公开(公告)号：WO2008004423A1

公开(公告)日：2008-01-10

申请号：PCT/JP2007/062014

申请日：2007-06-14

Applicant: 株式会社 村田製作所 ,  松原 大悟

Inventor： 松原 大悟

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01L21/563 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/4007 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09754 ,  H05K2201/10424 ,  H05K2203/308

Abstract: 　マザーボードへの実装性に優れ、マザーボードからの脱落等の不具合を抑制することができ、信頼性の高い柱状導体付き配線基板を提供する。 　本発明の柱状導体付き配線基板１０は、セラミック多層基板からなる配線基板１１と、配線基板１１の上面に設けられた柱状導体１２と、柱状導体１２の周側面を支持し、外形が柱状導体１２の先端から配線基板１１に向かって末広がりに形成された絶縁性支持部１３と、を有する。

Abstract translation: 提供了一种具有柱状导体的高可靠性布线板，其对母板的安装性能优异并且抑制诸如从母板掉落的故障。 具有柱状导体的布线板（10）设置有由陶瓷多层基板构成的布线基板（11） 布置在所述布线板（11）的上表面上的柱状导体（12）; 以及绝缘支撑部（13），其支撑所述柱状导体（12）的周边侧面，并且具有绝缘支撑部（13），所述绝缘支撑部具有从所述导线的前端朝向所述布线板（11）变宽的外形 柱状导体（12）。

公开(公告)号：WO2003098981A1

公开(公告)日：2003-11-27

申请号：PCT/DE2003/000504

申请日：2003-02-19

Applicant: ROBERT BOSCH GMBH ,  KRIMMER, Erwin ,  BAUR, Peter

Inventor： KRIMMER, Erwin ,  BAUR, Peter

IPC: H05K3/32

CPC classification number: H05K3/308 ,  H01R13/504 ,  H05K3/0058 ,  H05K3/328 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1059 ,  H05K2203/0285

Abstract: Die Erfindung betrifft ein elektrisches Gerät mit einem wenigstens ein erstes Gehäuseteil (1) und ein zweites Gehäuseteil (2) aufweisenden Gehäuse, in dem eine mit elektrischen/ elektronischen Bauelementen (9) versehene Trägerplatte (3) angeordnet ist, wobei an dem ersten Gehäuseteil (1) elektrische Kontaktelemente (5) angeordnet sind, deren erste Enden (11) mit einem elektrischen Anschluss (4) des Gerätes verbunden sind und deren zweite Enden (12) im Gehäuseinnenraum in einer Richtung abstehen und in dieser Richtung in Kontaktöffnungen (6) der Trägerplatte (3) eingepresst sind. Es wird vorgeschlagen, dass die Trägerplatte (3) an dem zweiten Gehäuseteil (2) festgelegt ist. Durch Aufsetzen des mit der Trägerplatte (3) versehenen zweiten Gehäuseteils (2) auf das erste Gehäuseteil (1) sind die zweiten Enden (12) der an dem ersten Gehäuseteil (11) angeordneten Kontaktelemente (5) in die Kontaktöffnungen (6) der Trägerplatte (3) eingepresst. Vorteilhaft erfolgt das Aufsetzen des zweiten Gehäuseteils (2) auf das erste Gehäuseteil (1) unter Ultraschalleinwirkung.

Abstract translation: 本发明涉及一种电气装置具有至少一个第一壳体部分（1）并且包括一个外壳，其中提供了一种电气/电子部件（9）支撑板（3）被布置，第二壳体部分（2），其中（在所述第一壳体部件 1）的电接触元件（5）被布置，其第一端部（11）（与该设备的电连接4）被连接，并且其第二在壳体内部的端部（12）在一个方向上突出并且（在的接触开口6）此方向 支撑板（3）被按压。 它建议，所述载体板（3）在所述第二壳体部分（2）是固定的。 通过将到所述载体板（3）的第二壳体部分（2）在第一壳体部分（1）提供，的在所述第一壳体部分的第二端（12）（11），布置接触件（5）在所述接触开口（6）的支撑板 （3）压入。 有利的是，超声的作用下在第一壳体部分（1）的第二壳体部分（2）的放置发生。

公开(公告)号：WO1997046058A1

公开(公告)日：1997-12-04

申请号：PCT/JP1997001832

申请日：1997-05-29

Applicant: TOKAI KOGYO KABUSHIKI KAISHA ,  YAMAGUCHI, Takayuki ,  SUGIURA, Katsura

