公开(公告)号：WO2014155326A2

公开(公告)日：2014-10-02

申请号：PCT/IB2014/060203

申请日：2014-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： PAGANI, Alberto

IPC: G01L25/00

CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

Abstract: The invention relates to an integrated electronic device (400; 400a; 500, 500'; 600, 600'; 700, 700') on a semiconductor material chip for detecting the pressure related to a force (F) applied in a predetermined direction (d) within a solid structure. The device comprises: - an integrated element (51) defined by an operating surface of the chip (52) that is substantially orthogonal to the direction (d) of application of the force; first (53) and second (54) conductive elements accommodated within the substrate element (51) and configured to face the operating surface; a measure module (55) accommodated within the substrate element and comprising first (56) and second (57) measurement terminals which are electrically connected to the first (53) and second (54) conductive elements, respectively; a detecting element (58) arranged in the predetermined direction (d) such that the operating surface (52) is sandwiched between the first (53) and second (54) conductive elements and this detecting element ( 58 ); - an insulating layer (59) suitable to coat at least the operating surface in order to galvanically insulate the first (53) and second (54) conductive elements. The device comprises a layer of dielectric material (510, 510') which is at least sandwiched between the detecting element (58) and the insulating layer (59). The layer of dielectric material is elastically deformable following the application of the force (F) in the predetermined direction to change an electromagnetic coupling between the detecting element (58) and the above-mentioned first (53) and second (54) conductive elements.

Abstract translation: 本发明涉及一种半导体材料芯片上的集成电子设备（400; 400a; 500,500'; 600,600'; 700,700'），用于检测与沿预定方向施加的力（F）相关的压力 d）在固体结构内。 该装置包括：由芯片（52）的操作表面限定的与施加力的方向（d）基本正交的集成元件（51）; 第一（53）和第二（54）导电元件，其容纳在所述衬底元件（51）内并被配置为面对所述操作表面; 测量模块（55），其容纳在所述衬底元件内并且包括分别电连接到所述第一（53）和第二（54）导电元件的第一测量端子（56）和第二测量端子（57） 沿预定方向（d）布置的检测元件（58），使得操作表面（52）夹在第一（53）和第二（54）导电元件和该检测元件（58）之间; - 绝缘层（59），其适于至少涂覆所述操作表面以使所述第一（53）和第二（54）导电元件电绝缘。 该装置包括至少夹在检测元件（58）和绝缘层（59）之间的电介质材料层（510,510'）。 介电材料层可以沿预定方向施加力（F）而弹性变形，以改变检测元件（58）和上述第一（53）和第二（54）导电元件之间的电磁耦合。

公开(公告)号：WO2014009490A1

公开(公告)日：2014-01-16

申请号：PCT/EP2013/064729

申请日：2013-07-11

Applicant: RAI RADIOTELEVISIONE ITALIANA S.P.A. ,  STMICROELECTRONICS S.R.L.

Inventor： PAU, Danilo ,  MESSINA, Alberto

IPC: G06K9/00 ,  G06K9/46

CPC classification number: G06K9/00744 ,  G06K9/4671

Abstract: The present invention provides for a method for extraction of descriptors from video content, comprising the following steps: a Key Frame Extracting step, applying a local descriptors-based approach to select pictures of the incoming video as key frames that are representative of a temporal region of the video which is visually homogeneous; a Content Analysis step, analysing the content of said key frames and classifying image patches of said key frames as interesting or not for said extraction of descriptors; a Descriptors Extracting step, extracting compact descriptors from said selected key frames, and defining a set of surrounding images also on the basis of input received from said Content Analysis step; a Temporal Coding step, multiplexing information about the time points at which said key frames have been extracted in said Key Frame Extracting step with said compact descriptors extracted in said Descriptors Extracting step, obtaining said descriptors.

Abstract translation: 本发明提供一种用于从视频内容中提取描述符的方法，包括以下步骤：关键帧提取步骤，应用基于局部描述符的方法来选择输入视频的图像作为表示时间区域的关键帧 视频均匀的视频; 内容分析步骤，对所述关键帧的内容进行分析，并且对所述关键帧的图像片段进行分类，对于描述符的提取是有趣的; 描述符提取步骤，从所述选择的关键帧中提取紧凑描述符，并且还基于从所述内容分析步骤接收的输入来定义一组周围图像; 时间编码步骤，在所述关键帧提取步骤中，利用在所述描述符提取步骤中提取的所述紧凑描述符，复用关于所述关键帧已被提取的时间点的信息，获得所述描述符。

