公开(公告)号：EP2680678A4

公开(公告)日：2015-03-18

申请号：EP11861583

申请日：2011-03-29

Applicant: DOWA METALS & MINING CO LTD

Inventor： OSANAI HIDEYO ,  TAKAHASHI TAKAYUKI ,  IDEGUCHI SATORU ,  KOTANI HIROTAKA

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/053 ,  B22D19/0081 ,  B22D19/04 ,  H01L21/481 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/09136 ,  H05K2201/2009 ,  H05K2203/128 ,  Y10T428/12618 ,  Y10T428/2457 ,  Y10T428/2462 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

公开(公告)号：EP2269216B1

公开(公告)日：2014-12-24

申请号：EP09721759.0

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： TOPACIO, Roden ,  ZBRZEZNY, Adam

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

公开(公告)号：EP2696128A1

公开(公告)日：2014-02-12

申请号：EP12193949.0

申请日：2012-11-23

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Shibusawa, Soichi ,  Hayashida, Yumiko

IPC: F21K99/00 ,  F21V23/00 ,  F21S8/04 ,  F21Y101/02

CPC classification number: F21V21/00 ,  F21K9/27 ,  F21K9/278 ,  F21K9/90 ,  F21S8/04 ,  F21V11/00 ,  F21V23/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/0355 ,  H05K2201/09136 ,  H05K2201/10106 ,  Y10T29/49002 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A device (11) of an embodiment includes a plurality of substrates (21) connected end to end along a predetermined direction. Then, the device of the embodiment includes a plurality of light-emitting elements (45) mounted on each of the substrates and aligned in the predetermined direction, a mounting interval of the light-emitting elements on one of the substrates is different from a mounting interval of the light-emitting elements on another of the substrates.

Abstract translation: 实施例的装置（11）包括沿预定方向端对端连接的多个基板（21）。 然后，本实施例的装置包括安装在每个基板上并沿预定方向排列的多个发光元件（45），其中一个基板上的发光元件的安装间隔与安装 发光元件在另一个基板上的间隔。

公开(公告)号：EP2672789A2

公开(公告)日：2013-12-11

申请号：EP13161463.8

申请日：2013-03-27

Applicant: General Electric Company

Inventor： McConnelee, Paul Alan ,  Burke, Elizabeth Ann ,  Smith, Scott

IPC: H05K1/18 ,  H01L25/10 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H01L21/60 ,  H01L23/538

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L25/105 ,  H01L2021/60 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/467 ,  H05K3/4673 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09136 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method of forming a buried die module includes providing an initial laminate flex layer 18 and forming a die opening 28 through the initial laminate flex layer. A first uncut laminate flex layer 32 is secured to the first surface 14 of the initial laminate flex layer 18 by way of an adhesive material and a die 30 is positioned within the die opening of the initial laminate flex layer and onto the adhesive material. A second uncut laminate flex layer 38 is secured to the second surface 26 of the initial laminate flex layer 18 by way of an adhesive material and the adhesive material between the first uncut laminate flex layer 32 and the initial laminate flex layer and between the second uncut laminate flex layer 38 and the initial laminate flex layer 18 is cured. A plurality of vias 20 and metal interconnects 22 are formed in and on the first and second uncut laminate flex layers 32,38 with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer 18 or a die pad on the die 30.

Abstract translation: 形成埋入模具模块的方法包括提供初始层压柔性层18并通过初始层叠柔性层形成模具开口28。 第一未切割层压柔性层32通过粘合剂材料固定到初始层压柔性层18的第一表面14，并且模具30定位在初始层压柔性层的模具开口内并粘附到粘合剂材料上。 第二未切割层压板柔性层38通过粘合剂材料固定到初始层叠柔性层18的第二表面26上，并且第一未切割层压板柔性层32和初始层压板柔性层之间以及第二未切割层之间的粘合材料 层压柔性层38和初始层压柔性层18固化。 多个通孔20和金属互连22形成在第一和第二未切割层压柔性层32,38内和第二未切割层压柔性层32,38之间，其中每个金属互连件延伸通过相应的通孔并直接金属化到初始层压柔性层上的金属互连 18或管芯30上的管芯焊盘。

公开(公告)号：EP2278864A4

公开(公告)日：2011-09-14

申请号：EP09735831

申请日：2009-04-24

Applicant: NEC CORP

Inventor： YUGAMI KAZUYUKI ,  FURUSAWA KOJI

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09136 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP2019572A3

公开(公告)日：2010-10-20

申请号：EP08013359.8

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Kawabata, Kenichi

IPC: H05K3/00 ,  H01L23/538

CPC classification number: H05K3/0052 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/0169 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2224/82 ,  H01L2924/00

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

Abstract translation: 本发明的目的是提供一种易于处理并能够抑制翘曲发生并且提供高生产率和经济效率的组装基板及其制造方法。 工作板100在基本上矩形的基板11的一个表面上包括绝缘层21，并且电子部件41和板状集成框架51嵌入绝缘层21的内部。板状集成框架51具有 多个凹部53在其内周壁52a处平行布置，并且布置在电子部件41的非放置区域上以围绕多个电子部件41（组）。