Inventor： TOKAI KOGYO KABUSHIKI KAISHA

IPC: H05K03/20

CPC classification number: H05K3/202 ,  H01R9/16 ,  H01R9/2458 ,  H01R43/16 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/281 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2203/167

Abstract: A conductive section device (300) has a plurality of independent conductive sections and is assembled to a base member (360). The device (300) has a film (310), a plurality of conductive members (321, 322 and 323) which are stuck to the film (310) and respectively constitute the independent conductive sections, and positioning hole sections (302a-302d) which are formed to correspond to projecting sections (362a-362d) formed on the member (360).

Abstract translation: 导电部分装置（300）具有多个独立的导电部分并被组装到基部部件（360）上。 装置（300）具有胶片（310），多个导电构件（321,322和323），粘合到膜（310）上并分别构成独立的导电部分，并且定位孔部分（302a-302d） 其形成为对应于形成在构件（360）上的突出部分（362a-362d）。

公开(公告)号：WO1993015520A1

公开(公告)日：1993-08-05

申请号：PCT/JP1993000029

申请日：1993-01-12

Applicant: NIPPON MEKTRON, LTD. ,  INABA, Masaichi ,  MIYAGAWA, Atsushi ,  IWAYAMA, Takeshi

Inventor： NIPPON MEKTRON, LTD.

IPC: H01L21/60

CPC classification number: H05K3/4092 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0391 ,  H05K2201/09754 ,  H01L2924/00

Abstract: A flexible multilayer circuit wiring board in which finger-like terminals, which are hard to deform even when forming more finely circuit conductors protruded in the form of finger leads, can be provided, and whose bent part is sufficiently flexible. In the circuit wiring board, on one end of one side of a flexible insulation base material (1), provided are circuit conductors (2) which are for forming finger lead-like terminals (3), and made of a conductive metal having a high Young's modulus. On the other side of the flexible insulation base material (1) inclusive of a bent part (A) of the circuit wiring board, provided is a required circuit wiring conductor (4) made of a conductive metal having a high flexibility. Provided is a through-hole (5) by which the circuit conductors (2) and the required parts of the circuit conductor (4) are electrically connected to each other.

Abstract translation: 可以提供柔性多层电路布线板，其中即使在形成更多以指状引线形式突出的细电路导体时也难以变形的指状端子，并且其弯曲部分具有足够的柔性。 在电路布线板中，在柔性绝缘基材（1）的一侧的一端设置有用于形成指状引线端子（3）的电路导体（2），并且由具有 杨氏模量高。 在包括电路布线板的弯曲部分（A）的柔性绝缘基材（1）的另一侧上，设置有由柔性高的导电金属制成的所需的电路布线导体（4）。 电路导体（2）和电路导体（4）的必需部分之间的通孔（5）彼此电连接。

公开(公告)号：EP3336991A1

公开(公告)日：2018-06-20

申请号：EP16205023.1

申请日：2016-12-19

Applicant: ABB Schweiz AG

Inventor： Velthuis, Rudi ,  Iordanidis, Arthouros ,  Maciocha, Dariusz ,  Reutlinger, Christoph

IPC: H02G5/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H02G5/005 ,  B32B15/08 ,  H05K1/0263 ,  H05K3/4641 ,  H05K3/4647 ,  H05K2201/09754 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: A laminated multi-phase busbar (1) for conducting electric energy, comprising a base layer (2) of an electrically insulating material, a first conducting layer (4a) of an electrically conducting material which is arranged on and mechanically connected to said base layer (2), a first intermediate insulating layer (6a) of an electrically insulating material which is arranged on and mechanically connected to said first conducting layer (4a), a second conducting layer (4b) of an electrically conducting material which is arranged on and mechanically connected to said first intermediate layer (6) and a cover layer (8) of an electrically insulating material which is arranged on said second conducting layer (4b), wherein said electrically insulating material of said base layer (2), said first intermediate insulating layer (6a) and said cover layer (8) is a sheet molding compound including a thermosetting resin and reinforcing fibers, and that the material of said first conducting layer (4a) and said second conducting layer (4b) is a sheet metal which is mechanically connected to the first intermediate insulating layer (6a) by said thermally cured thermosetting resin, is characterized in that said first conducting layer (4a) comprises at least one first through-hole (10a) which is filled with thermosetting resin and reinforcing fibers, said thermosetting resin and reinforcing fibers in said first through-hole (10a) forming a material bridge (12a) bonding said base layer (2) to said first intermediate insulating layer (6a).