公开(公告)号：WO2013178529A2

公开(公告)日：2013-12-05

申请号：PCT/EP2013/060635

申请日：2013-05-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： PAGANI, Alberto

IPC: H01Q1/22 ,  H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H04B5/00 ,  H02J5/00 ,  G06K19/077

CPC classification number: H04B5/0075 ,  A61B5/6804 ,  A61B2562/164 ,  H01F38/14 ,  H01L23/5387 ,  H01L23/645 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3025 ,  H01Q1/2225 ,  H01Q1/273 ,  H01Q1/526 ,  H01Q7/00 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  H02J50/70 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0081 ,  H01L2924/00

Abstract: The network (100) of electronic devices is formed on a flexible substrate (15; 101) by a plurality of electronic devices (1; 104) assembled on the flexible substrate. The electronic devices have an embedded antenna for mutual coupling (4; 111) of a wireless type. Each electronic device (1; 104) is formed by a chip or a complex system integrating a transceiver circuit (3) connected to the embedded antenna (4; 11) and a functional part (12; 112) connected to the transceiver circuit and including at least one element chosen in the group comprising: a sensor, an actuator, an interface, an electrode, a memory, a control unit, a power-supply unit, a converter, an adapter, a digital circuit, an analog circuit, an RF circuit, a microelectromechanical system, an electrode, a well, a cell, a container for liquids. The flexible support may be a substrate (15) of plastic material that incorporates the electronic devices or a garment having smart buttons that house the electronic devices.

Abstract translation: 电子设备的网络（100）通过组装在柔性基板上的多个电子设备（1; 104）形成在柔性基板（15; 101）上。 电子设备具有用于无线类型的互连（4; 111）的嵌入式天线。 每个电子设备（1; 104）由集成连接到嵌入式天线（4; 11）的收发器电路（3）和连接到收发器电路的功能部件（12; 112）的芯片或复合系统形成，并且包括 在组中选择的至少一个元件包括：传感器，致动器，接口，电极，存储器，控制单元，电源单元，转换器，适配器，数字电路，模拟电路， RF电路，微机电系统，电极，阱，电池，液体容器。 柔性支撑件可以是包含电子装置的塑料材料的基底（15）或具有容纳电子装置的智能按钮的衣服。

公开(公告)号：WO2013156539A1

公开(公告)日：2013-10-24

申请号：PCT/EP2013/058029

申请日：2013-04-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： CONTI, Sebastiano ,  MAGGI, Luca

IPC: H04R1/04 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R1/04 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014

Abstract: In an assembly of a semiconductor integrated device (30), a package (32) has a base element (33) and a covering element (34) defining an internal space (35), an access opening (36) is provided through the covering element (34) for access to the internal space (35) from outside, and a MEMS acoustic transducer (20) is housed within the package (32) and includes a die (21) integrating a microelectromechanical sensing structure (1), defining a membrane (2) suspended over a cavity (6) and facing a rigid plate (3). The MEMS acoustic transducer (20) is set so that the die (21) is directly set between the access opening (36) and the internal space (35), defining an uninterrupted fluidic path including the access opening (36), the cavity (6), and the internal space (35). The semiconductor integrated device (30) includes a further MEMS sensor (44), with a die (45) integrating a respective microelectromechanical sensing structure (46) having a sensing element (64) set in fluid communication with the outside through the same fluidic path.

Abstract translation: 在半导体集成装置（30）的组件中，封装（32）具有基部元件（33）和限定内部空间（35）的覆盖元件（34），通过覆盖物 元件（34），用于从外部进入内部空间（35），以及MEMS声学换能器（20）容纳在所述封装（32）内，并且包括集成微机电感测结构（1）的模具（21） 膜（2）悬挂在空腔（6）上并面向刚性板（3）。 MEMS声学换能器（20）被设置成使得模具（21）直接设置在进入开口（36）和内部空间（35）之间，限定了包括进入开口（36），空腔（36）的不间断流体路径 6）和内部空间（35）。 半导体集成器件（30）包括另外的MEMS传感器（44），其具有集成各自的微机电感测结构（46）的管芯（45），所述微机电感测结构（46）具有通过相同的流体路径与外部流体连通的传感元件（64） 。

