公开(公告)号：US20110088935A1

公开(公告)日：2011-04-21

申请号：US12975421

申请日：2010-12-22

Applicant: Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

Inventor： Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC: H05K1/09 ,  B32B37/00 ,  C09J163/00 ,  C09J133/08 ,  H01B1/02

CPC classification number: H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract translation: 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。

公开(公告)号：US20100243107A1

公开(公告)日：2010-09-30

申请号：US12796905

申请日：2010-06-09

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B23K35/24

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys

Abstract translation: 用于形成焊点的焊料组合物。 组合物包括包含固体金属基质材料和填充材料的粉末材料。 固体金属基体材料包括锡 - 银 - 铜（Sn-Ag-Cu），锡 - 铜（Sn-Cu），锡 - 铜 - 镍（Sn-Cu-Ni），锡 - 银（Sn （Sn-Bi-In），锡 - 金（Au-Sn），锡 - 锌（Sn-Zn），锡 - 铋 - 锡（Sn-Ag-Bi） （Sn-Zn-Bi），锡 - 铋 - 银（Sn-Bi-Ag），锡（Sn），锡 - 铟（Sn-In），铟（In），铟 - 银 ）和锡铅（Sn-Pb）。 填充材料包括铜（Cu），金（Au），镍（Ni），镍 - 金（Ni-Au），碳，银（Ag），铝（Al），钼（Mo） （Ni）或镍 - 金（Ni-Au）涂覆的碳，铂族金属（PGM's）及其合金

公开(公告)号：US20100171064A1

公开(公告)日：2010-07-08

申请号：US11508312

申请日：2006-08-23

Applicant: In-Keun Shim ,  Jae-Woo Joung

Inventor： In-Keun Shim ,  Jae-Woo Joung

IPC: H01F1/04

CPC classification number: H01B1/16 ,  B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  C09D11/52 ,  H01B1/02 ,  H05K1/097 ,  H05K2201/0218 ,  H05K2201/083 ,  Y10S977/775 ,  Y10T428/2991

Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.

Abstract translation: 一种用于导电油墨的纳米颗粒，其包括铁磁芯和围绕铁磁芯的导电层。 每100重量份的纳米颗粒，铁磁芯为5〜40重量份。 导电油墨通过允许在喷射的油墨中均匀分布纳米颗粒而提供电可靠性，并防止咖啡污点现象和迁移。

公开(公告)号：US20100059260A1

公开(公告)日：2010-03-11

申请号：US12546117

申请日：2009-08-24

Applicant: Kiyohiko Takemoto ,  Miharu Kanaya

Inventor： Kiyohiko Takemoto ,  Miharu Kanaya

IPC: H05K1/09 ,  B05D5/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C09D11/38 ,  C09D11/52 ,  C09D17/006 ,  C22C9/00 ,  C22C21/00 ,  H05K1/097 ,  H05K2201/0218

Abstract: Objects of the present invention include providing composite metallic thin filmy particles for conductive inks and a conductive ink, both allowing the production of highly conductive substrates with simpler equipment and at a lower cost, providing a method for making such a conductive substrate, and providing such a conductive substrate.The present invention includes Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic thin filmy particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.

Abstract translation: 本发明的目的包括提供用于导电油墨和导电油墨的复合金属薄膜颗粒，其允许以更简单的设备和更低的成本生产高导电性基材，提供制造这种导电基材的方法， 导电基板。 本发明包括用包含树脂层和蜡层中的至少一种和金属层和金属化合物层中的至少一种的复合金属薄膜层涂覆基材片的表面的步骤1和步骤 2用于从片材上除去复合金属薄膜层。 所得到的复合金属薄膜颗粒和导电油墨可以用于通过丝网印刷，喷墨法或一些其它基于液体的方法在导电基板上形成图案的导电基板制造装置中。

公开(公告)号：US20090294056A1

公开(公告)日：2009-12-03

申请号：US12365279

申请日：2009-02-04

Applicant: Hideaki YOSHIMURA ,  Takashi NAKAGAWA ,  Kenji FUKUZONO ,  Takashi KANDA ,  Tomohisa YAGI

Inventor： Hideaki YOSHIMURA ,  Takashi NAKAGAWA ,  Kenji FUKUZONO ,  Takashi KANDA ,  Tomohisa YAGI

IPC: B32B37/12

CPC classification number: H05K3/321 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2201/0361 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/061

Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

Abstract translation: 响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。 允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。 粘合片软化后，填料熔化。 金属间化合物形成在填料和导电性焊盘之间以及填料之间。 电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。 然后将基质材料和粘合片固化。 第一支撑体和第二支撑体彼此牢固地接合。

公开(公告)号：US20090096100A1

公开(公告)日：2009-04-16

申请号：US12246811

申请日：2008-10-07

Applicant: Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

Inventor： Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

IPC: H01L23/488 ,  H01L21/60 ,  H01B1/22

CPC classification number: H01L23/49562 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Abstract translation: 芯片接合部分由具有约15μm至200μm的最大粒径和Ag的粘合剂层的良好导电的Cu金属粉末金属地结合，并且微孔均匀地分散在接合层中。 利用这种结构，可以在不使用铅的情况下确保约260℃的回流电阻和热循环试验下的可靠性。

