CHARGED PARTICLE BEAM SCANNING USING DEFORMED HIGH GRADIENT INSULATOR
    141.
    发明申请
    CHARGED PARTICLE BEAM SCANNING USING DEFORMED HIGH GRADIENT INSULATOR 有权
    使用变形高梯度绝缘体的充电颗粒束扫描

    公开(公告)号:US20130140468A1

    公开(公告)日:2013-06-06

    申请号:US13705084

    申请日:2012-12-04

    Inventor: Yu-Jiuan Chen

    Abstract: Devices and methods are provided to allow rapid deflection of a charged particle beam. The disclosed devices can, for example, be used as part of a hadron therapy system to allow scanning of a target area within a patient's body. The disclosed charged particle beam deflectors include a dielectric wall accelerator (DWA) with a hollow center and a dielectric wall that is substantially parallel to a z-axis that runs through the hollow center. The dielectric wall includes one or more deformed high gradient insulators (HGIs) that are configured to produce an electric field with an component in a direction perpendicular to the z-axis. A control component is also provided to establish the electric field component in the direction perpendicular to the z-axis and to control deflection of a charged particle beam in the direction perpendicular to the z-axis as the charged particle beam travels through the hollow center of the DWA.

    Abstract translation: 提供了装置和方法以允许带电粒子束的快速偏转。 所公开的装置可以例如用作强子治疗系统的一部分,以允许扫描患者体内的目标区域。 所公开的带电粒子束偏转器包括具有中空中心的电介质壁加速器(DWA)和基本平行于穿过中空中心的z轴平行的电介质壁。 电介质壁包括一个或多个变形的高梯度绝缘体(HGI),其被配置为产生具有垂直于z轴的方向的分量的电场。 还提供控制组件以在垂直于z轴的方向上建立电场分量,并且当带电粒子束穿过中空中心时,控制带电粒子束在垂直于z轴的方向上的偏转 DWA。

    SEQUENTIAL RADIAL MIRROR ANALYSER
    142.
    发明申请
    SEQUENTIAL RADIAL MIRROR ANALYSER 失效
    顺序径向分析仪

    公开(公告)号:US20130126730A1

    公开(公告)日:2013-05-23

    申请号:US13679181

    申请日:2012-11-16

    Abstract: A sequential radial mirror analyser (RMA) (100) for facilitating rotationally symmetric detection of charged particles caused by a charged beam incident on a specimen (112) is disclosed. The RMA comprises a 0V equipotential exit grid (116), and a plurality of electrodes (119, 120a, 120b, 120c) electrically configured to generate corresponding electrostatic fields for deflecting at least some of the charged particles of a single energy level to exit through the exit grid (116) to form a second-order focal point on a detector (106). The second-order focal point is associated with the single energy level, and the detector (106) is disposed external to the corresponding electrostatic fields. A related method is also disclosed.

    Abstract translation: 公开了一种用于促进由入射在样本(112)上的带电束引起的带电粒子的旋转对称检测的顺序径向镜分析器(RMA)(100)。 RMA包括0V等电位出口格栅(116),以及多个电极(119,120a,120b,120c),其被电配置为产生相应的静电场,用于偏转单个能级的至少一些带电粒子以便通过 出口格栅(116)以在检测器(106)上形成二阶焦点。 二阶焦点与单个能级相关联,并且检测器(106)设置在相应静电场的外部。 还公开了相关方法。

    Pattern Modification Schemes for Improved FIB Patterning
    143.
    发明申请
    Pattern Modification Schemes for Improved FIB Patterning 有权
    用于改进FIB图案化的图案修改方案

    公开(公告)号:US20130092826A1

    公开(公告)日:2013-04-18

    申请号:US13655129

    申请日:2012-10-18

    Applicant: FEI Company

    Abstract: An improved method of directing a charged particle beam that compensates for the time required for the charged particles to traverse the system by altering one or more of the deflector signals. According to one embodiment of the invention, a digital filter is applied to the scan pattern prior to digital-to-analog (D/A) conversion in order to reduce or eliminate over-shoot effects that can result from TOF errors. In other embodiments, analog filters or the use of signal amplifiers with a lower bandwidth can also be used to compensate for TOF errors. By altering the scan pattern, over-shoot effects can be significantly reduced or eliminated.

