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract translation: 用于向处理器传送电力的系统使得DC-DC转换器基板能够在Z轴方向上固定到处理器载体。 与转换器以大致平行于母板表面的方向插入处理器载体的系统相比，以这种方式将转换器组装到处理器的能力便于组装。

公开(公告)号：US20020040811A1

公开(公告)日：2002-04-11

申请号：US10005464

申请日：2001-12-03

Inventor： Joe A. Harrison ,  Edward R. Stanford ,  Thomas G. Ruttan

IPC: H05K001/16 ,  H05K001/00 ,  H01R012/00

CPC classification number: H05K1/141 ,  G06F1/189 ,  H05K1/0263 ,  H05K3/325 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09345 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract translation: 用于向处理器传送电力的系统使得DC-DC转换器基板能够在Z轴方向上固定到处理器载体。 与转换器以大致平行于母板表面的方向插入处理器载体的系统相比，以这种方式将转换器组装到处理器的能力便于组装。

公开(公告)号：US20180042110A1

公开(公告)日：2018-02-08

申请号：US15668460

申请日：2017-08-03

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: H05K1/18 ,  H01L23/00 ,  H01G4/38 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/683 ,  H01L21/48

CPC classification number: H05K1/18 ,  H01G4/33 ,  H01G4/38 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/02 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/02311 ,  H01L2224/02371 ,  H01L2224/02381 ,  H01L2225/1035 ,  H01L2225/1076 ,  H05K1/141 ,  H05K1/144 ,  H05K1/162 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/045 ,  H05K2201/09672 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/2072 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/302 ,  H05K2203/308

Abstract: A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive connection posts protrude from the component substrate. One or more electrically conductive component contact pads are exposed on or over the component substrate on a side of the component substrate opposite the one or more connection posts. The one or more component contact pads and the one or more electrically conductive connection posts are both electrically connected to the circuit. The components can be printed onto a destination substrate and electrically connected to contact pads on the destination substrate through the connection posts. The components can also be printed onto other components and electrically connected through the connection posts and component contact pads to form a three-dimensional electronic structure.

公开(公告)号：US09693459B2

公开(公告)日：2017-06-27

申请号：US14801422

申请日：2015-07-16

Applicant: Delphi Technologies, Inc.

Inventor： Rodrigo Franco

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K1/144 ,  H05K1/111 ,  H05K1/115 ,  H05K1/14 ,  H05K1/141 ,  H05K1/145 ,  H05K1/181 ,  H05K1/183 ,  H05K3/32 ,  H05K3/3442 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/095 ,  H05K2201/10166 ,  H05K2201/10727

Abstract: The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board.

公开(公告)号：US20160105984A1

公开(公告)日：2016-04-14

申请号：US14857536

申请日：2015-09-17

Applicant: International Rectifier Corporation

Inventor： Eung San Cho ,  Thomas J. Ribarich ,  Dean Fernando ,  Kevin Moody ,  Dae Keun Park ,  Chuan Cheah

IPC: H05K7/10 ,  H01R12/70

CPC classification number: H05K7/1092 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/41113 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/13091 ,  H01L2924/181 ,  H01R12/7076 ,  H02M3/145 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/045 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/37099 ,  H01L2924/206

Abstract: In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board.

Abstract translation: 在一个实施方式中，用于插入母板的功率单元包括位于基板上的功率模块。 基板位于导电板条上，每个板材的延伸端远离电源模块。 每个导电板条提供动力单元的安装接触。 每个安装触头通过在基板中的电路径电耦合到功率模块。 安装触头被配置为在电源模块和母板之间提供电连接。

公开(公告)号：US20150330772A1

公开(公告)日：2015-11-19

申请号：US14279214

申请日：2014-05-15

Applicant: Nataporn Charusabha ,  Noppadol Keawcharoensook

Inventor： Nataporn Charusabha ,  Noppadol Keawcharoensook

IPC: G01B11/14 ,  H05K3/36 ,  H05K3/32

CPC classification number: G01B11/14 ,  H05K1/144 ,  H05K3/284 ,  H05K3/32 ,  H05K3/36 ,  H05K2201/045 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  Y10T29/49128 ,  Y10T29/49147

Abstract: A proximity sensor comprising a light emitter and light detector each encapsulated by a molded light transmissive component. The light transmissive components can be separated by a molded light blocking component, and the light detector can be mounted on a daughterboard, such that the light blocking component and daughterboard can inhibit the transmission of light between the light emitter and light detector to limit crosstalk.

Abstract translation: 一种接近传感器，包括光发射器和光检测器，每个由模制的透光部件封装。 透光部件可以通过模制遮光部件分离，并且光检测器可以安装在子板上，使得遮光部件和子板可以抑制光发射器和光检测器之间的光的传输，以限制串扰。

公开(公告)号：US20130164952A1

公开(公告)日：2013-06-27

申请号：US13339412

申请日：2011-12-29

Applicant: KANG WU ,  BO TIAN

Inventor： KANG WU ,  BO TIAN

IPC: H01R12/73

CPC classification number: G06F1/185 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A display card assembly includes a display card with a first circuit board, a straight through connector, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, first ground pins, and first signal pins. A second edge connector connected to the straight through connector is arranged on an end edge of the first circuit board adjoining the bottom edge and includes second power pins connected to the first power pins, second ground pins, and second signal pins connected to the control chip. A third edge connector engaged in the straight through connector is arranged on an end edge of the second circuit board and includes third power pins and third signal pins connected to the second storage chips, and third ground pins.