公开(公告)号：WO2013076530A1

公开(公告)日：2013-05-30

申请号：PCT/IB2011/055259

申请日：2011-11-23

Applicant: FREESCALE SEMICONDUCTOR, INC. ,  STMICROELECTRONICS S.R.L. ,  CULSHAW, Carl ,  LUEDEKE, Thomas ,  GROSSIER, Nicolas

Inventor： CULSHAW, Carl ,  LUEDEKE, Thomas ,  GROSSIER, Nicolas

IPC: G06F1/00

CPC classification number: G06F9/442 ,  G06F1/24 ,  G06F9/44505 ,  G06F11/0721 ,  G06F11/076

Abstract: A microprocessor device comprises at least one reset management module. The at least one reset management module is arranged to detect a reset event comprising a first reset level, determine if at least one reset condition has been met upon detection of the reset event comprising the first reset level, and cause a reset of a second reset level upon determining that the at least one reset condition has been met.

Abstract translation: 微处理器设备包括至少一个复位管理模块。 所述至少一个复位管理模块被布置成检测包括第一复位电平的复位事件，确定在检测到包括第一复位电平的复位事件时是否满足了至少一个复位条件，并且引起第二复位的复位 确定已经满足至少一个复位条件。

公开(公告)号：WO2013061313A1

公开(公告)日：2013-05-02

申请号：PCT/IB2012/055982

申请日：2012-10-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： LOSA, Stefano ,  PEZZUTO, Raffaella ,  CAMPEDELLI, Roberto ,  AZPEITIA URQUIA, Mikel ,  PERLETTI, Matteo ,  ESPOSITO, Luigi

IPC: B81C1/00

CPC classification number: H01L21/02178 ,  B81B7/0032 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00595 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2201/053 ,  H01L21/0228

Abstract: A method for manufacturing a protective layer (25) for protecting an intermediate structural layer (22) against etching with hydrofluoric acid (HP), the intermediate structural layer (22) being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminium oxide, by atomic layer deposition, on the intermediate structural layer (22); performing a thermal crystallization process on the first layer of aluminium oxide, forming a first intermediate protective layer (25a),- forming a second layer of aluminium oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallisation process on the second layer of aluminium oxide, forming a second intermediate protective layer (25b) and thereby completing the formation of the protective layer (25). The method for forming the protective layer (25) can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.

Abstract translation: 一种用于制造用于保护中间结构层（22）以防止用氢氟酸（HP）蚀刻的保护层（25）的方法，所述中间结构层（22）由可被氢氟酸蚀刻或损坏的材料制成， 该方法包括以下步骤：通过原子层沉积在中间结构层（22）上形成第一氧化铝层; 在第一氧化铝层上进行热结晶处理，形成第一中间保护层（25a）， - 通过原子层沉积形成第二层氧化铝，在第一中间保护层上方; 以及对所述第二氧化铝层进行热结晶处理，形成第二中间保护层（25b），从而完成所述保护层（25）的形成。 形成保护层（25）的方法可以用于例如陀螺仪或加速度计等惯性传感器的制造步骤。

公开(公告)号：WO2012090188A1

公开(公告)日：2012-07-05

申请号：PCT/IB2011/056033

申请日：2011-12-30

Applicant: STMICROELECTRONICS S.R.L. ,  PAGANI, Alberto

Inventor： PAGANI, Alberto

IPC: A61F9/08

CPC classification number: A61F2/14 ,  A61F2/148 ,  A61F9/08 ,  A61F2250/0002 ,  A61N1/0543 ,  A61N1/36 ,  A61N1/36046

Abstract: A retinal prosthesis including an electronic stimulation unit (40) housed inside an eye and including: a plurality of electrodes (62); an electronic control circuit (92, 102), which is electrically connected to the electrodes and supplies to the electrodes electrical stimulation signals designed to stimulate a portion of a retina of the eye; and a local antenna (114) connected to the electronic control circuit. The retinal prosthesis further includes an electromagnetic expansion (35) housed inside the eye and formed by a first expansion antenna (44) and a second expansion antenna (46) electrically connected together, the first expansion antenna being magnetically or electromagnetically coupled to an external antenna (38), the second expansion antenna being magnetically or electromagnetically coupled to the local antenna, the electromagnetic expansion moreover receiving an electromagnetic supply signal transmitted by the external antenna and generating a corresponding replica signal.

