公开(公告)号：JP2012526434A

公开(公告)日：2012-10-25

申请号：JP2012508979

申请日：2010-04-22

Applicant: ユナイテッド モノリシック セミコンダクターズ エス.アー.

Inventor： アロム、ピエール−フランク ,  トゥセン、クロード

IPC: H01P5/08 ,  H01P5/107

CPC classification number: H01P5/028 ,  H01L23/047 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/09072 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/0401

Abstract: 本発明は、
− ４５ＧＨｚよりもはるかに高い周波数Ｆ０で動作可能な表面装着のための個別パッケージ（２２２）内にカプセル化されたＭＭＩＣマイクロ波チップ（１００）と、
− 電磁結合により、動作周波数Ｆ０で結合信号の送信を保証する少なくとも１つの非接触型マイクロ波ポート（１２４）とを含むマイクロ波小型部品に関する。
本部品は、金属化層および誘電材料の層（１４０、１４２、１４４）を有する受動型多層集積回路（２２０）、上面（２２４）、金属化底面（２２５）を含み、当該金属化底面が、非接触型マイクロ波ポート（１２４）の側に、非接触型マイクロ波ポートによる結合電磁波を通過させる金属化部分における開口部（２３６）、および２層の誘電材料の間に、チップ（１００）の電子素子に接続された少なくとも１つの電磁結合導体（１４８）を有する金属化層（１４６）を含み、前記結合導体（１４８）が、動作周波数Ｆ０での電磁結合によりマイクロ波信号の送信を保証すべく当該非接触型マイクロ波ポート（１２４）のレベルに設置されている。

用途：自動車レーダー、高ビットレート通信図面：５ｂ

公开(公告)号：US10056672B2

公开(公告)日：2018-08-21

申请号：US15222230

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/02 ,  H01P3/12 ,  H01P3/08 ,  H01P5/08 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01P3/16 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US09706643B2

公开(公告)日：2017-07-11

申请号：US14727892

申请日：2015-06-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomoko Iwama

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L2224/33 ,  H01L2924/181 ,  H05K1/187 ,  H05K1/188 ,  H05K3/0014 ,  H05K3/4614 ,  H05K2201/0133 ,  H05K2201/0338 ,  H05K2201/037 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09736 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49131 ,  H01L2924/00012

Abstract: An electronic device according to the present disclosure includes a component, an electrode placed on the component, a conductor which includes a first conductor section, including an electrode contact surface in contact with the electrode, and two second conductor sections, electrically connected to two respective facing edges of the first conductor section to extend in respective directions away from the electrode and including respective inclined surfaces inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode, an insulator which is in contact with the two second conductor sections from sides opposite to the central axis and encloses the conductor and the electrode, and a case housing the component, the electrode, the conductor, and the insulator. A space without the insulator is defined between the two second conductor sections.

公开(公告)号：US09531052B2

公开(公告)日：2016-12-27

申请号：US14750033

申请日：2015-06-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/08 ,  H01P3/16 ,  H01P3/08

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract translation: 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线耦合到集成波导到波导转换。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。

公开(公告)号：US20160276729A1

公开(公告)日：2016-09-22

申请号：US14750033

申请日：2015-06-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P3/08 ,  H01P5/08 ,  H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US09405064B2

公开(公告)日：2016-08-02

申请号：US13439557

申请日：2012-04-04

Applicant: Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

Inventor： Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

IPC: G02B6/12 ,  H05K1/02 ,  G02B6/122 ,  H01P3/12

CPC classification number: H05K1/0239 ,  G02B6/12004 ,  G02B6/1228 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/16 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0274 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2201/10098

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract translation: 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。

公开(公告)号：US09331370B1

公开(公告)日：2016-05-03

申请号：US13829883

申请日：2013-03-14

Applicant: Altera Corporation

Inventor： Xiaohong Jiang

IPC: H01P1/00 ,  H01P3/08 ,  H01P11/00

CPC classification number: H01P1/005 ,  H01P3/026 ,  H01P3/081 ,  H01P3/082 ,  H01P3/085 ,  H01P11/006 ,  H05K1/024 ,  H05K1/0253 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/167

Abstract: Integrated circuit packages with stripline structures are provided. An integrated circuit package substrate may include a core layer having top and bottom surfaces and dielectric layers formed on the top and bottom surfaces of the core layer. Stripline structures may be formed in at least some of the dielectric layers. A stripline trace may include signal routing conductors sandwiched between top and bottom ground planes. In particular, a dielectric layer may be formed between the signal conductors and the bottom ground plane to support the signal conductors, whereas a localized air region may be formed over the signal routing conductors separating the signal conductors from the top ground plane. If desired, the region above the signal routing conductors between the top ground plane and the signal routing conductors may be filled using other types of material having low loss and/or a dielectric constant that is frequency independent.