    Abstract translation: 引导带电粒子束的改进方法,其补偿带电粒子通过改变一个或多个偏转器信号而穿过系统所需的时间。 根据本发明的一个实施例,在数模(D / A)转换之前,将数字滤波器应用于扫描图案,以便减少或消除可能由TOF误差引起的过拍影响。 在其他实施例中,也可以使用模拟滤波器或具有较低带宽的信号放大器的使用来补偿TOF误差。 通过改变扫描图案,可以显着减少或消除超拍效果。

    DECELERATION APPARATUS FOR RIBBON AND SPOT BEAMS
    145.
    发明申请
    DECELERATION APPARATUS FOR RIBBON AND SPOT BEAMS 有权
    RIBBON和SPOT BEA的减速装置

    公开(公告)号:US20120097861A1

    公开(公告)日:2012-04-26

    申请号:US13280162

    申请日:2011-10-24

    Abstract: A deceleration apparatus capable of decelerating a short spot beam or a tall. ribbon beam is disclosed. In either case, effects tending to degrade the shape of the beam profile are controlled. Caps to shield the ion beam from external potentials are provided. Electrodes whose position and potentials are adjustable are provided, on opposite sides of the beam, to ensure that the shape of the decelerating and deflecting electric fields does not significantly deviate from the optimum shape, even in the presence of the significant space-charge of high current low-energy beams of heavy ions.

    Abstract translation: 减速装置,能够使短点梁或高度减速。 公开了带状束。 在任一种情况下,都会控制趋向于降低光束轮廓形状的效果。 提供了用于将离子束屏蔽到外部电位的盖子。 其位置和电位可调的电极设置在梁的相对两侧,以确保减速和偏转电场的形状不会显着偏离最佳形状,即使存在显着的空间电荷高 目前低能量的重离子束。

    Focused ion beam apparatus
    146.
    发明申请
    Focused ion beam apparatus 审中-公开
    聚焦离子束装置

    公开(公告)号:US20110215256A1

    公开(公告)日:2011-09-08

    申请号:US12931987

    申请日:2011-02-15

    CPC classification number: H01J3/14 H01J3/26

    Abstract: A focused ion beam apparatus includes an ion gun unit having an emitter tip, a gas supply unit including an ion source gas nozzle configured to supply gas to the tip and an ion source gas supply source. An extracting electrode ionizes the gas adsorbed onto the surface of the tip and extracts ions by applying a voltage between the extracting electrode and the tip. A cathode electrode accelerates the ions toward a sample, and a gun alignment electrode positioned on the side of the sample with respect to the ion gun unit and adjusts the direction of irradiation of the ion beam ejected from the ion gun unit. A lens system includes a focusing lens electrode and an objective lens electrode to focus the ion beam onto the sample.

    Abstract translation: 聚焦离子束装置包括具有发射极尖端的离子枪单元,气体供给单元,其包括被配置为向尖端供应气体的离子源气体喷嘴和离子源气体供给源。 提取电极通过在提取电极和尖端之间施加电压使吸附在尖端表面上的气体电离并提取离子。 阴极电极将离子朝向样品加速,并且枪对准电极相对于离子枪单元位于样品侧,并调节从离子枪单元喷射的离子束的照射方向。 透镜系统包括聚焦透镜电极和用于将离子束聚焦到样品上的物镜电极。

    PATTERN MODIFICATION SCHEMES FOR IMPROVED FIB PATTERNING
    148.
    发明申请
    PATTERN MODIFICATION SCHEMES FOR IMPROVED FIB PATTERNING 有权
    改进FIB图案的图案修改方案

    公开(公告)号:US20110049382A1

    公开(公告)日:2011-03-03

    申请号:US12870816

    申请日:2010-08-28

    Abstract: An improved method of directing a charged particle beam that compensates for the time required for the charged particles to traverse the system by altering one or more of the deflector signals. According to one embodiment of the invention, a digital filter is applied to the scan pattern prior to digital-to-analog (D/A) conversion in order to reduce or eliminate over-shoot effects that can result from TOF errors. In other embodiments, analog filters or the use of signal amplifiers with a lower bandwidth can also be used to compensate for TOF errors. By altering the scan pattern, over-shoot effects can be significantly reduced or eliminated.