公开(公告)号：US07467742B1

公开(公告)日：2008-12-23

申请号：US09512400

申请日：2000-02-24

Applicant: Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Konstantinos Papathomas ,  Sampath Purushothaman

Inventor： Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Konstantinos Papathomas ,  Sampath Purushothaman

IPC: B23K31/02

CPC classification number: H05K1/095 ,  C08K3/10 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of thermosetting resins together with a flux resin selected for viscosity and low shrinkage, for screen printability, for electrical and for mechanical properties over a broad range of specification conditions. The vehicle or resin system includes thermosetting cyclo-aliphatic epoxy, thermosetting phenoxy polymer and thermosetting mono-functional limonene oxide. The low temperature melting coating system for the particles includes In, Sn, and alloys such as In—Sn, Sn—Pb, Bi—Sn—In and InAg. The micrometer diameter range particles includes Cu, Ni, Co, Ag, Pd, Pt, polymer and ceramic.

Abstract translation: 通过具有涂覆有低熔点金属的微米直径范围颗粒的随机尺寸来提供具有更广泛可选范围性质的导电粘合剂。 将涂覆的颗粒悬浮在热固性树脂的混合物与选择粘度和低收缩率的助焊剂树脂的车辆中，用于丝网印刷性，在宽范围的规格条件下用于电气和机械性能。 车辆或树脂系统包括热固性环脂族环氧树脂，热固性苯氧基聚合物和热固性单官能柠檬烯氧化物。 用于颗粒的低温熔融涂层系统包括In，Sn，以及In-Sn，Sn-Pb，Bi-Sn-In和InAg等合金。 微米直径范围的颗粒包括Cu，Ni，Co，Ag，Pd，Pt，聚合物和陶瓷。

公开(公告)号：US20080048009A1

公开(公告)日：2008-02-28

申请号：US10585729

申请日：2005-10-27

Applicant: Tadashi Maeda ,  Tadahiko Sakai

Inventor： Tadashi Maeda ,  Tadahiko Sakai

IPC: B23K1/20 ,  B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract translation: 当通过焊接安装电子部件时，它提供设置在凸块和电路电极之间的金属粉末含量的金属，金属粉末包括由诸如锡和锌的金属形成的芯金属和由贵金属形成的芯金属的表面金属覆盖表面 金属如金和银。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。

公开(公告)号：US20070212562A1

公开(公告)日：2007-09-13

申请号：US11709242

申请日：2007-02-22

Applicant: In-Keun Shim ,  Young-Soo Oh ,  Jae-Woo Joung

Inventor： In-Keun Shim ,  Young-Soo Oh ,  Jae-Woo Joung

IPC: B22F9/24

CPC classification number: H05K1/097 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K2201/0218 ,  Y10T428/12028 ,  B22F2207/15

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Abstract translation: 本发明提供金属纳米粒子，其包含铜芯和包覆芯的薄层贵金属以防止铜的氧化，其中由于铜含量增加，制造金属纳米粒子是经济的，并且由于这种金属纳米颗粒含有具有高电的金属 电导率如银用于薄层，它们可以形成具有比铜更好的导电性的布线，并且很少有人担心可能发生银迁移。

公开(公告)号：US07169327B2

公开(公告)日：2007-01-30

申请号：US10240266

申请日：2002-01-24

Applicant: Nobuyuki Ito ,  Hideaki Masuko ,  Satomi Hasegawa ,  Nakaatsu Yoshimura

Inventor： Nobuyuki Ito ,  Hideaki Masuko ,  Satomi Hasegawa ,  Nakaatsu Yoshimura

IPC: H01B1/22 ,  B32B33/00

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 μm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 μm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 根据本发明的电介质形成组合物的特征在于：电介质复合颗粒，其中介电常数为30或更大的无机颗粒的部分或全部表面涂覆有导电金属或其化合物，或导电 有机化合物或导电无机材料; 和（B）由聚合性化合物和聚合物中的至少一种构成的树脂成分。 此外，根据本发明的另一种电介质形成组合物的特征在于包含：由（J）平均粒径为0.1μm以下的（J）无机超微粒子构成的超微粒子 - 树脂复合粒子，（B）构成的树脂成分 的可聚合化合物和聚合物中的至少一种，其中无机超细颗粒（J）的一部分或全部表面涂覆有树脂组分（B），超细颗粒 - 树脂复合颗粒含有20重量％ 或更多的无机超细颗粒（J）; 和平均粒径为0.1〜2μm，介电常数为30以上的无机粒子，或其中导电性金属或其化合物或导电性有机化合物或导电性无机材料沉积在该部分上的无机复合粒子，或 无机颗粒的所有表面。