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公开(公告)号：KR1020140040025A
公开(公告)日：2014-04-02
申请号：KR1020130112410
申请日：2013-09-23
Applicant: 로베르트 보쉬 게엠베하
CPC classification number: H01L29/84 , B81B2201/025 , B81C1/00182 , G01P15/124 , H01L29/66477
Abstract: The present invention relates to a microelectronic device and a method of manufacturing the microelectronic device. The microelectronic device includes: semiconductor substrates (1; 1a), each of the semiconductor substrates having a top surface (O) and a rear surface (R); a mass unit (M) being elastically displaced on the top surface (O) of the substrate (1); at least one source area (10; 10′) disposed in or on the mass unit (M); at least one drain area (D1-D4; D1′-D10′) disposed in or on the mass unit (M); and a gate area (20; 20′) disposed above the source area (10: 10′) and the drain area (D1-D4; D1′-D10′), the gate area (20; 20′) being suspended by a conductor track assembly (LBA) and being spaced apart from the mass unit (M) through a gap (100). The conductor track assembly (LBA) is fixed to the top surface (O) of the substrate (1) in a periphery (P) of the mass unit (M) so that the gate area (20; 20′) is fixed and maintained when the mass unit (M) is displaced.
Abstract translation: 本发明涉及一种微电子器件及其制造方法。 微电子器件包括：半导体衬底（1; 1a），每个半导体衬底具有顶表面（O）和后表面（R）; 质量单元（M）在基板（1）的顶表面（O）上弹性位移; 设置在质量单元（M）中或上的至少一个源区域（10; 10'）; 设置在质量单元（M）中或其上的至少一个漏极区域（D1-D4; D1'-D10'）; 以及设置在源极区域（10：10'）和漏极区域（D1-D4; D1'-D10'）上方的栅极区域（20; 20'），栅极区域（20; 20'）被 导体轨道组件（LBA），并且通过间隙（100）与质量单元（M）间隔开。 导体轨道组件（LBA）在质量单元（M）的周边（P）中固定到衬底（1）的顶表面（O），使得门区域（20,20'）被固定和维持 当质量单元（M）被移位时。
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公开(公告)号：KR1020000050473A
公开(公告)日：2000-08-05
申请号：KR1019990000387
申请日：1999-01-11
Applicant: 삼성전자주식회사
IPC: G01P15/08
CPC classification number: H02N1/008 , B81B3/0094 , B81B2201/025 , B81B2203/0136 , G01C19/5755 , G01P15/097 , G01P15/125 , G01P2015/0814
Abstract: PURPOSE: A three-dimensional comb structure is provided to increase an electrostatic force through the increase of the number of combs per a unit area by manufacturing combs in vertical directions on a suspension structure and a substrate. CONSTITUTION: A suspension structure(42) is floated while maintaining a certain gap with a substrate to sense inertia movements and to be oscillated on the substrate. At least one or more elastic members(44) are connected to the suspension structure(42) in order to enable the suspension structure(42) to be oscillated. At least one or more supporters(45) are connected to the substrate to support the elastic members(44). A moving comb structure(43) is connected to the suspending structure(42) and has at least one comb formed to be protruded.
Abstract translation: 目的：提供一种三维梳状结构，通过在悬挂结构和基底上垂直方向制造梳子，通过增加每单位面积的梳子数来增加静电力。 构成：悬挂结构（42）浮动，同时与衬底保持一定的间隙以感测惯性运动并且在衬底上振荡。 至少一个或多个弹性构件（44）连接到悬架结构（42），以使得悬挂结构（42）能够摆动。 至少一个或多个支撑件（45）连接到基板以支撑弹性构件（44）。 移动梳结构（43）连接到悬挂结构（42）上并具有形成为突出的至少一个梳子。
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公开(公告)号：KR1020170080402A
公开(公告)日：2017-07-10
申请号：KR1020160041136
申请日：2016-04-04
Applicant: 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
CPC classification number: B81B1/004 , B81B2201/025 , B81B2201/0264 , B81C1/00087 , B81C1/00309 , B81C2201/019 , G01L9/00
Abstract: MEMS(micro-electro mechanical system) 압력센서는, 제1 기판, 제2 기판및 감지구조체를포함한다. 제2 기판은제1 기판과실질적으로평행하다. 감지구조체는제1 기판과제2 기판사이에있고, 상기제 기판의일부와상기제2 기판의일부에접합되며, 여기서제1 기판과감지구조체사이의제1 공간은외부와소통되며, 제2 기판과감지구조체사이의제2 공간은외부와소통되거나또는외부로부터격리된다.