    Abstract translation: 引导带电粒子束的改进方法,其补偿带电粒子通过改变一个或多个偏转器信号而穿过系统所需的时间。 根据本发明的一个实施例,在数模(D / A)转换之前,将数字滤波器应用于扫描图案,以便减少或消除可能由TOF误差引起的过拍影响。 在其他实施例中,也可以使用模拟滤波器或具有较低带宽的信号放大器的使用来补偿TOF误差。 通过改变扫描图案,可以显着减少或消除超拍效果。

    Deflector of a micro-column electron beam apparatus and method for fabricating the same

    公开(公告)号:US20040217299A1

    公开(公告)日:2004-11-04

    申请号:US10853519

    申请日:2004-05-26

    Abstract: The present invention relates to a deflector of a micro-column electron beam apparatus and method for fabricating the same, which forms a seed metal layer and a mask layer on both sides of a substrate, and exposes some of the seed metal layer on which deflecting plates, wirings and pads are to be formed by lithography process using a predetermined mask. The wirings and pads are formed by plating metal on the exposed portion, and some of the metal layer is also exposed on which the deflecting plates are to be formed using a predetermined mask, and then the metal is plated with desired thickness, thereby the deflecting plates are completed. Therefore, by forming plurality of deflecting plates on both sides of the substrate at the same time through plating process, alignment between the deflecting plates formed on both sides of the substrate can be exactly made, and by fabricating a deflector integrated with the substrate and deflecting plates in a batch process, productivity and reproducibility is improved. In addition, since the deflecting plates, wirings and pads are directly formed on the substrate, structural safety is improved and thereby durability is also improved.

    Deflector of a micro-column electron beam apparatus and method for fabricating the same
    150.
    发明申请
    Deflector of a micro-column electron beam apparatus and method for fabricating the same 失效
    微柱电子束装置的偏转器及其制造方法

    公开(公告)号:US20040099811A1

    公开(公告)日:2004-05-27

    申请号:US10617703

    申请日:2003-07-14

    Abstract: The present invention relates to a deflector of a micro-column electron beam apparatus and method for fabricating the same, which forms a seed metal layer and a mask layer on both sides of a substrate, and exposes some of the seed metal layer on which deflecting plates, wirings and pads are to be formed by lithography process using a predetermined mask. The wirings and pads are formed by plating metal on the exposed portion, and some of the metal layer is also exposed on which the deflecting plates are to be formed using a predetermined mask, and then the metal is plated with desired thickness, thereby the deflecting plates are completed. Therefore, by forming plurality of deflecting plates on both sides of the substrate at the same time through plating process, alignment between the deflecting plates formed on both sides of the substrate can be exactly made, and by fabricating a deflector integrated with the substrate and deflecting plates in a batch process, productivity and reproducibility is improved. In addition, since the deflecting plates, wirings and pads are directly formed on the substrate, structural safety is improved and thereby durability is also improved.

    Abstract translation: 微柱电子束装置的偏转器及其制造方法技术领域本发明涉及一种微柱电子束装置的偏转器及其制造方法,其在基板的两面形成种子金属层和掩模层,并使一些种子金属层露出偏转 板,布线和焊盘将通过使用预定掩模的光刻工艺形成。 布线和焊盘通过在暴露部分上电镀金属而形成,并且一些金属层也暴露在其上将使用预定掩模在其上形成偏转板,然后以期望的厚度镀覆金属,由此偏转 板块完成。 因此,通过电镀处理同时在基板的两面形成多个偏转板,可以精确地形成形成在基板两侧的偏转板之间的对准,并且通过制造与基板一体化的偏转板和偏转 分批处理板,提高了生产率和再现性。 此外,由于偏转板,布线和焊盘直接形成在基板上,所以结构安全性得到改善,从而也提高了耐久性。

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