Abstract translation: 一种视网膜假体，包括容纳在眼睛内的电子刺激单元（40），包括：多个电极（62）; 电子控制电路（92,102），其电连接到电极并向电极提供设计成刺激眼睛的视网膜的一部分的电刺激信号; 以及连接到电子控制电路的本地天线（114）。 视网膜假体还包括容纳在眼睛内并由电连接在一起的第一扩展天线（44）和第二扩展天线（46）形成的电磁膨胀（35），第一扩展天线被磁性或电磁耦合到外部天线 （38），所述第二扩展天线与所述本地天线进行磁或电磁耦合，所述电磁膨胀还接收由所述外部天线发送的电磁供给信号并产生对应的复制信号。

公开(公告)号：WO2012084845A1

公开(公告)日：2012-06-28

申请号：PCT/EP2011/073270

申请日：2011-12-19

Applicant: STMICROELECTRONICS S.R.L. ,  STROPPA, Alberto ,  SPINI, Claudio ,  ADRAGNA, Claudio

Inventor： STROPPA, Alberto ,  SPINI, Claudio ,  ADRAGNA, Claudio

IPC: H02M3/337

CPC classification number: H02M3/33507 ,  H02M3/3376 ,  H02M2001/0032 ,  Y02B70/16

Abstract: A control device for a switching mode DC-DC converter, the converter comprising at least a half-bridge with at least first (Q1) and second (Q2) switches connected between an input voltage (Vin) and a reference voltage. The converter further comprises a transformer (20) with a primary coupled with the center point (HB) of the half -bridge and a secondary (22) coupled with a load (Load). The control device comprises an error detector (2) configured to determine an error signal (Se) between a first signal (Vout1) representative of the voltage (Vout) across the load and a first reference signal (Vref2) and a frequency controller (100) configured to increase the switching frequency of the half -bridge when the error signal (Se) is kept below a second signal (Vrefl).

Abstract translation: 一种用于开关模式DC-DC转换器的控制装置，所述转换器至少包括连接在输入电压（Vin）和参考电压之间的至少第一（Q1）和第二（Q2）开关的半桥。 该转换器还包括具有与半桥的中心点（HB）初级耦合的变压器（20）和与负载（负载）耦合的次级（22）。 控制装置包括误差检测器（2），其被配置为确定表示负载之间的电压（Vout）的第一信号（Vout1）与第一参考信号（Vref2）和频率控制器（100）之间的误差信号（Se） ）被配置为当误差信号（Se）保持低于第二信号（Vrefl）时增加半桥的开关频率。

公开(公告)号：WO2012084295A1

公开(公告)日：2012-06-28

申请号：PCT/EP2011/068359

申请日：2011-10-20

Applicant: STMICROELECTRONICS S.R.L. ,  PAGANI, Alberto ,  MURARI, Bruno

Inventor： PAGANI, Alberto ,  MURARI, Bruno

IPC: G01N27/20 ,  G01N33/38 ,  G01L1/18

CPC classification number: G01N27/00 ,  G01L1/26 ,  G01M5/0083

Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

Abstract translation: 用于检测和监测固体结构（300）内的局部参数的装置（100）。 该装置包括在单个芯片上制成的集成检测模块（1），其具有包括至少一个集成传感器（10）和集成天线（11）的集成功能电路部分（16），以及电磁装置（2） /接收信号和能量交换。 集成功能电路部分（16）包括面向芯片外部的功能表面（18）。 钝化层（15）布置成完全覆盖至少功能表面（18），使得集成检测模块（1）完全被气密密封并与周围环境电隔离。 集成天线（11），电磁装置（2）和远程天线（221）通过磁或电磁耦合无线地可操作地连接。

公开(公告)号：WO2012084207A1

公开(公告)日：2012-06-28

申请号：PCT/EP2011/006449

申请日：2011-12-20

Applicant: STMICROELECTRONICS S.R.L. ,  PAGANI, Alberto

Inventor： PAGANI, Alberto

IPC: H01L23/522

CPC classification number: H01L28/90 ,  H01L23/5223 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention in a single structure combines a pad comprising a connection terminal suitable for connecting the circuit elements integrated in a chip to circuits outside of the chip itself and at least one condenser. By combining a connection pad and a condenser in a single structure it is possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the condenser itself. In this way, the costs and size of the chip can be reduced.

Abstract translation: 本发明的单一结构组合了包括适于将集成在芯片中的电路元件连接到芯片本身外部的电路的连接端子和至少一个冷凝器的焊盘。 通过在单一结构中组合连接焊盘和冷凝器，可以减少芯片的总面积，否则由于冷凝器本身的存在，否则常见的集成电路将会更大。 以这种方式，可以降低芯片的成本和尺寸。