Abstract translation: 微机电系统（MEMS）压力传感器包括第一基板，第二基板和感测结构。 第二衬底基本平行于第一衬底。 感测结构位于第一基板2与基板的一部分以及第二基板的一部分之间，其中第一基板与感测结构之间的第一空间与外界连通， 冲击结构之间的第二空间与外部连通或与外部隔离。
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公开(公告)号：KR1020140147185A
公开(公告)日：2014-12-30
申请号：KR1020130069622
申请日：2013-06-18
Applicant: 삼성전기주식회사
CPC classification number: B81B3/0021 , B81B2201/0235 , B81B2201/025 , B81B2203/0127 , B81C1/00158 , B81C2201/013 , G01P15/09 , G01P2015/084
Abstract: An MEMS component according to the present invention comprises: a membrane; a weight body connected to the membrane; and a support part which is connected to the membrane and supports the weight body in a floating state to be displaced. The membrane has an insulating adhesion layer in the center. An upper electrode and an upper piezoelectric body are arranged on one side of the membrane, and a lower electrode and a lower piezoelectric body are arranged on the other side of the membrane.
Abstract translation: 根据本发明的MEMS部件包括：膜; 连接到膜的重量体; 以及支撑部，其连接到所述膜并且将所述配重体以浮动状态支撑以被移位。 该膜在中心具有绝缘粘合层。 上电极和上压电体设置在膜的一侧，下电极和下压电体设置在膜的另一侧。
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公开(公告)号：KR1020140028126A
公开(公告)日：2014-03-07
申请号：KR1020147002257
申请日：2012-06-29
Applicant: 인벤센스, 인크.
Inventor： 시거,조셉 , 체르트코브,이고르 , 아키올,하산 , 야랄리오글루,고크센,쥐. , 나시리,스티븐,에스. , 구린,일리야
CPC classification number: B81B7/02 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81C1/00246 , B81C2203/0771 , G01L1/144 , G01L1/148 , G01L5/0028 , G01L9/0072 , G01L15/00 , G01L19/0092 , G01L19/0636 , G01L19/148 , G01L27/007 , H01L29/84 , G01F1/20 , G01L9/12
Abstract: 집적 전자장치를 갖는 MEMS 디바이스를 제공하기 위한 방법 및 시스템이 개시된다. MEMS 디바이스는 집적 회로 기판 및 집적 회로 기판에 연결된 MEMS 서브어셈블리를 포함한다. 집적 회로 기판은 적어도 하나의 고정 전극에 연결된 적어도 하나의 회로를 포함한다. MEMS 서브어셈블리는 리소그래피 공정에 의해 형성된 적어도 하나의 이격부, 상면과 하면을 구비하는 가요성 평판, 및 상기 가요성 평판에 연결되고 상기 적어도 하나의 이격부에 전기적으로 연결된 MEMS 전극을 포함한다. 상기 가요성 평판 상에서 작용하는 힘이 상기 MEMS 전극과 상기 적어도 하나의 고정 전극 사이의 간격의 변화를 야기한다.
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Patent Agency Ranking
公开(公告)号：KR1020120119167A
公开(公告)日：2012-10-30
申请号：KR1020110036962
申请日：2011-04-20
Applicant: 삼성전기주식회사
CPC classification number: G01C19/56 , B81B2201/025 , B81C1/00182 , B81C2201/0108 , B81C2201/0187 , G01P15/0802 , G01P15/09
Abstract: PURPOSE: An inertial sensor manufacturing method is provided to improve the density of a mass object by forming the mass object with metal through a plating process or a filling process. CONSTITUTION: A first mold(120) is placed on a side of a predetermined area in a plate-shaped membrane(110) to expose a border(111) and a central part(113) of a side of the predetermined area. A mass object(130) is formed on the central part of the side of the predetermined area exposed by the first mold through a plating process or a filling process. A post(140) is formed at the border of the side of the predetermined area. The first mold is removed.
