Abstract:
A method of operating a focused ion beam device having a gas field ion source is described. According to some embodiments, the method being adapted for high imaging resolutions below 1 nm includes emitting an ion beam from a gas field ion source, providing a final beam energy on impingement of the ion beam on the specimen of 1 keV to 4 keV, and imaging the specimen.
Abstract:
An ion source (400) is cooled using a cooling plate (412) that is separate and independent of the anode (408). The coolin plate (412) forms a coolant cavity (414) through which a fluid coolant (e.g., liquid or gas) can flow to cool the anode. In such configurations, a magnet may be thermally protected by the cooling plate. A thermally conductive material in a thermal transfer interface component can enhance the cooling capacity of the cooling plate. Combining these structures into an anode subassembly and magnet subassembly can also facilitate assembly and maintenance of the ion source.
Abstract:
An ion beam generation apparatus comprising an ion source (20) for generating ions, and a tetrode extraction assembly (11) comprising four electrodes for extracting and accelerating ions from the ion source. The extraction assembly comprises a source electrode (22) at the potential of the ion source, an extraction electrode (23) adjacent to the source electrode to extract ions from the ion source (20), a ground electrode (25), and a suppression electrode (24) between the extraction electrode and the ground electrode. Each electrode has an aperture to allow the ion beam to pass therethrough. The gap between the extraction (23) and suppression (24) electrodes is variable in the direction of ion beam travel.
Abstract:
An indirectly heated cathode ion source includes an arc chamber housing that defines an arc chamber, an indirectly heated cathode and a filament for heating the cathode. The cathode may include an emitting portion having a front surface, a rear surface and a periphery, a support rod attached to the rear surface of the emitting portion, and a skirt extending from the periphery of the emitting portion. A cathode assembly may include the cathode, a filament and a clamp assembly for mounting the cathode and the filament in a fixed spatial relationship and for conducting electrical energy to the cathode and the filament. The filament is positioned in a cavity defined by the emitting portion and the skirt of the cathode. The ion source may include a shield for inhibiting escape of electrons and plasma from a region outside the arc hamber in proximity to the filament and the cathode.
Abstract:
A method and apparatus for producing optical films on substrates having extremely high packing densities of the same quality as those films produced by ion beam sputtering including a vacuum chamber with a conventional magnetron sputtering system and unusually high speed vaccum pump means. The low pressure of inert gas created by said high speed vacuum pump means being in the range of 5 x 10-5 Torr to 2.0 x 10-4 Torr and the magnetron sputtering system being at least 20'' from said substrates. A gas manifold around the magnetron and target material confines the inert working gas in the vicinity of the magnetron and as the gas diffuses and expands into the chamber the high speed vacuum pump means removes the expanded gas from the chamber at the high speed. An ion gun directs ionized reactant gas toward the substrates which has the effect of improving film stoichiometry as well as reducing reactant gas at the magnetron. Multiple magnetron assemblies, multiple target materials and compound target materials may be used.
Abstract:
A polymer surface and near surface treatment process produced by irradiation with high energy particle beams. The process is preferably implemented with pulsed ion beams. The process alters the chemical and mechanical properties of the polymer surface in a manner useful for a wide range of commercial applications.
Abstract:
The present invention provides for an ion implantation system that employs an ion source (12) for ionizing and implanting into a substrate (S) a noble diluent gas and a particular dopant gas. The noble diluent gas of the present invention preferably does not react with the dopant gas, or with dopant residue which coats the walls of the ionization chamber (24) of the ion source (12), thus allowing the ion source to be used for accurate, stable low dose implants. Additionally, the noble diluent gas does not introduce conductivity altering ions, or impurities, into the substrate (S). Consequently, the dosage of the dopant ions implanted into the substrate can be precisely controlled, especially in low dose applications.
Abstract:
A method and apparatus for treating material surfaces (13) using a repetitively pulsed ion beam (11). In particular, the treatment is tailored by adjusting treatment parameters of a pulsed ion beam (11) to a duration less than or equal to 1000 ns and a repetition rate of less than 1 Hz.
Abstract:
A method for treatment of articles in gas-discharge plasma consists in that between an anode (3) and an integrally cold cathode (2) a two stage vacuum-arc discharge is generated with mutually separated metal-gas and gas stage of the plasma. The gas stage of the plasma is obtained by means of ionization of the working gas with ions separated from the metal-gas stage of the plasma. Then the treated article (5) is heated up to the working temperature and conditioned within that temperature interval. For that purpose the device is provided with a means (13) which is located in the zone of the cathode (2), is impenetrable for the metal ions generated by the cathode (2) and intended for separation of the electrons from the metal-gas stage of the plasma. In a particular case the means (13) consists of a set of V-shaped plates (14).