公开(公告)号：WO98056217A1

公开(公告)日：1998-12-10

申请号：PCT/JP1998/002437

申请日：1998-06-02

IPC: B23K35/00 ,  B23K35/26 ,  H01L23/498 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A soldering member for connection to an external unit, which is joined to a connection terminal having a nickel/gold electroless plating layer on the surface formed correspondingly to a conductor pattern on a printed wiring board. The member comprises a soldering ball containing finely powdered copper, and exhibits excellent strength of junction to the connection terminal.

Abstract translation: 一种用于连接到外部单元的焊接部件，其被连接到在与印刷线路板上的导体图案相对应地形成的表面上具有镍/金化学镀层的连接端子。 该构件包括含有细粉末铜的焊球，并且显示出优良的连接到连接端子的强度。

公开(公告)号：WO1990005614A1

公开(公告)日：1990-05-31

申请号：PCT/US1989004979

申请日：1989-11-06

Applicant: RAYCHEM CORPORATION

Inventor： RAYCHEM CORPORATION ,  SVENDSEN, Leo, Gulvad ,  LEARLY, Rebecca, Ann ,  GESCHWIND, Gary, Ira

IPC: B23K35/02

CPC classification number: H01L23/49811 ,  B23K35/0222 ,  H01L23/49833 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/043 ,  Y02P70/613

Abstract: A connection to a contact on an electronic component is made by means of a solder preform in the form of a column, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.

Abstract translation: 与电子部件上的接触件的连接通过柱状焊料预制件制成，其包括至少部分地封装在管状支撑件内的焊料体。 预成型件被定位成使得其纵向轴线在与其连接的点处大致平行于触头的平面。

公开(公告)号：US20240222245A1

公开(公告)日：2024-07-04

申请号：US18455553

申请日：2023-08-24

Applicant: Zhuhai ACCESS Semiconductor Co., LTD.

Inventor： Xianming CHEN ,  Gao HUANG ,  Yejie HONG ,  Wenjian LIN ,  Benxia HUANG ,  Zhijun ZHANG

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/10242

Abstract: A method for manufacturing embedded device packaging substrate, a packaging substrate, and a semiconductor are disclosed. The method includes: forming a first circuit layer; laminating a first photosensitive layer onto the first circuit layer; providing an embedded device on the first photosensitive layer, with a pin face of the embedded device facing away from the first photosensitive layer; providing a second photosensitive layer covering the embedded device; partially removing the first dielectric layer such that a minimum thickness of the first dielectric layer covering a side surface of the embedded device is greater than or equal to a preset threshold; providing a second dielectric layer covering the first dielectric layer; and forming, on the second dielectric layer, a second circuit layer that is electrically connected to the first circuit layer and the embedded device.

公开(公告)号：US20240040691A1

公开(公告)日：2024-02-01

申请号：US18212863

申请日：2023-06-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwon Su YUN

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/02

CPC classification number: H05K1/0296 ,  H05K1/115 ,  H05K3/02 ,  H05K2201/10984 ,  H05K2201/10242 ,  H05K2201/10674

Abstract: A printed circuit board (PCB) includes an insulating layer, a first solder resist layer disposed on an upper surface of the insulating layer, a first conductive pattern disposed on the insulating layer and providing a conductive post protruding from an upper surface of the first solder resist layer, and a second conductive pattern buried in the insulating layer and having an upper surface positioned to be lower than the upper surface of the insulating layer.

公开(公告)号：US20230209717A1

公开(公告)日：2023-06-29

申请号：US18173320

申请日：2023-02-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yatao LV ,  Qingguo TANG ,  Ning WANG

IPC: H05K1/18 ,  H05K3/28

CPC classification number: H05K1/181 ,  H05K3/28 ,  H05K2201/10242

Abstract: Embodiments of this application disclose a packaging module and an electronic device. Both a first surface and a second surface of a PCB in the packaging module are covered with a molding layer, a conductive pin is electrically connected to the PCB, the conductive pin is packaged inside the molding layer along a stacking direction of the PCB and the molding layer, and the conductive pin is partially exposed on an outer surface of the molding layer. When the packaging module performs electrical interaction with another element, the PCB outputs or inputs an electrical signal by using the conductive pin. In this way, there is no need to reserve a through hole on a packaging side of the packaging module, the packaging module may be arranged at a position close to a chip, and there are short wires between the packaging module and the chip.

公开(公告)号：US20190244877A1

公开(公告)日：2019-08-08

申请号：US16384494

申请日：2019-04-15

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US20190190110A1

公开(公告)日：2019-06-20

申请号：US16272834

申请日：2019-02-11

Applicant: Cambium Networks Limited

Inventor： Paul Clark ,  Peter Strong ,  Carl Morrell ,  Adam Wilkins ,  Nigel Jonathan Richard King

IPC: H01P3/08 ,  H05K1/02

CPC classification number: H01P3/081 ,  H01P5/028 ,  H05K1/0237 ,  H05K2201/09209 ,  H05K2201/10242

Abstract: A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The aperture is partially filled with a solid dielectric material and partially filled with air. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.

公开(公告)号：US20180160547A1

公开(公告)日：2018-06-07

申请号：US15806385

申请日：2017-11-08

Applicant: FUJITSU LIMITED

Inventor： Norikazu Ozaki ,  Hiroshi MIYAO ,  Satoru HASEGAWA

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/42 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2203/0278

Abstract: A first through hole is formed in a base, a conductive layer covering an inner wall side surface of the first through hole is formed, a columnar electric conductor having a Vickers hardness of a value in a range of 30 Hv or more and 400 Hv or less is inserted into the first through hole formed with the conductive layer, pressure is applied in a vertical direction to the columnar electric conductor, and a second through hole is formed in the columnar electric conductor.

公开(公告)号：US20180160533A1

公开(公告)日：2018-06-07

申请号：US15369822

申请日：2016-12-05

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao LIN ,  Chiao-Cheng CHANG ,  Yi-Nong LIN

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/4641 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/10242 ,  H05K2203/041 ,  H05K2203/0568

Abstract: A multilayer printed circuit board includes a first circuit board, a second circuit board and bonding films. The first circuit board includes a first dielectric layer, a first wiring pattern layer, a plurality of conductive blocks and a plurality of solder balls. The first wiring pattern layer is formed on a first surface of the first dielectric layer and the conductive blocks are formed on a second surface of the first dielectric layer. The solder balls are formed on a surface of the first wiring pattern layer. The second circuit board includes a second dielectric layer, a second wiring pattern layer, second conductive blocks and conductive pillars. The second wiring pattern layer is formed on a third surface of the second dielectric layer and the second conductive blocks are formed on a fourth surface thereof. The conductive pillars are formed on the second wiring pattern layer.

公开(公告)号：US09942975B2

公开(公告)日：2018-04-10

申请号：US14875222

申请日：2015-10-05

Applicant: Raytheon Company

Inventor： James M. Elliott ,  James S. Wilson ,  David E. Swernofsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.