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    MEMS ACTUATOR
    141.
    发明申请
    MEMS ACTUATOR 审中-公开
    MEMS致动器

    公开(公告)号：WO2009045346A4

    公开(公告)日：2009-12-30

    申请号：PCT/US2008011212

    申请日：2008-09-26

    Applicant: LUCENT TECHNOLOGIES INC ,  AKSYUK VLADIMIR ANATOLYEVICH ,  PARDO FLAVIO ,  SIMON MARIA ELINA

    Inventor： AKSYUK VLADIMIR ANATOLYEVICH ,  PARDO FLAVIO ,  SIMON MARIA ELINA

    IPC: H01H1/00

    CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/031 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

    Abstract: Apparatus including substrate, pusher assembly, and flexor assembly adjacent to pusher assembly. Pusher assembly includes hot and cold pusher arms. First ends of hot and cold pusher arms are anchored over substrate. Second ends of hot and cold pusher arms are coupled together and suspended for lateral displacement over substrate. Flexor assembly includes flexor arm, and conductor having actuator contact. First end of flexor arm is anchored over substrate. Pusher assembly is configured for causing lateral displacement of second end of flexor arm and of actuator contact over the substrate. Method includes providing apparatus and causing pusher assembly to laterally displace second end of flexor arm and actuator contact over substrate.

    Abstract translation: 装置包括与推动器组件相邻的衬底，推动器组件和屈肌组件。 推杆组件包括热推和冷推臂。 热推和冷推臂的第一端固定在基板上。 热推动臂和冷推动臂的第二端联接在一起并悬挂以在基底上横向移位。 屈肌组件包括屈肌臂和具有致动器接触的导体。 屈肌臂的第一端锚定在基底上。 推动器组件被构造成用于引起屈肌臂的第二端和致动器在衬底上的接触的横向位移。 方法包括提供装置并使推动器组件横向移动屈肌臂的第二端和促动器接触在衬底上。

    A MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT
    142.
    发明申请
    A MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT 审中-公开
    具有双向元件的MEMS器件

    公开(公告)号：WO2009005683A1

    公开(公告)日：2009-01-08

    申请号：PCT/US2008/007944

    申请日：2008-06-26

    Applicant: LUCENT TECHNOLOGIES INC. ,  GASPARYAN, Arman ,  GATES, Ohn, VanAtta ,  SIMON, Maria, Elina

    Inventor： GASPARYAN, Arman ,  GATES, Ohn, VanAtta ,  SIMON, Maria, Elina

    IPC: H01H37/00

    CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H37/00 ,  H01H2001/0047 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

    Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

    Abstract translation: 本发明提供一种双向微电子机械元件，包括双向元件的微机电开关，以及减少双向元件中机械蠕变的方法。 在一个实施例中，双向微机电元件包括​​具有自由端的冷梁和连接到冷束锚的第一端。 冷梁锚附接到基板。 第一束对通过自由端系绳连接到冷束，并且被构造成在被加热时延伸到比冷束的温度更大的温度。 第二光束对位于与第一光束对的冷光束的相对侧上，并且通过自由端系绳耦合到第一光束对和冷光束。 第二束对被配置成在被加热时延长到更高的温度。

    MULTI-DIRECTIONAL THERMAL ACTUATOR
    145.
    发明申请
    MULTI-DIRECTIONAL THERMAL ACTUATOR 审中-公开
    多方向致动器

    公开(公告)号：WO2002088018A2

    公开(公告)日：2002-11-07

    申请号：PCT/US2002/003679

    申请日：2002-02-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： GOETZ, Douglas, P. ,  HAMERLY, Michael, E. ,  PENDERGRASS, Daniel, B., Jr. ,  SMITH, Robert, G. ,  THEISS, Silva, K. ,  WEAVER, Billy, L.

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  B81B2201/031 ,  B81B2203/0307 ,  B81B2203/051 ,  B81B2203/053 ,  H01G5/18 ,  H01G5/40 ,  H01H2061/008

    Abstract: A micrometer sized multi-directional thermal actuator capable of repeatable and rapid displacement in a substantially horizontal direction, a substantially vertical direction, and/or a combination thereof. The multi-directional thermal actuator constructed on a surface of a substrate includes three or more beams each cantilevered from one or more anchors at a first end to extend generally parallel to the surface of the substrate. A member mechanically and electrically couples the distal ends of the beams. Application of current to a circuit comprising combinations of any two or more of the beams displaces the member in one of three or more non-parallel radial directions, respectively.

    Abstract translation: 一种千分尺尺寸的多向热致动器，其能够在基本上水平的方向，基本上垂直的方向上重复和快速地位移，和/或其组合。 构造在基板的表面上的多向热致动器包括三个或更多个梁，每个梁在第一端处从一个或多个锚固件悬臂延伸，以大致平行于基板的表面延伸。 机械和电气耦合梁的远端的部件。 将电流施加到包括任何两个或更多个光束的组合的电路中，分别使构件在三个或更多个非平行的径向方向之一中移位。

    MICROBELLOWS ACTUATOR
    146.
    发明申请
    MICROBELLOWS ACTUATOR 审中-公开
    MICROBELLOWS执行器

    公开(公告)号：WO9848608A3

    公开(公告)日：1999-04-01

    申请号：PCT/US9807424

    申请日：1998-04-09

    Applicant: CALIFORNIA INST OF TECHN

    Inventor： TAI YU-CHONG ,  YANG XING

    IPC: B81B3/00 ,  B82B3/00 ,  H01L21/00 ,  H01L29/82

    CPC classification number: B81B3/007 ,  B81B2201/031

    Abstract: A micromachined multi-layered microbellows-style actuator capable of delivering larger deflections. Anchor structures (420, 430, 440, 450) are disclosed that improve the strength of the microbellows membrane (150). Thermopneumatic actuators having a resistive heater chip are also disclosed.

    Abstract translation: 微加工的多层微波导式致动器能够提供更大的偏转。 公开了提高微量薄膜（150）的强度的锚结构（420,430,440,450）。 还公开了具有电阻加热器芯片的热气动致动器。

    Integrated circuit packages having stress-relieving features
    147.
    发明授权
    Integrated circuit packages having stress-relieving features 有权

    公开(公告)号：US12091310B2

    公开(公告)日：2024-09-17

    申请号：US17331762

    申请日：2021-05-27

    Applicant: TallannQuest LLC

    Inventor： David A. Grant ,  Abhijeet Ghoshal

    IPC: B81B3/00 ,  B81C1/00 ,  H02N10/00

    CPC classification number: B81B3/0072 ,  B81C1/00666 ,  H02N10/00 ,  B81B2201/031 ,  B81B2207/07 ,  H01L2224/0235

    Abstract: Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

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