公开(公告)号：EP3346320A1

公开(公告)日：2018-07-11

申请号：EP16841119.7

申请日：2016-08-30

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KUMAMOTO, Yasuhiro ,  SHINYA, Takeichi ,  HIGA, Koujirou ,  OFUJI, Masaaki ,  TAKEUCHI, Taizou ,  KUGIMARU, Tadahiro ,  SHIMOTAYA, Ryou

IPC: G02F1/133 ,  F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  F21V23/06 ,  G02F1/1333 ,  G02F1/13357 ,  G09F9/00 ,  G09G3/20 ,  G09G3/34 ,  G09G3/36

CPC classification number: G02F1/133603 ,  F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  F21V23/06 ,  G02F1/13306 ,  G02F1/133308 ,  G02F2001/133601 ,  G02F2001/133612 ,  G02F2001/133628 ,  G09F9/00 ,  G09G3/20 ,  G09G3/34 ,  G09G3/36 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/09672 ,  H05K2201/10106 ,  H05K2201/10136

Abstract: Provided is a video display device that includes a plurality of light emitting diodes capable of independently dimming. The video display device includes a liquid crystal display panel, and light source substrates configured to illuminate the liquid crystal display panel from a rear side of the liquid crystal display panel. Each of the light source substrates includes a plurality of light emitting diodes each of which is provided in corresponding one of areas different from each other in the liquid crystal display panel, and driver elements which drive each of the plurality of light emitting diodes such that light is emitted with luminance corresponding to brightness within a corresponding area of an image in accordance with a control signal. First conductive foil is disposed on a first main surface of the light source substrate on which the light emitting diodes are provided. Second conductive foil is disposed on a second main surface of the light source substrate on a side opposite to the first main surface. Ground pattern foil is disposed as the second conductive foil on the second main surface in regions each of which includes a corresponding one of the plurality of light emitting diodes in a plan view. The first conductive foil and the second conductive foil have a substantially equivalent area.

公开(公告)号：EP3316666A1

公开(公告)日：2018-05-02

申请号：EP17190527.6

申请日：2017-09-12

Applicant: Robert Bosch GmbH

Inventor： Watermann, Fred

IPC: H05K1/02 ,  H04B15/02 ,  H05K9/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/12

CPC classification number: H05K1/0218 ,  H04B15/02 ,  H05K3/1216 ,  H05K3/325 ,  H05K3/3457 ,  H05K3/3484 ,  H05K9/0028 ,  H05K2201/09136 ,  H05K2201/094 ,  H05K2201/10371

Abstract: Gegenstand der Erfindung ist ein Verfahren zur Herstellung eines elektronischen Bauelements (100), bei welchem eine Leiterplatte (12) zwischen einem ersten Gehäuseteil (10) und einem zweiten Gehäuseteil (11) positioniert wird und die beiden Gehäuseteile (10, 11) an mehreren Befestigungsstellen (15) kraftschlüssig miteinander verbunden werden, wobei zwischen den Befestigungsstellen (15) auf der Leiterplatte (12) eine Vielzahl von Auftragsflächen (14) ausgebildet sind, auf welchen jeweils ein Lotwerkstoff (18) derart aufgebracht wird, dass der Lotwerkstoff (18) die Auftragsfläche (14) jeweils überlappt, wobei nach dem Aufbringen des Lotwerkstoffs (18) Wärme zugeführt wird, wodurch sich der Lotwerkstoff (18) auf der Auftragsfläche (14) zusammenzieht und eine kuppelartige Ausbildung auf der Auftragsfläche (14) ausbildet, wobei die Höhe (h 1 , h 2 ) der kuppelartigen Ausbildung jeweils derart angepasst ist, dass der Lotwerkstoff (18) einen Kontaktpunkt mit einem der beiden Gehäuseteile (10, 11) ausbildet.

Abstract translation: 本发明涉及一种方法，用于在多个附连点的电子部件制造（100），其中第一壳体部分（10）和第二外壳部分（11）之间的电路板（12）被定位并且在两个壳体部分（10，11） （15）摩擦地相互连接，在所述电路板（12）的多个应用的​​表面（14）的固定点（15）之间形成，在其中的每一个（18）施加的焊接材料，使得焊接材料（18）的 应用表面（14）各自重叠，其中，焊料材料的施用之后（18）的热被供给，由此，钎焊填充材料（18）的施加表面上（14）收缩，并形成所述应用表面（14）上的拱顶状结构，其中，所述高度（ h1，h2）分别适于使得焊接材料（18）具有与两个壳体中的一个壳体接触的点 （10,11）。

公开(公告)号：EP3278636A1

公开(公告)日：2018-02-07

申请号：EP15888002.1

申请日：2015-03-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： WYATT, Stewart R ,  SAUNDERS, Don E ,  HAHN, Scott D ,  HUTCHINGS, Cameron

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0274 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/46 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/09145 ,  H05K2201/09781

Abstract: According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer, The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material, In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.

公开(公告)号：EP2816589A3

公开(公告)日：2015-06-03

申请号：EP14181484.8

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： Topacio, Roden ,  Zbrzezny, Adam

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.