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    Electronic packages having multiple-zone interconnects and methods of manufacture
    141.
    发明授权
    Electronic packages having multiple-zone interconnects and methods of manufacture 有权
    具有多区域互连的电子封装和制造方法

    公开(公告)号：US06717066B2

    公开(公告)日：2004-04-06

    申请号：US10004002

    申请日：2001-11-30

    Applicant: Gilroy J. Vandentop ,  Yuan-Liang Li

    Inventor： Gilroy J. Vandentop ,  Yuan-Liang Li

    IPC: H01L2348

    CPC classification number: H01L24/73 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2924/00

    Abstract: To accommodate thermal stresses arising from different coefficients of thermal expansion (CTE) of a packaged or unpackaged die and a substrate, the package incorporates two or more different interconnect zones. A first interconnect zone, located in a central region of the die, employs a relatively stiff interconnect structure. A second interconnect zone, located near the periphery of the die, employs a relatively compliant interconnect structure. Additional interconnect zones, situated between the first and second interconnect zones and having interconnect structure with compliance qualities intermediate those of the first and second zones, can optionally be employed. In one embodiment, solder connections providing low electrical resistance are used in the first interconnect zone, and compliant connections, such as nanosprings, are used in the second interconnect zone. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system are also described.

    Abstract translation: 为了适应由封装的或未封装的裸片和衬底的不同热膨胀系数（CTE）产生的热应力，封装包含两个或多个不同的互连区域。 位于模具的中心区域中的第一互连区域采用相对较硬的互连结构。 位于模具周边附近的第二互连区采用相对顺应的互连结构。 位于第一和第二互连区之间并具有与第一和第二区之间的顺应性质量的互连结构的附加互连区可以任选地被采用。 在一个实施例中，在第一互连区域中使用提供低电阻的焊接连接，并且在第二互连区域中使用诸如纳米脉冲的顺应连接。 还描述了制造方法以及将包装应用于电子组件，电子系统和数据处理系统。

    Light emitting diode with integrated heat dissipater
    142.
    发明申请
    Light emitting diode with integrated heat dissipater 审中-公开
    带集成散热器的发光二极管

    公开(公告)号：US20040052077A1

    公开(公告)日：2004-03-18

    申请号：US10641759

    申请日：2003-08-14

    Inventor： Kelvin Shih

    IPC: F21V029/00

    CPC classification number: H01L33/647 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10659 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A light emitting diode (LED)has an integrated heat sink structure for removing heat from an LED junction and for dissipating heat from the junction to the ambient air. The anode and the cathode both either act as or are coupled to a thermally conductive material which acts as the heat sink. In one embodiment, the heat sink forms a mounting configuration that allows air to circulate around multiple surfaces to maximize heat dissipation. As a result, the LED junction temperature remains low, allowing the LED to by driven with higher currents and generate a higher light output without adverse temperature-related effects.

    Abstract translation: 发光二极管（LED）具有集成的散热器结构，用于从LED结点移除热量，并将热量从结到散热到环境空气。 阳极和阴极既可以作为或耦合到用作散热器的导热材料。 在一个实施例中，散热器形成允许空气围绕多个表面循环以最大化散热的安装构造。 结果，LED结温度保持较低，允许LED以更高的电流驱动，并产生更高的光输出，而不会产生不利的温度相关影响。

    Support member for mounting a microelectronic circuit package
    150.
    发明授权
    Support member for mounting a microelectronic circuit package 失效
    用于安装微电子电路封装的支撑构件

    公开(公告)号：US5923538A

    公开(公告)日：1999-07-13

    申请号：US646037

    申请日：1996-05-07

    Applicant: Emily Hawthorne

    Inventor： Emily Hawthorne

    IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H01R5/09 ,  H05K7/02

    CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

    Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

    Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

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