Abstract translation: 显示卡组件包括具有第一电路板的显示卡，直通连接器和具有第二电路板的扩展卡。 第一边缘连接器布置在第一电路板的底部边缘上，并且包括连接到控制芯片和第一存储芯片，第一接地引脚和第一信号引脚的第一电源引脚。 连接到直通连接器的第二边缘连接器布置在邻接底边缘的第一电路板的端边缘上，并且包括连接到连接到控制芯片的第一电源引脚，第二接地引脚和第二信号引脚的第二电源引脚 。 接合在直通连接器中的第三边缘连接器布置在第二电路板的端边缘上，并且包括连接到第二存储芯片的第三电源引脚和第三信号引脚以及第三接地引脚。

公开(公告)号：US08144473B2

公开(公告)日：2012-03-27

申请号：US12913136

申请日：2010-10-27

Applicant: Masanori Yumoto ,  Yoshihisa Hirano ,  Chiaki Imaeda

Inventor： Masanori Yumoto ,  Yoshihisa Hirano ,  Chiaki Imaeda

IPC: H05K1/00

CPC classification number: G02F1/13452 ,  G02F1/133615 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/045 ,  H05K2201/055

Abstract: An electro-optical apparatus comprising an electro-optical panel including a display section, a flexible printed circuit board, and a rigid circuit board. The flexible printed circuit board includes a first terminal connected to the electro-optical panel and a second terminal connected to an external circuit. The rigid circuit board includes a first surface on which electronic components are mounted and a second surface mounted to the flexible printed circuit board. The second surface of the rigid circuit board is opposite to the first surface. An entirety of the rigid circuit board is stacked on the flexible printed circuit board within the flexible printed circuit board. The rigid circuit board is electrically connected to the flexible printed circuit board. The flexible printed circuit board is bent toward the external circuit.

Abstract translation: 一种电光装置，包括包括显示部分，柔性印刷电路板和刚性电路板的电光面板。 柔性印刷电路板包括连接到电光面板的第一端子和连接到外部电路的第二端子。 刚性电路板包括安装有电子部件的第一表面和安装到柔性印刷电路板的第二表面。 刚性电路板的第二表面与第一表面相对。 整个刚性电路板堆叠在柔性印刷电路板上的柔性印刷电路板上。 刚性电路板电连接到柔性印刷电路板。 柔性印刷电路板向外部电路弯曲。

公开(公告)号：US08027570B2

公开(公告)日：2011-09-27

申请号：US11642863

申请日：2006-12-21

Applicant: Tomokazu Sugamura ,  Masuo Ogawa

Inventor： Tomokazu Sugamura ,  Masuo Ogawa

IPC: H04N5/77

CPC classification number: H04N5/64 ,  B82Y20/00 ,  G11B31/00 ,  G11B33/10 ,  G11B33/12 ,  H04N21/42646 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/048

Abstract: A disk unit-integrated display capable of increase in conveyance efficiency and reduce in conveyance cost of a disk unit, a holding member and a first circuit board unitized with each other can be obtained. This disk unit-integrated display includes the disk unit having a drive portion, the holding member for supporting the disk unit, the first circuit board arranged between the disk unit and the holding member and having an opening at a position corresponding to the drive portion of the disk unit.

Abstract translation: 可以获得能够提高输送效率并降低盘单元，保持构件和彼此组合的第一电路板的输送成本的盘单元集成显示器。 该盘单元集成显示器包括具有驱动部分的盘单元，用于支撑盘单元的保持构件，布置在盘单元和保持构件之间的第一电路板，并且在与驱动部分的驱动部分相对应的位置处具有开口 磁盘单元。

公开(公告)号：US07800918B2

公开(公告)日：2010-09-21

申请号：US11145009

申请日：2005-06-06

Applicant: Takanori Saeki

Inventor： Takanori Saeki

IPC: H05K1/11 ,  H05K1/14

CPC classification number: G11C5/066 ,  G06F13/1684 ,  G11C5/04 ,  H05K1/14 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10159 ,  Y02D10/14

Abstract: There is provided a memory module that facilitates meeting the needs of high-speed performance and large capacity. It comprises first module substrates (101 through 108), each with multiple DRAM devices (11), and a second module substrate whereon the first modules (101 through 108) are mounted, signal line groups connected to the multiple first modules respectively are provided in parallel, and a controller LSI (50), connected to the multiple first modules respectively via the signal line groups provided in parallel, that converts the signal lines into fewer signal lines than the total number of the signal line groups and outputs the result is provided, and the second module substrate (20) is mounted on a motherboard (40).

Abstract translation: 提供了一个可以满足高速性能和大容量需求的内存模块。 它包括第一模块基板（101至108），每个具有多个DRAM器件（11）以及第一模块（101至108）安装在其上的第二模块基板，分别连接到多个第一模块的信号线组分别设置在 并联的控制器LSI（50），分别经由并联设置的信号线组连接到多个第一模块，将信号线转换成比信号线组的总数少的信号线，并输出结果 ，并且第二模块基板（20）安装在母板（40）上。