Abstract translation: 提供具有带状线结构的集成电路封装。 集成电路封装基板可以包括具有形成在芯层的顶表面和底表面上的顶表面和底表面以及介电层的芯层。 线状结构可以形成在至少一些介电层中。 带状线迹可能包括夹在顶部和底部接地平面之间的信号路由导体。 特别地，可以在信号导体和底部接地平面之间形成电介质层以支撑信号导体，而可以在信号路由导体上形成局部空气区域，从而将信号导体与顶部接地平面分开。 如果需要，可以使用具有低损耗和/或频率无关的介电常数的其他类型的材料来填充顶部接地平面和信号布线导体之间的信号路由导体上方的区域。

公开(公告)号：US20150373851A1

公开(公告)日：2015-12-24

申请号：US14727892

申请日：2015-06-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TOMOKO IWAMA

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01L2224/33 ,  H01L2924/181 ,  H05K1/187 ,  H05K1/188 ,  H05K3/0014 ,  H05K3/4614 ,  H05K2201/0133 ,  H05K2201/0338 ,  H05K2201/037 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09736 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49131 ,  H01L2924/00012

Abstract: An electronic device according to the present disclosure includes a component, an electrode placed on the component, a conductor which includes a first conductor section, including an electrode contact surface in contact with the electrode, and two second conductor sections, electrically connected to two respective facing edges of the first conductor section to extend in respective directions away from the electrode and including respective inclined surfaces inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode, an insulator which is in contact with the two second conductor sections from sides opposite to the central axis and encloses the conductor and the electrode, and a case housing the component, the electrode, the conductor, and the insulator. A space without the insulator is defined between the two second conductor sections.

Abstract translation: 根据本公开的电子设备包括部件，放置在部件上的电极，导体，其包括第一导体部分，第一导体部分包括与电极接触的电极接触表面，以及两个第二导体部分，电连接到两个相应的 所述第一导体部分的相对边缘沿着相对于所述电极的各个方向延伸，并且包括相对于所述倾斜表面倾斜的倾斜表面，所述倾斜表面朝着穿过所述电极的中心并垂直于所述电极的中心的中心轴线倾斜， 其中两个第二导体部分从与中心轴线相反的一侧包围导体和电极，以及容纳该部件，电极，导体和绝缘体的壳体。 在两个第二导体部分之间限定没有绝缘体的空间。

公开(公告)号：US20150318597A1

公开(公告)日：2015-11-05

申请号：US14699465

申请日：2015-04-29

Applicant: MANDO CORPORATION

Inventor： Jong Gyu PARK ,  Han Yeol YU

IPC: H01P5/107 ,  H01P11/00 ,  H01P1/04

CPC classification number: H01P3/121 ,  H01P3/08 ,  H01P5/028 ,  H01P11/002 ,  H01P11/003 ,  H01Q1/38 ,  H05K1/0242 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2203/041 ,  Y10T29/49018

Abstract: The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.

Abstract translation: 本发明涉及可用于无线信号发送/接收装置等的多层基板，通孔和第一波导和第二波导，该导电膜包围通孔的内表面 分别形成在多层基板的上基板和下基板上，并且可以通过两个波导在上表面和下表面之间传输RF信号。 使用通过表面贴装技术（SMT）制造多层基板的工艺，使得能够精确且容易地形成通过多层基板的波导管。

公开(公告)号：US20130265734A1

公开(公告)日：2013-10-10

申请号：US13439646

申请日：2012-04-04

Applicant: Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

Inventor： Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

IPC: H05K1/14 ,  H05K1/11

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/43 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/122 ,  H01P5/107 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0274 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2201/10098

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract translation: 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。