公开(公告)号：EP3029779A1

公开(公告)日：2016-06-08

申请号：EP15194873.4

申请日：2015-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： JOO, Sung Yong ,  LEE, Jin Hyung ,  CHUN, Seok Yeol

IPC: H01R12/71 ,  H01R12/70 ,  H01R24/76 ,  H05K1/18 ,  H04N5/63 ,  H04N5/64

CPC classification number: H01R13/40 ,  G02F1/133308 ,  G02F2001/133314 ,  G06F1/16 ,  H01R9/2491 ,  H01R12/7076 ,  H01R12/716 ,  H01R13/5213 ,  H01R24/76 ,  H04N5/63 ,  H04N5/64 ,  H05K1/185 ,  H05K5/0017 ,  H05K5/0026 ,  H05K5/0247 ,  H05K2201/09754 ,  H05K2201/10325

Abstract: A display apparatus in which a height of an AC socket protruding to a rear side of a printed circuit board is reduced and a power cord is provided to be in close contact with a product to provide a display apparatus in which a creeping distance is increased to prevent the printed circuit board from being damaged by a high voltage or a stroke of lightning.

Abstract translation: 一种显示装置，其中突出到印刷电路板的后侧的AC插座的高度减小，并且提供电源线以与产品紧密接触，以提供一种显示装置，其中爬行距离增加到 防止印刷电路板受到高压或闪电的冲击而损坏。

公开(公告)号：EP2943048A1

公开(公告)日：2015-11-11

申请号：EP15162923.5

申请日：2015-04-09

Applicant: Lockheed Martin Corporation

Inventor： Gruhl, Tim

IPC: H05K3/40 ,  H01L21/48 ,  H01R12/00 ,  H05K3/46 ,  H05K3/12

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board 110 by depositing a first plurality of layers 115 and forming an interconnect 120 integral to the printed circuit board by depositing a second plurality of layers 121 on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure 125 and a contact 130 positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过在第一多个层115中的至少一部分上沉积第二多个层121来沉积第一多个层115并形成与印刷电路板成一体的互连120来形成印刷电路板110 层。 互连包括稳定结构125和定位在稳定结构内的触点130。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。

公开(公告)号：EP2425692A1

公开(公告)日：2012-03-07

申请号：EP10720314.3

申请日：2010-04-27

Applicant: Yazaki Corporation

Inventor： SAWAI, Mamoru

IPC: H05K3/40

CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

公开(公告)号：EP2382775A1

公开(公告)日：2011-11-02

申请号：EP10729577.6

申请日：2010-01-08

Applicant: Manufacturing Resources International, INC.

Inventor： DUNN, William, R. ,  WILLIAMS, David ,  BEDELL, Ware

IPC: H04N5/64 ,  H04N5/44

CPC classification number: G06F1/1601 ,  G06F1/181 ,  G06F2200/1612 ,  H01L23/3107 ,  H01L23/32 ,  H01R12/7076 ,  H01R12/73 ,  H01R23/70 ,  H01R23/7005 ,  H04N5/63 ,  H04N5/64 ,  H04N5/655 ,  H05K1/117 ,  H05K2201/044 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1034

Abstract: An electronic display assembly where the components can be removed and serviced or replaced without having to remove the display from its position. A backplane may be in electrical communication with the image producing assembly and may contain a plurality of blind mate connectors. Various electronic assemblies may be connected to the blind mate connectors. An access panel may provide access to the electronic assemblies so that they can be removed from the housing. N+1 power supplies may be used so that if one fails the unit would continue to operate until the failed power supply could be replaced. The electronic assemblies may be removed from the left side, right side, top, or bottom surfaces of the display housing. Any flat panel electronic display may be used.

公开(公告)号：EP2298048A1

公开(公告)日：2011-03-23

申请号：EP09772960.2

申请日：2009-06-23

Applicant: Koninklijke Philips Electronics N.V.

Inventor： ELZINGA, Marcus, J., G.

IPC: H05K3/34 ,  H01L33/48

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.