Abstract translation: 目的：提供惯性传感器制造方法，通过电镀工艺或填充工艺，通过用金属形成质量物体来提高质量物体的密度。 构成：将第一模具（120）放置在板状膜（110）中的预定区域的一侧以暴露预定区域的一侧的边界（111）和中心部分（113）。 通过电镀处理或填充处理，在由第一模具露出的预定区域的侧面的中心部分上形成质量物体（130）。 在预定区域的边界的边界处形成柱（140）。 第一个模具被移除。
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公开(公告)号：KR101076665B1
公开(公告)日：2011-10-26
申请号：KR1020087012313
申请日：2006-11-24
Applicant: 파나소닉 전공 주식회사
CPC classification number: G01P15/0802 , B81B7/0051 , B81B7/0064 , B81B2201/025 , B81C2203/038 , G01C19/5719 , G01P1/023 , G01P15/125 , H01L2924/0002 , H01L2924/00
Abstract: 개구를가지는프레임, 프레임에대하여이동가능하게개구내에유지되는이동가능한부분, 및이동가능한부분의위치변위에따라전기신호를출력하는검출부를구비하는센서유닛과, 반도체재료로형성되고센서유닛의표면에접합되는패키지기판을포함한다. 패키지기판은, 센서유닛에대향하는표면에전기절연막을가지고, 전기절연막의활성화표면과센서유닛의활성화표면을상온에서직접접합함으로써, 패키지기판이센서유닛에접합된다.
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158.发明专利
公开(公告)号：JP5494861B2
公开(公告)日：2014-05-21
申请号：JP2013080452
申请日：2013-04-08
Applicant: 株式会社デンソー
IPC: G01P15/125 , B81B3/00 , B81C1/00 , G01P15/08 , H01L29/84
CPC classification number: H01L27/1203 , B81B2201/025 , B81B2201/0257 , B81B2201/0285 , B81B2201/047 , B81C1/00182 , G01C19/5755 , G01P15/0802 , G01P15/125 , G01P2015/0814 , H01L21/84
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公开(公告)号：JP2013011587A
公开(公告)日：2013-01-17
申请号：JP2012067706
申请日：2012-03-23
Applicant: Denso Corp , 株式会社デンソー
Inventor： FUJII TETSUO , GOTO KEISUKE , QING JIAN YI
CPC classification number: G01L9/0073 , B60C23/0488 , B81B7/02 , B81B2201/025 , B81B2207/015 , G01L9/0085 , G01L19/0092 , G01P1/023 , G01P15/08 , G01P15/125
Abstract: PROBLEM TO BE SOLVED: To provide a low-cost dynamic quantity sensor device and a method for manufacturing the same in which a pressure sensor and a high accuracy dynamic quantity sensor are optimally modularized in such a manner that the modularization does not decrease the performance of each dynamic quantity sensor.SOLUTION: In a dynamic quantity sensor device 100, a first dynamic quantity detection part M1 of a first dynamic quantity sensor R1 for detecting a pressure and a second dynamic quantity detection part M2 of a second dynamic quantity sensor R2 are displaceably formed on a first base 10, on which a second base plate 20 is stuck to form a first space K1 and a second space K2 that are not in communication with each other. The first substrate 10 consists of an SOI substrate. The first dynamic quantity detection part M1 and the second dynamic quantity detection part M2 are each arranged on part of a semiconductor region S consisting of an SOI layer 3. The second dynamic quantity detection part M2 measures a change in capacitance of two opposing surfaces in a second movable semiconductor region S2a and a second fixed semiconductor region S2b to detect a second dynamic quantity.
Abstract translation: 要解决的问题：为了提供一种低成本动态传感器装置及其制造方法，其中压力传感器和高精度动态传感器被最佳地模块化，使得模块化不会减小 每个动态量传感器的性能。 解决方案：在动态量传感器装置100中，用于检测压力的第一动态量传感器R1的第一动态量检测部分M1和第二动态量传感器R2的第二动态量检测部分M2可移位地形成在 第一基座10，第二基板20被卡在其上以形成不彼此连通的第一空间K1和第二空间K2。 第一衬底10由SOI衬底组成。 第一动态量检测部M1和第二动量检测部M2分别配置在由SOI层3构成的半导体区域S的一部分上。第二动态量检测部M2测量两个相对面的电容变化 第二可移动半导体区域S2a和第二固定半导体区域S2b，以检测第二动态量。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2012521898A
公开(公告)日：2012-09-20
申请号：JP2012502461
申请日：2009-03-31
Applicant: シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft
Inventor： シャイプナー ディアク , ディーネル マルコ , フォアケ ローマン
IPC: B81B3/00
CPC classification number: B81B3/0078 , B81B2201/025 , B81B2203/0118 , Y10T29/49007
Abstract: An exposed end o a micromechanical system having at least one beam-shaped element is connected to a further element of the micromechanical system at the other end thereof. To optimize the mechanical properties of the micromechanical system, recesses are provided in the beam-shaped element in such a way that the mass of the beam-shaped elements decreases toward the exposed end.
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